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1. 发明申请

US20120112857A1 DOUBLE MICROSTRIP TRANSMISSION LINE HAVING COMMON DEFECTED GROUND STRUCTURE AND WIRELESS CIRCUIT APPARATUS USING THE SAME 有权
标题翻译：具有共同缺陷的地面结构和无线电路的双路微型传输线
公开(公告)号：US20120112857A1
公开(公告)日：2012-05-10
申请号：US13267152
申请日：2011-10-06
申请人： Jongsik LIM , Dal AHN
发明人： Jongsik LIM , Dal AHN
IPC分类号： H01P3/08
CPC分类号： H01P3/081 , H01P1/2039 , H01P3/082 , H01P3/088 , H01P5/028 , H01P5/16 , H01P5/184 , H01P5/185
摘要： Disclosed are a microstrip transmission line having a common defected ground structure (DGS) and a wireless circuit apparatus having the same. The microstrip transmission line realizes a common defected ground structure (DGS) and a double microstrip structure, and includes: a first dielectric layer; a first signal line pattern formed on a first surface of the first dielectric layer; a common ground conductive layer formed on a second surface of the first dielectric layer and having a defected ground structure, the first surface facing the second surface; a second dielectric layer having a first surface brought into contact with the common ground conductive layer, and facing the first dielectric layer while interposing the common ground conductive layer between the first dielectric layer and the second dielectric layer; and a second signal line pattern formed on a second surface of the second dielectric layer, the first surface facing the second surface.
摘要翻译：公开了具有共同缺陷接地结构（DGS）的微带传输线以及具有该微结构传输线的无线电路设备。微带传输线实现了共同的缺陷接地结构（DGS）和双微带结构，包括：第一介电层; 形成在所述第一介电层的第一表面上的第一信号线图案; 形成在所述第一电介质层的第二表面上并且具有缺陷的接地结构的公共接地导电层，所述第一表面面向所述第二表面; 第二电介质层，其具有与公共接地导电层接触的第一表面，并且在第一介电层和第二介电层之间插入公共接地导电层的同时面向第一介电层; 以及形成在所述第二介电层的第二表面上的第二信号线图案，所述第一表面面向所述第二表面。

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