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    • 5. 发明申请
    • DOPING OF ZrO2 FOR DRAM APPLICATIONS
    • 用于DRAM应用的ZrO2的掺杂
    • US20130122722A1
    • 2013-05-16
    • US13808165
    • 2011-06-23
    • Julie CissellChongying XuThomas M. CameronWilliam HunksDavid W. Peters
    • Julie CissellChongying XuThomas M. CameronWilliam HunksDavid W. Peters
    • H01L49/02
    • H01L28/40C23C16/45525H01L21/02189H01L21/02194H01L21/0228
    • A method of forming a dielectric material, comprising doping a zirconium oxide material, using a dopant precursor selected from the group consisting of Ti(NMe2)4; Ti(NMeEt)4; Ti(NEt2)4; TiCl4; tBuN═Nb(NEt2)3; tBuN═Nb(NMe2)3; t-BuN═Nb(NEtMe)3; t-AmN═Nb(NEt2)3; t-AmN═Nb(NEtMe)3; t-AmN═Nb(NMe2)3; t-AmN═Nb(OBu-t)3; Nb-13; Nb(NEt2)4; Nb(NEt2)5; Nb(N(CH3)2)5; Nb(OC2H5)5; Nb(thd)(OPr-i)4; SiH(OMe)3; SiCU; Si(NMe2)4; (Me3Si)2NH; GeRax(ORb)4.x wherein x is from 0 to 4, each Ra is independently selected from H or C1-C8 alkyl and each Rb is independently selected from C1-C8 alkyl; GeCl4; Ge(NRa2)4 wherein each Ra is independently selected from H and C1-C8 alkyl; and (Rb3Ge)2NH wherein each Rb is independently selected from C1-C8 alkyl; bis(N,N′-diisopropyl-1,3-propanediamide) titanium; and tetrakis(isopropylmethylamido) titanium; wherein Me is methyl, Et is ethyl, Pr-i is isopropyl, t-Bu is tertiary butyl, t-Am is tertiary amyl, and thd is 2,2,6,6-tetramethyl-3,5-heptanedionate. Doped zirconium oxide materials of the present disclosure are usefully employed in ferroelectric capacitors and dynamic random access memory (DRAM) devices.
    • 一种形成电介质材料的方法,包括使用选自Ti(NMe 2)4的掺杂剂前体掺杂氧化锆材料; Ti(NMeEt)4; Ti(NEt2)4; TiCl4; tBuN = Nb(NEt2)3; tBuN = Nb(NMe2)3; t-BuN = Nb(NEtMe)3; t-AmN = Nb(NEt2)3; t-AmN = Nb(NEtMe)3; t-AmN = Nb(NMe2)3; t-AmN = Nb(OBu-t)3; Nb-13; Nb(NEt2)4; Nb(NEt2)5; Nb(N(CH 3)2)5; Nb(OC2H5)5; Nb(thd)(OPr-i)4; SiH(OMe)3; SiCU; Si(NMe2)4; (Me 3 Si)2 NH GeRax(ORb)4.x其中x为0至4,每个R a独立地选自H或C 1 -C 8烷基,并且每个R b独立地选自C 1 -C 8烷基; GeCl4; Ge(NRa 2)4,其中每个R a独立地选自H和C 1 -C 8烷基; 和(Rb 3 Ge)2 NH,其中每个R b独立地选自C 1 -C 8烷基; 双(N,N'-二异丙基-1,3-丙二酰胺)钛; 和四(异丙基甲基氨基)钛; 其中Me是甲基,Et是乙基,Pr-i是异丙基,t-Bu是叔丁基,t-Am是叔戊基,thd是2,2,6,6-四甲基-3,5-庚二酮酸。 本公开的掺杂氧化锆材料有用地用于铁电电容器和动态随机存取存储器(DRAM)器件中。
    • 6. 发明授权
    • Precursors for CVD/ALD of metal-containing films
    • 含金属膜CVD / ALD的前体
    • US08168811B2
    • 2012-05-01
    • US12507048
    • 2009-07-21
    • Thomas M. CameronChongying XuTianniu Chen
    • Thomas M. CameronChongying XuTianniu Chen
    • C07F9/00C07F15/00C07F5/06
    • C07C225/14C07F7/003
    • Precursors useful for vapor phase deposition processes, e.g., CVD/ALD, to form metal-containing films on substrates. The precursors include, in one class, a central metal atom M to which is coordinated at least one ligand of formula (I): wherein: R1, R2 and R3 are each independently H or ogano moieties; and G1 is an electron donor arm substituent that increases the coordination of the ligand to the central metal atom M; wherein when G1 is aminoalkyl, the substituents on the amino nitrogen are not alkyl, fluoroalkyl, cycloaliphatic, or aryl, and are not connected to form a ring structure containing carbon, oxygen or nitrogen atoms. Also disclosed are ketoester, malonate and other precursors adapted for forming metal-containing films on substrates, suitable for use in the manufacture of microelectronic device products such as semiconductor devices and flat panel displays.
    • 用于气相沉积工艺(例如CVD / ALD)以在基底上形成含金属膜的前体。 前体在一类中包括配位至少一种式(I)配位体的中心金属原子M:其中:R 1,R 2和R 3各自独立地为H或无规部分; 并且G1是增加配体与中心金属原子M的配位的电子给体臂取代基; 其中当G1是氨基烷基时,氨基氮上的取代基不是烷基,氟烷基,脂环族或芳基,并且不连接形成含有碳,氧或氮原子的环结构。 还公开了适用于在诸如半导体器件和平板显示器的微电子器件产品的制造中用于在基底上形成含金属膜的酮酯,丙二酸酯和其它前体。