专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09048241B2 Semiconductor device utilzing redistribution layers to couple stacked die 有权
标题翻译：半导体器件利用再分配层来耦合堆叠的管芯
公开(公告)号：US09048241B2
公开(公告)日：2015-06-02
申请号：US14063394
申请日：2013-10-25
申请人： Jong Sik Paek , Doo Hyun Park , Seong Min Seo , Won Chul Do , Pil Je Sung , Jin Hee Park , Do Hyung Kim , In Bae Park , Chang Min Lee , Yong Song , SungGeun Kang
发明人： Jong Sik Paek , Doo Hyun Park , Seong Min Seo , Won Chul Do , Pil Je Sung , Jin Hee Park , Do Hyung Kim , In Bae Park , Chang Min Lee , Yong Song , SungGeun Kang
IPC分类号： H01L23/02 , H01L23/538 , H01L25/00
CPC分类号： H01L24/03 , H01L21/563 , H01L23/3114 , H01L23/5386 , H01L23/5389 , H01L24/11 , H01L24/24 , H01L24/81 , H01L24/82 , H01L25/0657 , H01L25/50 , H01L2224/02317 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/24146 , H01L2224/24226 , H01L2224/24227 , H01L2224/32145 , H01L2224/32225 , H01L2224/73209 , H01L2224/73217 , H01L2224/73267 , H01L2224/92244 , H01L2224/94 , H01L2225/06517 , H01L2225/06524 , H01L2225/06568 , H01L2924/15311 , H01L2224/82 , H01L2224/83
摘要： A semiconductor device utilizing redistribution layers to couple stacked die is disclosed and may include a first semiconductor die with a first surface comprising bond pads, a second surface opposite the first surface, and sloped side surfaces between the first and second surfaces, such that a cross-section of the first die is trapezoidal in shape. A second semiconductor die with a first surface may be bonded to the second surface of the first die, wherein the first surface of the second die may comprise bond pads. A passivation layer may be formed on the first surface and sloped side surfaces of the first die and the first surface of the second die. A redistribution layer may be formed on the passivation layer, electrically coupling bond pads on the first and second die. A conductive pillar may extend from a bond pad on the second die to the second redistribution layer.
摘要翻译：公开了一种利用再分配层耦合堆叠管芯的半导体器件，其可以包括第一半导体管芯，其具有包括接合焊盘的第一表面，与第一表面相对的第二表面以及第一和第二表面之间的倾斜侧表面，第一个模具的截面形状为梯形。具有第一表面的第二半导体管芯可以结合到第一管芯的第二表面，其中第二管芯的第一表面可以包括接合焊盘。钝化层可以形成在第一模具的第一表面和倾斜的侧表面上以及第二模具的第一表面上。可以在钝化层上形成再分配层，电耦合第一和第二裸片上的接合焊盘。导电柱可以从第二管芯上的焊盘延伸到第二再分布层。

2. 发明申请

US20150014830A1 SEMICONDUCTOR DEVICE UTILZING REDISTRIBUTION LAYERS TO COUPLE STACKED DIE 有权
标题翻译：使用重新分配层的半导体器件
公开(公告)号：US20150014830A1
公开(公告)日：2015-01-15
申请号：US14063394
申请日：2013-10-25
申请人： Jong Sik Paek , Doo Hyun Park , Seong Min Seo , Won Chul Do , Pil Je Sung , Jin Hee Park , Do Hyung Kim , In Bae Park , Chang Min Lee , Yong Song , SungGeun Kang
发明人： Jong Sik Paek , Doo Hyun Park , Seong Min Seo , Won Chul Do , Pil Je Sung , Jin Hee Park , Do Hyung Kim , In Bae Park , Chang Min Lee , Yong Song , SungGeun Kang
IPC分类号： H01L23/538 , H01L25/00
CPC分类号： H01L24/03 , H01L21/563 , H01L23/3114 , H01L23/5386 , H01L23/5389 , H01L24/11 , H01L24/24 , H01L24/81 , H01L24/82 , H01L25/0657 , H01L25/50 , H01L2224/02317 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/24146 , H01L2224/24226 , H01L2224/24227 , H01L2224/32145 , H01L2224/32225 , H01L2224/73209 , H01L2224/73217 , H01L2224/73267 , H01L2224/92244 , H01L2224/94 , H01L2225/06517 , H01L2225/06524 , H01L2225/06568 , H01L2924/15311 , H01L2224/82 , H01L2224/83
摘要： A semiconductor device utilizing redistribution layers to couple stacked die is disclosed and may include a first semiconductor die with a first surface comprising bond pads, a second surface opposite the first surface, and sloped side surfaces between the first and second surfaces, such that a cross-section of the first die is trapezoidal in shape. A second semiconductor die with a first surface may be bonded to the second surface of the first die, wherein the first surface of the second die may comprise bond pads. A passivation layer may be formed on the first surface and sloped side surfaces of the first die and the first surface of the second die. A redistribution layer may be formed on the passivation layer, electrically coupling bond pads on the first and second die. A conductive pillar may extend from a bond pad on the second die to the second redistribution layer.
摘要翻译：公开了一种利用再分配层耦合堆叠管芯的半导体器件，其可以包括第一半导体管芯，其具有包括接合焊盘的第一表面，与第一表面相对的第二表面以及第一和第二表面之间的倾斜侧表面，第一个模具的截面形状为梯形。具有第一表面的第二半导体管芯可以结合到第一管芯的第二表面，其中第二管芯的第一表面可以包括接合焊盘。钝化层可以形成在第一模具的第一表面和倾斜的侧表面上以及第二模具的第一表面上。可以在钝化层上形成再分配层，电耦合第一和第二裸片上的接合焊盘。导电柱可以从第二管芯上的焊盘延伸到第二再分布层。

3. 发明授权

US07202554B1 Semiconductor package and its manufacturing method 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US07202554B1
公开(公告)日：2007-04-10
申请号：US10921642
申请日：2004-08-19
申请人： Do Hyung Kim , Hyung Il Jeon , Doo Hyun Park
发明人： Do Hyung Kim , Hyung Il Jeon , Doo Hyun Park
IPC分类号： H01L23/02
CPC分类号： H01L23/49575 , H01L23/3135 , H01L23/49548 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05554 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/49175 , H01L2224/73215 , H01L2224/73265 , H01L2224/92247 , H01L2924/01079 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor package comprising paddle and a plurality of leads which extend at least partially about the die paddle in spaced relation thereto. Attached to the die paddle is a semiconductor die which is electrically connected to at least some of the leads. Attached to the semiconductor die is at least one inner package. A package body encapsulates the die paddle, the leads, the semiconductor die and the inner package such that a portion of each of the leads and a portion of the inner package are exposed in the package body.
摘要翻译：一种包括桨和多个引线的半导体封装，所述多个引线至少部分地围绕所述管芯片间隔开地延伸。连接到管芯焊盘的是与至少一些引线电连接的半导体管芯。连接到半导体管芯的是至少一个内部封装。封装体封装裸片，引线，半导体管芯和内部封装，使得每个引线的一部分和内部封装的一部分在封装主体中露出。

4. 发明授权

US09280703B2 Apparatus and method for tracking hand 有权
标题翻译：用于跟踪手的装置和方法
公开(公告)号：US09280703B2
公开(公告)日：2016-03-08
申请号：US13596523
申请日：2012-08-28
申请人： Woo Han Yun , Jae Yeon Lee , Do Hyung Kim , Jae Hong Kim , Joo Chan Sohn
发明人： Woo Han Yun , Jae Yeon Lee , Do Hyung Kim , Jae Hong Kim , Joo Chan Sohn
IPC分类号： G06K9/00
CPC分类号： G06K9/00355
摘要： Disclosed are an apparatus for tracking a location of a hand, includes: a skin color image detector for detecting a skin color region from an image input from an image device using a predetermined skin color of a user; a face tracker for tracking a face using the detected skin color image; a motion detector for setting a ROI using location information of the tracked face, and detecting a motion image from the set ROI; a candidate region extractor for extracting a candidate region with respect to a hand of the user using the skin color image detected by the skin color image detector and the motion image detected by the motion detector; and a hand tracker for tracking a location of the hand in the extracted candidate region to find out a final location of the hand.
摘要翻译：公开了一种用于跟踪手的位置的装置，包括：皮肤彩色图像检测器，用于使用用户的预定皮肤颜色从图像设备输入的图像中检测皮肤颜色区域; 面部跟踪器，用于使用检测到的肤色图像跟踪脸部; 运动检测器，用于使用所跟踪的面部的位置信息来设置ROI，以及从所设置的ROI检测运动图像; 候选区域提取器，用于使用由肤色图像检测器检测到的肤色图像和由运动检测器检测的运动图像提取相对于用户的手的候选区域; 以及用于跟踪所提取的候选区域中的手的位置以找出手的最终位置的手跟踪器。

5. 发明授权

US09237351B2 Encoding/decoding apparatus and method for parallel correction of in-loop pixels based on measured complexity, using video parameter 有权
标题翻译：使用视频参数，基于测量的复杂度并行校正环路像素的编码/解码装置和方法
公开(公告)号：US09237351B2
公开(公告)日：2016-01-12
申请号：US13606544
申请日：2012-09-07
申请人： Doo Hyun Kim , Dong Gyu Sim , Joon Ho Song , Do Hyung Kim , Eun Kyung Ryu , Shi Hwa Lee , Hyun Ho Cho , Jung Han Seo
发明人： Doo Hyun Kim , Dong Gyu Sim , Joon Ho Song , Do Hyung Kim , Eun Kyung Ryu , Shi Hwa Lee , Hyun Ho Cho , Jung Han Seo
IPC分类号： H04N19/00 , H04N19/14 , H04N19/176 , H04N19/127 , H04N19/46 , H04N19/436 , H04N19/86
CPC分类号： H04N19/14 , H04N19/127 , H04N19/176 , H04N19/436 , H04N19/46 , H04N19/86
摘要： An encoding/decoding apparatus and method for parallel correction of in-loop pixels based on complexity using a video parameter may include a complexity measuring unit to measure a complexity of an in-loop pixel correction process, using video codec parameter information, in a video codec, and a core allocating unit to evenly distribute jobs associated with the in-loop pixel correction process, using the measured complexity.
摘要翻译：用于使用视频参数的基于复杂度的并行校正循环像素的编码/解码装置和方法可以包括：复杂度测量单元，用于在视频中使用视频编解码器参数信息来测量循环中像素校正处理的复杂度编解码器和核心分配单元，以使用测量的复杂度来平均分配与循环像素校正过程相关联的作业。

6. 发明授权

US08860049B2 Multi-light emitting diode package 有权
标题翻译：多发光二极管封装
公开(公告)号：US08860049B2
公开(公告)日：2014-10-14
申请号：US13090862
申请日：2011-04-20
申请人： Jung Hoo Seo , Do Hyung Kim , Byoung Ki Pyo , You Jin Kwon , Ju Yong Shim
发明人： Jung Hoo Seo , Do Hyung Kim , Byoung Ki Pyo , You Jin Kwon , Ju Yong Shim
IPC分类号： H01L33/62 , H01L33/58 , H01L25/075 , H01L33/50 , H01L33/64
CPC分类号： H01L25/0753 , H01L33/504 , H01L33/58 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/12041 , Y10S362/80 , H01L2924/00014 , H01L2924/00
摘要： A multi-LED package includes a heat sink including a primary slug and a secondary slug separated from each other, a primary LED chip mounted on the primary slug, one or more secondary LED chips mounted on the secondary slug, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. Another multi-LED package includes a heat sink having an upper surface and partitions protruding therefrom, a primary LED chip mounted inside the partitions, one or more secondary LED chips mounted outside the partitions, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip.
摘要翻译：多LED封装包括散热器，其包括彼此分离的初级芯片和次级芯片，安装在初级芯片上的主要LED芯片，安装在次级芯片上的一个或多个次级LED芯片，电连接的引线框架结构到主要和次要LED芯片以及覆盖主要LED芯片的至少一部分的荧光体。另一个多LED封装包括具有上表面和从其突出的隔板的散热器，安装在隔板内的主LED芯片，安装在隔板外部的一个或多个次级LED芯片，电连接到主和次级LED的引线框架结构芯片和覆盖主LED芯片的至少一部分的荧光体。

7. 发明授权

US08849048B2 Apparatus for decoding image data based on availability of reference data and method thereof 有权
标题翻译：基于参考数据的可用性对图像数据进行解码的装置及其方法
公开(公告)号：US08849048B2
公开(公告)日：2014-09-30
申请号：US13373239
申请日：2011-11-09
申请人： Min Soo Kim , Joon Ho Song , Shi Hwa Lee , Do Hyung Kim
发明人： Min Soo Kim , Joon Ho Song , Shi Hwa Lee , Do Hyung Kim
IPC分类号： G06K9/36 , G06K9/46 , H04N7/12 , H04N11/02 , H04N19/44 , H04N19/436
CPC分类号： H04N19/00533 , H04N19/436 , H04N19/44
摘要： An image data decoding apparatus and method are based on an availability of reference data. The image data decoding apparatus may include a core to process decoding of image data, and an availability determining device to receive, from the core, availability verification request information with respect to a reference area of a first frame included in the image data, to determine an availability with respect to the reference area based on the received availability verification request information, and to transmit, to the core, the determined availability. When the reference area is available, the core may process decoding of a second frame based on the reference area.
摘要翻译：图像数据解码装置和方法基于参考数据的可用性。图像数据解码装置可以包括用于处理图像数据的解码的核心和可用性确定装置，用于从核心接收关于包括在图像数据中的第一帧的参考区域的可用性验证请求信息，以确定基于所接收的可用性验证请求信息相对于参考区域的可用性，并且向核心发送所确定的可用性。当参考区域可用时，核心可以基于参考区域处理第二帧的解码。

8. 发明授权

US08624350B2 Semiconductor device and method of fabricating the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08624350B2
公开(公告)日：2014-01-07
申请号：US13243386
申请日：2011-09-23
申请人： Do Hyung Kim , Young Man Cho
发明人： Do Hyung Kim , Young Man Cho
IPC分类号： H01L21/70
CPC分类号： H01L27/10891 , H01L27/0207 , H01L27/10876 , H01L27/10885 , H01L29/4236
摘要： The invention relates to a semiconductor device, wherein a storage node contact hole is made large to solve any problem caused during etching a storage node contact hole with a small CD, a landing plug is formed to lower plug resistance. A semiconductor device according to the invention comprises: first and second active regions formed in a substrate, the first and second active being adjacent to each other, each of the first and second active regions including a bit-line contact region and a storage node contact region and a device isolation structure; a word line provided within a trench formed in the substrate; first and second storage node contact plugs assigned to the first and second active regions, respectively, the first and second storage node contact plugs being separated from each other by a bit line groove; and a bit line formed within the bit-line groove.
摘要翻译：本发明涉及一种半导体器件，其中存储节点接触孔较大以解决在用小CD刻蚀存储节点接触孔期间引起的任何问题，形成了降低插头电阻的着陆插头。根据本发明的半导体器件包括：形成在衬底中的第一和第二有源区，第一和第二有源层彼此相邻，第一和第二有源区域中的每一个包括位线接触区域和存储节点接触区域和器件隔离结构; 设置在形成在所述基板中的沟槽内的字线; 分别分配给第一和第二有源区域的第一和第二存储节点接触插塞，第一和第二存储节点接触插塞通过位线槽相互分离; 以及形成在位线槽内的位线。

9. 发明申请

US20130229292A1 APPARATUS AND METHOD FOR DECODING 有权
标题翻译：装置和解码方法
公开(公告)号：US20130229292A1
公开(公告)日：2013-09-05
申请号：US13586416
申请日：2012-08-15
申请人： Doo Hyun KIM , Do Hyung Kim , Shi Hwa Lee
发明人： Doo Hyun KIM , Do Hyung Kim , Shi Hwa Lee
IPC分类号： H03M7/40
CPC分类号： H03M7/425 , H03M7/4043 , H03M7/4062 , H04N19/91
摘要： A decoding apparatus and method store at least one table including at least one code, receive at least one instruction signal, and extract a symbol value and a symbol length from the at least one table based on the at least one instruction signal. The decoding apparatus calculates a target suffix length that minimizes the size of a generated table and minimizes the size of a non-prefix length of the at least one code.
摘要翻译：解码装置和方法存储至少一个表，该表至少包括一个代码，接收至少一个指令信号，以及基于至少一个指令信号从所述至少一个表提取符号值和符号长度。解码装置计算使生成的表的大小最小化的目标后缀长度，并且使至少一个代码的非前缀长度的大小最小化。

10. 发明申请

US20130177204A1 APPARATUS AND METHOD FOR TRACKING HAND 有权
标题翻译：跟踪手段和方法
公开(公告)号：US20130177204A1
公开(公告)日：2013-07-11
申请号：US13596523
申请日：2012-08-28
申请人： Woo Han YUN , Jae Yeon Lee , Do Hyung Kim , Jae Hong Kim , Joo Chan Sohn
发明人： Woo Han YUN , Jae Yeon Lee , Do Hyung Kim , Jae Hong Kim , Joo Chan Sohn
IPC分类号： G06K9/62
CPC分类号： G06K9/00355
摘要： Disclosed are an apparatus for tracking a location of a hand, includes: a skin color image detector for detecting a skin color region from an image input from an image device using a predetermined skin color of a user; a face tracker for tracking a face using the detected skin color image; a motion detector for setting a ROI using location information of the tracked face, and detecting a motion image from the set ROI; a candidate region extractor for extracting a candidate region with respect to a hand of the user using the skin color image detected by the skin color image detector and the motion image detected by the motion detector; and a hand tracker for tracking a location of the hand in the extracted candidate region to find out a final location of the hand.
摘要翻译：公开了一种用于跟踪手的位置的装置，包括：皮肤彩色图像检测器，用于使用用户的预定皮肤颜色从图像设备输入的图像中检测皮肤颜色区域; 面部跟踪器，用于使用检测到的肤色图像跟踪脸部; 运动检测器，用于使用所跟踪的面部的位置信息来设置ROI，以及从所设置的ROI检测运动图像; 候选区域提取器，用于使用由肤色图像检测器检测到的肤色图像和由运动检测器检测的运动图像提取相对于用户的手的候选区域; 以及用于跟踪所提取的候选区域中的手的位置以找出手的最终位置的手跟踪器。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式