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    • 2. 发明申请
    • Method and apparatus for chemical-mechanical polishing
    • 化学机械抛光方法和装置
    • US20090286453A1
    • 2009-11-19
    • US12385704
    • 2009-04-16
    • Il-young YoonTae-hoon LeeJae-ouk Choo
    • Il-young YoonTae-hoon LeeJae-ouk Choo
    • B24B49/04B24B1/00
    • B24B37/042B24B49/04
    • In accordance with at least one example embodiment, a method of chemical-mechanical polishing includes re-polishing a polished layer on a wafer based on a measured thickness of the polished layer. In accordance with at least one example embodiment, an apparatus for chemical-mechanical polishing may include a thickness measuring unit configured to measure a thickness of a polished surface on a wafer and to determine a re-polishing time based on the measured thickness. In accordance with example embodiments, a thickness deviation between different lots, wafers, or chips inside a wafer is reduced regardless of the durability of a polishing pad, a polishing head, or a disk used in a polishing apparatus.
    • 根据至少一个示例性实施例,化学机械抛光的方法包括基于所测量的抛光层的厚度在晶片上重新抛光抛光层。 根据至少一个示例性实施例,用于化学机械抛光的设备可以包括厚度测量单元,其被配置为测量晶片上的抛光表面的厚度并且基于测量的厚度来确定重新抛光时间。 根据示例性实施例,晶片内的不同批次,晶片或芯片之间的厚度偏差减小,而与研磨装置中使用的抛光垫,抛光头或盘的耐久性无关。
    • 7. 发明授权
    • Cooking apparatus having a cooling system
    • 具有冷却系统的烹饪设备
    • US08941041B2
    • 2015-01-27
    • US11848583
    • 2007-08-31
    • Tae-hoon Lee
    • Tae-hoon Lee
    • H05B6/64H05B6/80F24C15/20F24C15/00
    • H05B6/6435F24C15/006H05B6/642
    • A cooking apparatus is provided. The cooking apparatus includes a cooking cavity, an upper space formed above the cooking cavity, lateral side spaces formed to at opposite lateral sides of the cooking cavity, a rear space formed behind the cooking cavity, and a lower space formed below the cooking cavity. A fan provided in the rear space generates a cooling flow that cools components housed in the rear space. A cooling flow path extends from the rear space and into the upper space and lateral side spaces. Flow from the upper space enters the door to cool the door and is exhausted through a lower portion of the door. Flow from the lateral side spaces, which includes an exhaust flow from the cooking cavity, is guided to the lower space and exhausted. In this manner, the cooking apparatus can be completely cooled and cooking odors and heat appropriately exhausted by the cooling fan positioned in the rear space.
    • 提供烹饪设备。 烹饪设备包括烹饪腔,形成在烹饪腔上方的上部空间,形成在烹饪腔的相对侧面的侧面空间,形成在烹饪腔后面的后部空间,以及形成在烹饪腔下方的下部空间。 后部空间中设置的风扇产生冷却容纳在后方空间的部件的冷却流。 冷却流路从后部空间延伸到上部空间和侧面空间。 从上部空间的流动进入门以冷却门并且通过门的下部排出。 从包括来自烹饪腔的排出流的横向侧空间的流动被引导到下部空间并排出。 以这种方式,烹饪设备可以被完全冷却,并且烹饪气味和热量由位于后部空间中的冷却风扇适当地排出。
    • 10. 发明授权
    • Computer system and control method thereof
    • 计算机系统及其控制方法
    • US08826054B2
    • 2014-09-02
    • US13025564
    • 2011-02-11
    • Tae-hoon Lee
    • Tae-hoon Lee
    • G06F1/00
    • G06F1/3203G06F1/3275G06F1/3287Y02D10/13Y02D10/14Y02D10/171
    • A computer system and a control method thereof, the computer system includes a host unit which includes a plurality of lines, a plurality of memory units to which power is selectively supplied, a power supply which supplies power to the plurality of memory units, a graphic processor which connects with the host unit through the plurality of lines and accesses the plurality of memory unit, and a controller which controls supply of power to the plurality of memory units on the basis of an operation mode of the host unit, controls whether to use the plurality of lines in transmitting data in accordance with the supply of power to the plurality of memory units, and controls the graphic processor not to access the memory units receiving no power among the plurality of memory units.
    • 一种计算机系统及其控制方法,所述计算机系统包括主机单元,其包括多条线路,选择供电的多个存储单元,向所述多个存储单元供电的电源,图形 处理器,其通过多条线路与主机单元连接并访问多个存储单元;以及控制器,其基于主机单元的操作模式控制向多个存储器单元供电的控制器,控制是否使用 所述多条线根据向所述多个存储器单元的供电而发送数据,并且控制所述图形处理器不访问所述多个存储器单元中不接收电力的存储器单元。