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1. 发明申请

US20070241442A1 STACKED INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM 有权
标题翻译：堆叠式集成电路封装系统
公开(公告)号：US20070241442A1
公开(公告)日：2007-10-18
申请号：US11379097
申请日：2006-04-18
申请人： Jong-Woo Ha , Gwang Kim , JuHyun Park
发明人： Jong-Woo Ha , Gwang Kim , JuHyun Park
IPC分类号： H01L23/02
CPC分类号： H01L25/0657 , H01L23/3135 , H01L24/73 , H01L25/03 , H01L25/105 , H01L25/162 , H01L25/165 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06562 , H01L2225/1023 , H01L2225/1052 , H01L2924/14 , H01L2924/15311 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A stacked integrated circuit package-in-package system is provided forming a first integrated circuit package having a first peripheral contact, forming a second integrated circuit package having a second peripheral contact, stacking the second integrated circuit package on the first integrated circuit package in an offset configuration with the first peripheral contact exposed, the offset configuration provides a second package overhang with the second integrated circuit package above the first integrated circuit package, electrically connecting the first peripheral contact and a package substrate top contact, and electrically connecting the second peripheral contact and the package substrate top contact.
摘要翻译：提供一种堆叠式集成电路封装封装系统，其形成具有第一外围触点的第一集成电路封装，形成具有第二外围触点的第二集成电路封装，将第二集成电路封装堆叠在第一集成电路封装上第一外围触点暴露的偏移构造，偏移构造提供第二封装突出端与第一集成电路封装之上的第二集成电路封装，电连接第一周边触点和封装衬底顶部触点，并电连接第二周边触点和封装衬底顶部接触。

2. 发明授权

US07368319B2 Stacked integrated circuit package-in-package system 有权
标题翻译：堆叠式集成电路封装封装系统
公开(公告)号：US07368319B2
公开(公告)日：2008-05-06
申请号：US11276940
申请日：2006-03-17
申请人： Jong-Woo Ha , Gwang Kim , JuHyun Park
发明人： Jong-Woo Ha , Gwang Kim , JuHyun Park
IPC分类号： H01L21/00 , H01L23/02 , H01R12/16
CPC分类号： H01L25/105 , H01L23/3128 , H01L24/45 , H01L25/03 , H01L2224/0401 , H01L2224/06135 , H01L2224/06136 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/4824 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2225/1023 , H01L2225/1052 , H01L2225/1058 , H01L2924/01014 , H01L2924/01079 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： A stacked integrated circuit package-in-package system is provided forming a first integrated circuit package having a first encapsulation and a second integrated circuit package having a second encapsulation, stacking the first integrated package below the second integrated circuit package with the first encapsulation attached to the second encapsulation, forming a substrate having an opening from a substrate top surface to a substrate bottom surface, mounting the first integrated circuit package over the substrate top surface, electrically connecting the first integrated circuit package and the substrate bottom surface through the opening, and electrically connecting the second integrated circuit package and the substrate top surface.
摘要翻译：提供一种堆叠集成电路封装封装系统，其形成具有第一封装的第一集成电路封装和具有第二封装的第二集成电路封装，将第一集成封装堆叠在第二集成电路封装下方，第一封装连接到第二封装，形成具有从衬底顶表面到衬底底表面的开口的衬底，将第一集成电路封装安装在衬底顶表面上，通过开口电连接第一集成电路封装和衬底底表面;以及电连接第二集成电路封装和基板顶表面。

3. 发明申请

US20070241453A1 STACKED INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM 有权
标题翻译：堆叠式集成电路封装系统
公开(公告)号：US20070241453A1
公开(公告)日：2007-10-18
申请号：US11379106
申请日：2006-04-18
申请人： Jong-Woo Ha , Gwang Kim , JuHyun Park
发明人： Jong-Woo Ha , Gwang Kim , JuHyun Park
IPC分类号： H01L23/34
CPC分类号： H01L25/0657 , H01L23/3128 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06562 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19105 , H01L2924/19107 , H01L2224/32245 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A stacked integrated circuit package-in-package system is provided forming a first integrated circuit package having a first peripheral contact, forming a second integrated circuit package having a second peripheral contact, stacking the second integrated circuit package on the first integrated circuit package in a multidirectional offset stack configuration with the first peripheral contact exposed, the multidirectional offset stack configuration provides a second package overhang with the second integrated circuit package above the first integrated circuit package, electrically connecting the first peripheral contact and a package substrate contact along a package first edge, and electrically connecting the second peripheral contact and the package substrate contact along a package second edge.
摘要翻译：提供了一种堆叠式集成电路封装封装系统，其形成具有第一外围触点的第一集成电路封装，形成具有第二外围触点的第二集成电路封装，将第二集成电路封装堆叠在第一集成电路封装上多向偏移堆叠结构，其中所述第一外围接触件暴露，所述多向偏移堆叠结构提供与所述第一集成电路封装之上的所述第二集成电路封装件的第二封装突出端，沿着封装的第一边缘电连接所述第一外围触点和封装衬底触点并且沿着封装第二边缘电连接第二外围触点和封装基板触点。

4. 发明授权

US07498667B2 Stacked integrated circuit package-in-package system 有权
标题翻译：堆叠式集成电路封装封装系统
公开(公告)号：US07498667B2
公开(公告)日：2009-03-03
申请号：US11379106
申请日：2006-04-18
申请人： Jong-Woo Ha , Gwang Kim , JuHyun Park
发明人： Jong-Woo Ha , Gwang Kim , JuHyun Park
IPC分类号： H01L23/02 , H01L23/48
CPC分类号： H01L25/0657 , H01L23/3128 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06562 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19105 , H01L2924/19107 , H01L2224/32245 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A stacked integrated circuit package-in-package system is provided forming a first integrated circuit package having a first peripheral contact, forming a second integrated circuit package having a second peripheral contact, stacking the second integrated circuit package on the first integrated circuit package in a multidirectional offset stack configuration with the first peripheral contact exposed, the multidirectional offset stack configuration provides a second package overhang with the second integrated circuit package above the first integrated circuit package, electrically connecting the first peripheral contact and a package substrate contact along a package first edge, and electrically connecting the second peripheral contact and the package substrate contact along a package second edge.
摘要翻译：提供了一种堆叠式集成电路封装封装系统，其形成具有第一外围触点的第一集成电路封装，形成具有第二外围触点的第二集成电路封装，将第二集成电路封装堆叠在第一集成电路封装上多向偏移堆叠结构，其中所述第一外围接触件暴露，所述多向偏移堆叠结构提供与所述第一集成电路封装之上的所述第二集成电路封装件的第二封装突出端，沿着封装的第一边缘电连接所述第一外围触点和封装衬底触点并且沿着封装第二边缘电连接第二外围触点和封装基板触点。

5. 发明申请

US20070218689A1 STACKED INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM 有权
标题翻译：堆叠式集成电路封装系统
公开(公告)号：US20070218689A1
公开(公告)日：2007-09-20
申请号：US11276940
申请日：2006-03-17
申请人： Jong-Woo Ha , Gwang Kim , JuHyun Park
发明人： Jong-Woo Ha , Gwang Kim , JuHyun Park
IPC分类号： H01L21/44
CPC分类号： H01L25/105 , H01L23/3128 , H01L24/45 , H01L25/03 , H01L2224/0401 , H01L2224/06135 , H01L2224/06136 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/4824 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2225/1023 , H01L2225/1052 , H01L2225/1058 , H01L2924/01014 , H01L2924/01079 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： A stacked integrated circuit package-in-package system is provided forming a first integrated circuit package having a first encapsulation and a second integrated circuit package having a second encapsulation, stacking the first integrated package below the second integrated circuit package with the first encapsulation attached to the second encapsulation, forming a substrate having an opening from a substrate top surface to a substrate bottom surface, mounting the first integrated circuit package over the substrate top surface, electrically connecting the first integrated circuit package and the substrate bottom surface through the opening, and electrically connecting the second integrated circuit package and the substrate top surface.
摘要翻译：提供一种堆叠集成电路封装封装系统，其形成具有第一封装的第一集成电路封装和具有第二封装的第二集成电路封装，将第一集成封装堆叠在第二集成电路封装下方，第一封装连接到第二封装，形成具有从衬底顶表面到衬底底表面的开口的衬底，将第一集成电路封装安装在衬底顶表面上，通过开口电连接第一集成电路封装和衬底底表面;以及电连接第二集成电路封装和基板顶表面。

6. 发明申请

US20120187531A1 Semiconductor Device and Method of Forming Shielding Layer Around Back Surface and Sides of Semiconductor Wafer Containing IPD Structure 有权
标题翻译：半导体器件和在包含IPD结构的半导体晶片的背面和侧面形成屏蔽层的方法
公开(公告)号：US20120187531A1
公开(公告)日：2012-07-26
申请号：US13438463
申请日：2012-04-03
申请人： YongTaek Lee , HyunTai Kim , Gwang Kim , ByungHoon Ahn
发明人： YongTaek Lee , HyunTai Kim , Gwang Kim , ByungHoon Ahn
IPC分类号： H01L29/02
CPC分类号： H01L21/561 , H01L23/3114 , H01L23/552 , H01L23/64 , H01L25/16 , H01L2224/73265 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/13091
摘要： A semiconductor wafer has an insulating layer over a first surface of the substrate. An IPD structure is formed over the insulating layer. The IPD structure includes a MIM capacitor and inductor. A conductive via is formed through a portion of the IPD structure and partially through the substrate. The conductive via can be formed in first and second portions. The first portion is formed partially through the substrate and second portion is formed through a portion of the IPD structure. A first via is formed through a second surface of the substrate to the conductive via. A shielding layer is formed over the second surface of the substrate wafer. The shielding layer extends into the first via to the conductive via. The shielding layer is electrically connected through the conductive via to an external ground point. The semiconductor wafer is singulated through the conductive via.
摘要翻译：半导体晶片在基板的第一表面上具有绝缘层。 IPD结构形成在绝缘层上。 IPD结构包括MIM电容和电感。导电通孔通过IPD结构的一部分形成，并且部分地穿过衬底。导电通孔可以形成在第一和第二部分中。第一部分部分地穿过基底，第二部分通过IPD结构的一部分形成。第一通孔通过衬底的第二表面形成到导电通孔。在衬底晶片的第二表面上形成屏蔽层。屏蔽层延伸到第一通孔到导电通孔。屏蔽层通过导电通孔电连接到外部接地点。通过导电通孔将半导体晶片分离。

7. 发明申请

US20110215456A1 THIN PACKAGE SYSTEM WITH EXTERNAL TERMINALS AND METHOD OF MANUFACTURE THEREOF 有权
标题翻译：具有外部端子的薄封装系统及其制造方法
公开(公告)号：US20110215456A1
公开(公告)日：2011-09-08
申请号：US13112717
申请日：2011-05-20
申请人： Youngcheol Kim , Myung Kil Lee , Gwang Kim , Koo Hong Lee
发明人： Youngcheol Kim , Myung Kil Lee , Gwang Kim , Koo Hong Lee
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L21/6835 , H01L21/4832 , H01L21/568 , H01L23/3107 , H01L23/49503 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/83 , H01L2224/32057 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/49175 , H01L2224/73265 , H01L2224/83001 , H01L2224/83385 , H01L2224/85001 , H01L2224/92247 , H01L2924/00014 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
摘要： A method of manufacture of a thin package system with external terminals includes: providing a leadframe; providing a template for defining an external bond finger; forming external bond fingers in the template on the leadframe; forming land pad terminals by a first multi-layer plating; providing a die; attaching the die to the land pad terminals above the leadframe with an adhesive on the leadframe; covering an encapsulant over at least portions of the die and the external bond fingers; and removing the leadframe leaving a surface of the adhesive coplanar with a surface of the encapsulant.
摘要翻译：具有外部端子的薄封装系统的制造方法包括：提供引线框架; 提供用于定义外部粘结手指的模板; 在引线框架上的模板中形成外部粘结指状物; 通过第一多层电镀形成焊盘端子; 提供一个模具; 使用引线框上的粘合剂将管芯附接到引线框架上方的焊盘端子; 覆盖在所述管芯和所述外部粘结指状物的至少部分上的密封剂; 并且移除引线框架，使粘合剂的表面与密封剂的表面共面。

8. 发明授权

US08481371B2 Thin package system with external terminals and method of manufacture thereof 有权
标题翻译：具有外部端子的薄封装系统及其制造方法
公开(公告)号：US08481371B2
公开(公告)日：2013-07-09
申请号：US13112717
申请日：2011-05-20
申请人： Youngcheol Kim , Myung Kil Lee , Gwang Kim , Koo Hong Lee
发明人： Youngcheol Kim , Myung Kil Lee , Gwang Kim , Koo Hong Lee
IPC分类号： H01L21/56
CPC分类号： H01L21/6835 , H01L21/4832 , H01L21/568 , H01L23/3107 , H01L23/49503 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/83 , H01L2224/32057 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/49175 , H01L2224/73265 , H01L2224/83001 , H01L2224/83385 , H01L2224/85001 , H01L2224/92247 , H01L2924/00014 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
摘要： A method of manufacture of a thin package system with external terminals includes: providing a leadframe; providing a template for defining an external bond finger; forming external bond fingers in the template on the leadframe; forming land pad terminals by a first multi-layer plating; providing a die; attaching the die to the land pad terminals above the leadframe with an adhesive on the leadframe; covering an encapsulant over at least portions of the die and the external bond fingers; and removing the leadframe leaving a surface of the adhesive coplanar with a surface of the encapsulant.
摘要翻译：具有外部端子的薄封装系统的制造方法包括：提供引线框架; 提供用于定义外部粘结手指的模板; 在引线框架上的模板中形成外部粘结指状物; 通过第一多层电镀形成焊盘端子; 提供一个模具; 使用引线框上的粘合剂将管芯附接到引线框架上方的焊盘端子; 覆盖在所述管芯和所述外部粘结指状物的至少部分上的密封剂; 并且移除引线框架，使粘合剂的表面与密封剂的表面共面。

9. 发明授权

US08183130B2 Semiconductor device and method of forming shielding layer around back surface and sides of semiconductor wafer containing IPD structure 有权
标题翻译：在包含IPD结构的半导体晶片的背面和侧面形成屏蔽层的半导体器件和方法
公开(公告)号：US08183130B2
公开(公告)日：2012-05-22
申请号：US12816190
申请日：2010-06-15
申请人： YongTaek Lee , HyunTai Kim , Gwang Kim , ByungHoon Ahn
发明人： YongTaek Lee , HyunTai Kim , Gwang Kim , ByungHoon Ahn
IPC分类号： H01L21/00
CPC分类号： H01L21/561 , H01L23/3114 , H01L23/552 , H01L23/64 , H01L25/16 , H01L2224/73265 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/13091
摘要： A semiconductor wafer has an insulating layer over a first surface of the substrate. An IPD structure is formed over the insulating layer. The IPD structure includes a MIM capacitor and inductor. A conductive via is formed through a portion of the IPD structure and partially through the substrate. The conductive via can be formed in first and second portions. The first portion is formed partially through the substrate and second portion is formed through a portion of the IPD structure. A first via is formed through a second surface of the substrate to the conductive via. A shielding layer is formed over the second surface of the substrate wafer. The shielding layer extends into the first via to the conductive via. The shielding layer is electrically connected through the conductive via to an external ground point. The semiconductor wafer is singulated through the conductive via.
摘要翻译：半导体晶片在基板的第一表面上具有绝缘层。 IPD结构形成在绝缘层上。 IPD结构包括MIM电容和电感。导电通孔通过IPD结构的一部分形成，并且部分地穿过衬底。导电通孔可以形成在第一和第二部分中。第一部分部分地穿过基底，第二部分通过IPD结构的一部分形成。第一通孔通过衬底的第二表面形成到导电通孔。在衬底晶片的第二表面上形成屏蔽层。屏蔽层延伸到第一通孔到导电通孔。屏蔽层通过导电通孔电连接到外部接地点。通过导电通孔将半导体晶片分离。

10. 发明申请

US20070124041A1 Apparatus and method for providing audio and video content service in vehicle 有权
标题翻译：用于在车辆中提供音频和视频内容服务的装置和方法
公开(公告)号：US20070124041A1
公开(公告)日：2007-05-31
申请号：US11521686
申请日：2006-09-15
申请人： Kee Kwon , Gwang Kim , Dong Lim
发明人： Kee Kwon , Gwang Kim , Dong Lim
IPC分类号： G01C21/00
CPC分类号： H04N21/4314 , H04N21/4122 , H04N21/41422 , H04N21/4312 , H04N21/442
摘要： An apparatus and a method for providing a video content service in a vehicle are provided. The apparatus includes a speed detection unit detecting a speed of the vehicle using a global positioning system, a status detection unit detecting a status of a parking brake, and a video control unit controlling one or more display apparatuses so that an the video contents are displayed when the speed of the vehicle is determined to be below a predetermined speed based on information on the detected status of the parking brake and the detected speed of the vehicle. According to the present invention, various video contents can be provided to a driver and passengers while safety driving of the vehicle and the driver's concentration on driving are maintained.
摘要翻译：提供了一种用于在车辆中提供视频内容服务的装置和方法。该装置包括使用全局定位系统检测车辆的速度的速度检测单元，检测驻车制动器的状态的状态检测单元以及控制一个或多个显示装置的视频控制单元，使得显示视频内容当根据关于驻车制动器的检测状态和检测到的车辆速度的信息确定车辆的速度低于预定速度时。根据本发明，在车辆的安全驾驶和驾驶员的驾驶集中保持的同时，可以向司机和乘客提供各种视频内容。

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