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1. 发明申请

US20130056457A1 USER INTERFACE FOR INDUCTION HEATING COOKER AND CONTROL METHOD THEREOF 有权
标题翻译：用于感应加热烹饪器的用户界面及其控制方法
公开(公告)号：US20130056457A1
公开(公告)日：2013-03-07
申请号：US13600732
申请日：2012-08-31
申请人： Joon Ho LEE , Joo Hyun KIM
发明人： Joon Ho LEE , Joo Hyun KIM
IPC分类号： H05B6/12
CPC分类号： H05B6/12 , F24C7/083
摘要： A user interface for an induction heating cooker, a method of controlling the same and an induction heating cooker thereof are provided. The user interface, if a drag touch signal of a drag touch from one position to another position on a display unit is sensed, is configured to change power levels of all of coils in operation to a predetermined reference power level and displays the changed power level. The induction heating cooker is configured to supply the coils with a power corresponding to the reference power level, thereby controlling all of the coils with one drag touch and enabling enhanced security while in a rapid manner.
摘要翻译：提供了感应加热烹调器的用户界面，其控制方法以及感应加热烹调器。如果感测到从显示单元上的一个位置到另一个位置的拖动触摸的拖动触摸信号的用户接口被配置为将操作中的所有线圈的功率电平改变到预定参考功率电平并且显示改变的功率电平。感应加热烹调器被配置为向线圈供给与参考功率电平相对应的功率，从而以一种拖动触摸方式控制所有线圈，并且能够以快速的方式提高安全性。

2. 发明公开

US20230282507A1 CONDUCTIVE ELECTROSTATIC CHUCK LIFT PIN, ELECTROSTATIC CHUCK COMPRISING THE SAME, AND SEMICONDUCTOR MANUFACTURING METHOD USING THE SAME 审中-公开
公开(公告)号：US20230282507A1
公开(公告)日：2023-09-07
申请号：US18016221
申请日：2021-06-21
申请人： Joon Ho LEE
发明人： Joon Ho LEE
IPC分类号： H01L21/683
CPC分类号： H01L21/6833
摘要： The present invention relates to a conductive lift pin used in an electrostatic chuck, an electrostatic chuck including same, and a semiconductor manufacturing method using same. Provided in the present invention are a conductive electrostatic chuck lift pin and an electrostatic chuck having the lift pin mounted therein, the lift pin including AlTiC, which has a TiC phase dispersed on an Al2O3 phase, and having electrical resistivity of 2.5×10-5 to 3.5×10-5 Ω·m. The electrostatic chuck lift pin of the present invention can solve the problem of defects induced by static electricity and electric reaction due to contact between the components and insulating ceramic when using existing insulating ceramic, and is conductive and thus can release residual charge between a semiconductor wafer and the electrostatic chuck even without the presence of plasma. Therefore, since the lift pin can be raised immediately after de-chucking, treatment time per wafer sheet is reduced.

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