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1. 发明申请

US20110171882A1 CHEMICAL-MECHANICAL POLISHING APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICES 失效
标题翻译：用于制造半导体器件的化学机械抛光装置
公开(公告)号：US20110171882A1
公开(公告)日：2011-07-14
申请号：US12985048
申请日：2011-01-05
申请人： Jong-sun Ahn , In-seak Hwang , Soo-young Tak , Shin Kim , One-moon Chang
发明人： Jong-sun Ahn , In-seak Hwang , Soo-young Tak , Shin Kim , One-moon Chang
IPC分类号： B24B41/06 , B24B49/00
CPC分类号： B24B37/10 , B24B49/12
摘要： A chemical-mechanical polishing (CMP) apparatus for manufacturing a semiconductor device. The apparatus includes: a spin chuck for supporting and rotating a semiconductor wafer; a polisher comprising a polishing pad for planarizing a surface of the semiconductor wafer, the polisher moving along the surface of the semiconductor wafer by a polishing arm; and a polisher supporting device for supporting the polisher and maintaining the polisher in a horizontal state, while polishing an edge part of the surface of the semiconductor wafer, in order to improve polishing uniformity of a center part and the edge part of the semiconductor wafer. Accordingly, polishing uniformity of the center part and edge part of the semiconductor wafer may be improved, and a height of the polisher supporting device may be optimized according to a polishing degree. Also, the polisher may be easily supported, wear and tear of the support head may be minimized, and the support head may function as a conditioner.
摘要翻译：一种用于制造半导体器件的化学机械抛光（CMP）装置。该装置包括：用于支撑和旋转半导体晶片的旋转卡盘; 抛光机，包括用于平坦化半导体晶片的表面的抛光垫，抛光机通过抛光臂沿着半导体晶片的表面移动; 以及用于在抛光半导体晶片的表面的边缘部分的同时在支撑抛光机并将抛光机保持在水平状态的抛光机支撑装置，以便改善半导体晶片的中心部分和边缘部分的抛光均匀性。因此，可以提高半导体晶片的中心部分和边缘部分的抛光均匀性，并且可以根据抛光度来优化抛光机支撑装置的高度。此外，可以容易地支撑抛光机，可以使支撑头的磨损和撕裂最小化，并且支撑头可用作调节器。

2. 发明授权

US08662958B2 Chemical-mechanical polishing apparatus for manufacturing semiconductor devices 失效
标题翻译：用于制造半导体器件的化学机械抛光装置
公开(公告)号：US08662958B2
公开(公告)日：2014-03-04
申请号：US12985048
申请日：2011-01-05
申请人： Jong-sun Ahn , In-seak Hwang , Soo-young Tak , Shin Kim , One-moon Chang
发明人： Jong-sun Ahn , In-seak Hwang , Soo-young Tak , Shin Kim , One-moon Chang
IPC分类号： B24B49/00
CPC分类号： B24B37/10 , B24B49/12
摘要： A chemical-mechanical polishing (CMP) apparatus for manufacturing a semiconductor device. The apparatus includes: a spin chuck for supporting and rotating a semiconductor wafer; a polisher comprising a polishing pad for planarizing a surface of the semiconductor wafer, the polisher moving along the surface of the semiconductor wafer by a polishing arm; and a polisher supporting device for supporting the polisher and maintaining the polisher in a horizontal state, while polishing an edge part of the surface of the semiconductor wafer, in order to improve polishing uniformity of a center part and the edge part of the semiconductor wafer. Accordingly, polishing uniformity of the center part and edge part of the semiconductor wafer may be improved, and a height of the polisher supporting device may be optimized according to a polishing degree. Also, the polisher may be easily supported, wear and tear of the support head may be minimized, and the support head may function as a conditioner.
摘要翻译：一种用于制造半导体器件的化学机械抛光（CMP）装置。该装置包括：用于支撑和旋转半导体晶片的旋转卡盘; 抛光机，包括用于平坦化半导体晶片的表面的抛光垫，抛光机通过抛光臂沿着半导体晶片的表面移动; 以及用于在抛光半导体晶片的表面的边缘部分的同时在支撑抛光机并将抛光机保持在水平状态的抛光机支撑装置，以便改善半导体晶片的中心部分和边缘部分的抛光均匀性。因此，可以提高半导体晶片的中心部分和边缘部分的抛光均匀性，并且可以根据抛光度来优化抛光机支撑装置的高度。此外，可以容易地支撑抛光机，可以使支撑头的磨损和撕裂最小化，并且支撑头可用作调节器。

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