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1. 发明授权

US08280204B2 Optical wiring board and manufacturing method thereof 失效
标题翻译：光接线板及其制造方法
公开(公告)号：US08280204B2
公开(公告)日：2012-10-02
申请号：US12760035
申请日：2010-04-14
申请人： Sang-Hoon Kim , Han-Seo Cho , Joon-Sung Kim , Jae-Hyun Jung
发明人： Sang-Hoon Kim , Han-Seo Cho , Joon-Sung Kim , Jae-Hyun Jung
IPC分类号： G02B6/12
CPC分类号： G02B6/4214 , B32B37/02 , B32B38/10 , B32B2038/0092 , B32B2457/08 , B32B2457/14 , G02B6/428 , G02B6/43 , Y10T156/1002
摘要： An optical wiring board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a base substrate having an optical waveguide layer with a mirror groove formed on one surface thereof and a first insulation layer stacked on one surface of the optical waveguide layer and having a through-hole connected with the mirror groove formed thereon, forming a metal mirror layer connected from the mirror groove to an inner wall of the through-hole and forming an electrode pad on a side of the other surface of the optical waveguide layer, in which the electrode pad is disposed in accordance with the position of the metal mirror layer.
摘要翻译：公开了一种光布线板及其制造方法。根据本发明的实施例，该方法包括提供一基底基板，该基底基板具有光波导层，该光波导层在其一个表面上形成有反射镜槽，第一绝缘层层叠在该光波导层的一个表面上，与形成在其上的反射镜槽连接的孔，形成从反射镜槽连接到通孔的内壁的金属镜层，并在光波导层的另一个表面的一侧形成电极焊盘，其中电极按照金属镜面层的位置设置衬垫。

2. 发明申请

US20110007999A1 Printed circuit board 有权
标题翻译：印刷电路板
公开(公告)号：US20110007999A1
公开(公告)日：2011-01-13
申请号：US12923143
申请日：2010-09-03
申请人： Sang-Hoon Kim , Je-Gwang Yoo , Joon-Sung Kim , Jae-Hyun Jung , Han-Seo Cho
发明人： Sang-Hoon Kim , Je-Gwang Yoo , Joon-Sung Kim , Jae-Hyun Jung , Han-Seo Cho
IPC分类号： G02B6/12
CPC分类号： G02B6/12002 , G02B6/13 , G02B6/43 , H05K1/0274 , H05K3/4652 , H05K3/4691
摘要： A printed circuit board including a first optical waveguide having a circuit pattern and a pad buried in one side thereof, a first insulation layer stacked over one side of the first optical waveguide, a first insulating material stacked over the first insulation layer, a first electrical wiring layer stacked over the first insulating material, a second optical waveguide having a circuit pattern and a pad buried in one side thereof, a second insulation layer stacked over one side of the second optical waveguide, a second insulating material stacked over the second insulation layer, a second electrical wiring layer stacked over the second insulating material, an intermediate layer interposed between the other side of the first optical waveguide and the other side of the second optical waveguide such that the first optical waveguide and the second optical waveguide are attached, and a via penetrating the first optical waveguide and the second optical waveguide.
摘要翻译：一种印刷电路板，包括具有电路图案的第一光波导和埋在其一侧的焊盘，堆叠在所述第一光波导的一侧上的第一绝缘层，堆叠在所述第一绝缘层上的第一绝缘材料，布线层堆叠在第一绝缘材料上，具有电路图案和埋在其一侧的焊盘的第二光波导，堆叠在第二光波导的一侧上的第二绝缘层，堆叠在第二绝缘层上的第二绝缘材料层叠在所述第二绝缘材料上的第二电布线层，插入在所述第一光波导的另一侧和所述第二光波导的另一侧之间的中间层，使得附接所述第一光波导和所述第二光波导;以及穿过第一光波导和第二光波导的通孔。

3. 发明授权

US07991250B2 Printed circuit board 有权
公开(公告)号：US07991250B2
公开(公告)日：2011-08-02
申请号：US12923143
申请日：2010-09-03
申请人： Sang-Hoon Kim , Je-Gwang Yoo , Joon-Sung Kim , Jae-Hyun Jung , Han-Seo Cho
发明人： Sang-Hoon Kim , Je-Gwang Yoo , Joon-Sung Kim , Jae-Hyun Jung , Han-Seo Cho
IPC分类号： G02B6/12
CPC分类号： G02B6/12002 , G02B6/13 , G02B6/43 , H05K1/0274 , H05K3/4652 , H05K3/4691
摘要： A printed circuit board including a first optical waveguide having a circuit pattern and a pad buried in one side thereof, a first insulation layer stacked over one side of the first optical waveguide, a first insulating material stacked over the first insulation layer, a first electrical wiring layer stacked over the first insulating material, a second optical waveguide having a circuit pattern and a pad buried in one side thereof, a second insulation layer stacked over one side of the second optical waveguide, a second insulating material stacked over the second insulation layer, a second electrical wiring layer stacked over the second insulating material, an intermediate layer interposed between the other side of the first optical waveguide and the other side of the second optical waveguide such that the first optical waveguide and the second optical waveguide are attached, and a via penetrating the first optical waveguide and the second optical waveguide.

4. 发明申请

US20110116736A1 OPTICAL WIRING BOARD AND MANUFACTURING METHOD THEREOF 失效
标题翻译：光接线板及其制造方法
公开(公告)号：US20110116736A1
公开(公告)日：2011-05-19
申请号：US12760035
申请日：2010-04-14
申请人： Sang-Hoon KIM , Han-Seo Cho , Joon-Sung Kim , Jae-Hyun Jung
发明人： Sang-Hoon KIM , Han-Seo Cho , Joon-Sung Kim , Jae-Hyun Jung
IPC分类号： G02B6/12 , B05D5/12 , B29C65/00
CPC分类号： G02B6/4214 , B32B37/02 , B32B38/10 , B32B2038/0092 , B32B2457/08 , B32B2457/14 , G02B6/428 , G02B6/43 , Y10T156/1002
摘要： An optical wiring board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a base substrate having an optical waveguide layer with a mirror groove formed on one surface thereof and a first insulation layer stacked on one surface of the optical waveguide layer and having a through-hole connected with the mirror groove formed thereon, forming a metal mirror layer connected from the mirror groove to an inner wall of the through-hole and forming an electrode pad on a side of the other surface of the optical waveguide layer, in which the electrode pad is disposed in accordance with the position of the metal mirror layer.
摘要翻译：公开了一种光布线板及其制造方法。根据本发明的实施例，该方法包括提供一基底基板，该基底基板具有光波导层，该光波导层在其一个表面上形成有反射镜槽，第一绝缘层堆叠在该光波导层的一个表面上，与形成在其上的反射镜槽连接的孔，形成从反射镜槽连接到通孔的内壁的金属镜层，并在光波导层的另一个表面的一侧形成电极焊盘，其中电极按照金属镜面层的位置设置衬垫。

5. 发明授权

US07809220B2 Printed circuit board and manufacturing method thereof 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US07809220B2
公开(公告)日：2010-10-05
申请号：US12219135
申请日：2008-07-16
申请人： Sang-Hoon Kim , Je-Gwang Yoo , Joon-Sung Kim , Jae-Hyun Jung , Han-Seo Cho
发明人： Sang-Hoon Kim , Je-Gwang Yoo , Joon-Sung Kim , Jae-Hyun Jung , Han-Seo Cho
IPC分类号： G02B6/12
CPC分类号： G02B6/12002 , G02B6/13 , G02B6/43 , H05K1/0274 , H05K3/4652 , H05K3/4691
摘要： A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The printed circuit board can include: an optical waveguide, in one side of which a circuit pattern and a pad are buried; an insulation layer stacked over one side of the optical waveguide; a first insulating material stacked over the insulation layer; a first electrical wiring layer stacked over the first insulating material; a second insulating material stacked over the other side of the optical waveguide; a second electrical wiring layer stacked over the second insulating material; and a via penetrating the optical waveguide. Certain embodiments of the invention enable the efficient transmission of optical and electrical signals, reduce loss in the optical signals transferred to the photoelectric converters, and allow more efficient designs for the wiring in the board.
摘要翻译：公开了印刷电路板和印刷电路板的制造方法。印刷电路板可以包括：光波导，其一侧埋有电路图案和垫; 层叠在光波导一侧的绝缘层; 堆叠在所述绝缘层上的第一绝缘材料; 堆叠在所述第一绝缘材料上的第一电布线层; 层叠在所述光波导的另一侧的第二绝缘材料; 层叠在所述第二绝缘材料上的第二电布线层; 以及穿过光波导的通孔。本发明的某些实施例能够有效地传输光信号和电信号，减少传输到光电转换器的光信号的损耗，并且允许更有效的设计用于电路板中的配线。

6. 发明授权

US08249403B2 Optical wiring board and manufacturing method thereof 失效
标题翻译：光接线板及其制造方法
公开(公告)号：US08249403B2
公开(公告)日：2012-08-21
申请号：US12761716
申请日：2010-04-16
申请人： Sang-Hoon Kim , Han-Seo Cho , Joon-Sung Kim , Jae-Hyun Jung
发明人： Sang-Hoon Kim , Han-Seo Cho , Joon-Sung Kim , Jae-Hyun Jung
IPC分类号： G02B6/12 , G02B6/10
CPC分类号： G02B6/4201 , G02B6/4214 , G02B6/428 , G02B6/43 , Y10T29/49117
摘要： An optical wiring board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a flexible optical waveguide layer, selectively forming a reinforcing clad on one surface of the optical waveguide layer and forming a mirror groove on the other surface of the optical waveguide layer in accordance with where the reinforcing clad is formed. Thus, the clad can be formed thick only on the place where the mirror groove is to be formed, and thus a flexible optical wiring board having flexibility can be manufactured even though the optical wiring board is generally made thin.
摘要翻译：公开了一种光布线板及其制造方法。根据本发明的实施例，该方法包括提供柔性光波导层，在光波导层的一个表面上选择性地形成加强包层，并在光波导层的另一个表面上根据其中形成加强包层。因此，只要在形成镜面凹槽的地方能够形成厚度的包层，即使光线路板通常薄，也可以制造具有挠性的挠性光布线板。

7. 发明申请

US20110116737A1 OPTICAL WIRING BOARD AND MANUFACTURING METHOD THEREOF 失效
标题翻译：光接线板及其制造方法
公开(公告)号：US20110116737A1
公开(公告)日：2011-05-19
申请号：US12761716
申请日：2010-04-16
申请人： Sang-Hoon KIM , Han-Seo Cho , Joon-Sung Kim , Jae-Hyun Jung
发明人： Sang-Hoon KIM , Han-Seo Cho , Joon-Sung Kim , Jae-Hyun Jung
IPC分类号： G02B6/12 , H01R43/00
CPC分类号： G02B6/4201 , G02B6/4214 , G02B6/428 , G02B6/43 , Y10T29/49117
摘要： An optical wiring board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a flexible optical waveguide layer, selectively forming a reinforcing clad on one surface of the optical waveguide layer and forming a mirror groove on the other surface of the optical waveguide layer in accordance with where the reinforcing clad is formed. Thus, the clad can be formed thick only on the place where the mirror groove is to be formed, and thus a flexible optical wiring board having flexibility can be manufactured even though the optical wiring board is generally made thin.
摘要翻译：公开了一种光布线板及其制造方法。根据本发明的实施例，该方法包括提供柔性光波导层，在光波导层的一个表面上选择性地形成加强包层，并在光波导层的另一个表面上根据其中形成加强包层。因此，只要在形成镜面凹槽的地方能够形成厚度的包层，即使光线路板通常薄，也可以制造具有挠性的挠性光布线板。

8. 发明授权

US07831116B2 Optical waveguide and optical printed circuit board having the same 失效
标题翻译：光波导和具有相同光学印刷电路板
公开(公告)号：US07831116B2
公开(公告)日：2010-11-09
申请号：US12232899
申请日：2008-09-25
申请人： Joon-Sung Kim , Jae-Hyun Jung , Han-Seo Cho , Sang-Hoon Kim
发明人： Joon-Sung Kim , Jae-Hyun Jung , Han-Seo Cho , Sang-Hoon Kim
IPC分类号： G02B6/12 , H01L21/00
CPC分类号： G02B6/43 , G02B6/4224 , H05K1/0269 , H05K1/0274 , H05K2201/0108 , H05K2201/09781 , H05K2201/09918
摘要： An optical waveguide, an optical printed circuit board equipped with the optical waveguide, and methods of manufacturing the optical waveguide and the optical printed circuit board are disclosed. The optical waveguide can include: a first cladding layer; a core formed on the first cladding layer; an alignment pattern, having a predefined positional relationship to the core, formed on the first cladding layer; a target mark formed on the alignment pattern to indicate a position of the alignment pattern; and a second cladding layer formed on the first cladding layer to cover the core, the alignment pattern, and the target mark. In such an optical waveguide, circuit patterns, etc., formed over the second cladding layer may be precisely and efficiently aligned with the core.
摘要翻译：公开了一种光波导，配备有光波导的光学印刷电路板以及制造光波导和光学印刷电路板的方法。光波导可以包括：第一包层; 形成在第一包层上的芯; 形成在所述第一包层上的与所述芯部具有预定位置关系的对准图案; 形成在所述对准图案上以指示所述对准图案的位置的目标标记; 以及形成在所述第一包覆层上以覆盖所述芯，所述对准图案和所述目标标记的第二包层。在这种光波导中，形成在第二覆层上的电路图案等可以精确且有效地与芯对准。

9. 发明申请

US20090304324A1 Optical waveguide and optical printed circuit board having the same 失效
标题翻译：光波导和具有相同光学印刷电路板
公开(公告)号：US20090304324A1
公开(公告)日：2009-12-10
申请号：US12232899
申请日：2008-09-25
申请人： Joon-Sung Kim , Jae-Hyun Jung , Han-Seo Cho , Sang-Hoon Kim
发明人： Joon-Sung Kim , Jae-Hyun Jung , Han-Seo Cho , Sang-Hoon Kim
IPC分类号： G02B6/12 , G02B6/02
CPC分类号： G02B6/43 , G02B6/4224 , H05K1/0269 , H05K1/0274 , H05K2201/0108 , H05K2201/09781 , H05K2201/09918
摘要： An optical waveguide, an optical printed circuit board equipped with the optical waveguide, and methods of manufacturing the optical waveguide and the optical printed circuit board are disclosed. The optical waveguide can include: a first cladding layer; a core formed on the first cladding layer; an alignment pattern, having a predefined positional relationship to the core, formed on the first cladding layer; a target mark formed on the alignment pattern to indicate a position of the alignment pattern; and a second cladding layer formed on the first cladding layer to cover the core, the alignment pattern, and the target mark. In such an optical waveguide, circuit patterns, etc., formed over the second cladding layer may be precisely and efficiently aligned with the core.
摘要翻译：公开了一种光波导，配备有光波导的光学印刷电路板以及制造光波导和光学印刷电路板的方法。光波导可以包括：第一包层; 形成在第一包层上的芯; 形成在所述第一包层上的与所述芯部具有预定位置关系的对准图案; 形成在所述对准图案上以指示所述对准图案的位置的目标标记; 以及形成在所述第一包覆层上以覆盖所述芯，所述对准图案和所述目标标记的第二包层。在这种光波导中，形成在第二覆层上的电路图案等可以精确且有效地与芯对准。

10. 发明授权

US07697800B2 Method of manufacturing printed circuit board 失效
标题翻译：制造印刷电路板的方法
公开(公告)号：US07697800B2
公开(公告)日：2010-04-13
申请号：US12453616
申请日：2009-05-15
申请人： Han Seo Cho , Je-Gwang Yoo , Sang-Hoon Kim , Joon-Sung Kim
发明人： Han Seo Cho , Je-Gwang Yoo , Sang-Hoon Kim , Joon-Sung Kim
IPC分类号： G02B6/12 , G02B6/10 , H01L21/00
CPC分类号： G02B6/1221 , G02B6/136 , G02B6/28 , G02B6/4214 , H05K1/0274 , H05K3/20 , Y10T29/49155
摘要： A method of manufacturing a printed circuit board in which optical waveguides are formed for transmitting optical signals together with electrical signals, which includes a cladding, a core embedded in the cladding that transmits optical signals, and a wiring pattern embedded in the cladding that transmits electrical signals, can offer improved optical connection efficiency and reduced material costs by enabling the cladding to act as an insulation layer and embedding the wiring pattern in the cladding.
摘要翻译：一种制造印刷电路板的方法，其中形成光波导以及电信号一起传输光信号，电信号包括包层，嵌入在传播光信号的包层中的芯，以及嵌入在包层中的布线图案，其传输电信号，可以通过使包层充当绝缘层并且将布线图案嵌入包层中来提供改善的光学连接效率和降低的材料成本。

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