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1. 发明申请

US20060289506A1 Apparatus and method for controlling cooling time of microwave oven 审中-公开
标题翻译：控制微波炉冷却时间的装置和方法
公开(公告)号：US20060289506A1
公开(公告)日：2006-12-28
申请号：US11304569
申请日：2005-12-16
申请人： Jong Shon , Won Lee , Geun Kim , So Lee , Kum Hwang
发明人： Jong Shon , Won Lee , Geun Kim , So Lee , Kum Hwang
IPC分类号： H05B6/50
CPC分类号： H05B6/6461 , H05B6/6458
摘要： An apparatus and method for controlling cooling time of a microwave oven that is capable of controlling an initial cooling time, which is given to secure stable operational characteristics of a sensor, when sensor-based automatic cooking is performed, thereby reducing total cooking time. The cooling time control method includes determining whether sensor-based automatic cooking is performed, when the sensor-based automatic cooking is performed, operating a cooling fan to perform cooling operation such that a sensor is cooled, sensing an output value of the sensor, when the cooling operation is performed, to calculate a change of the sensor output value, and comparing the calculated change of the sensor output value with a predetermined reference value, and, when the change of the sensor output value exceeds the predetermined reference value, controlling cooling time based on the change of the sensor output value.
摘要翻译：一种用于控制微波炉的冷却时间的装置和方法，所述微波炉的冷却时间能够控制初始冷却时间，当执行基于传感器的自动烹饪时，这确保了传感器的稳定操作特性，从而减少了总烹饪时间。冷却时间控制方法包括确定是否执行基于传感器的自动烹饪，当执行基于传感器的自动烹饪时，操作冷却风扇以执行冷却操作，使得传感器被冷却，感测传感器的输出值，当进行制冷运转，计算出传感器输出值的变化，将计算出的传感器输出值的变化与规定的基准值进行比较，当传感器输出值的变化超过规定的基准值时，控制冷却时间基于传感器输出值的变化。

2. 发明申请

US20080088953A1 Lens, manufacturing method thereof and light emitting device package using the same 有权
标题翻译：透镜及其制造方法以及使用其的发光器件封装
公开(公告)号：US20080088953A1
公开(公告)日：2008-04-17
申请号：US11902779
申请日：2007-09-25
申请人： Yong Kim , Hoon Hurh , Geun Kim , Yu Won
发明人： Yong Kim , Hoon Hurh , Geun Kim , Yu Won
IPC分类号： G02B7/02 , B29D11/00
CPC分类号： G02B7/022 , H01L33/483 , H01L33/54
摘要： A lens and a light emitting device package formed by introducing surface mount technology (SMT) are disclosed. The lens includes a refractive portion which refracts incident light, and at least one surface mount portion, wherein a portion of the surface mount portion is formed in the refractive portion.
摘要翻译：公开了通过引入表面贴装技术（SMT）形成的透镜和发光器件封装。透镜包括折射入射光的折射部分和至少一个表面安装部分，其中表面安装部分的一部分形成在折射部分中。

3. 发明申请

US20070080420A1 Submount substrate for mounting light emitting device and method of fabricating the same 有权
标题翻译：用于安装发光器件的底座基板及其制造方法
公开(公告)号：US20070080420A1
公开(公告)日：2007-04-12
申请号：US11633613
申请日：2006-12-05
申请人： Geun Kim , Chil Park
发明人： Geun Kim , Chil Park
IPC分类号： H01L31/00
CPC分类号： H01L25/167 , H01L2224/14 , H01L2924/0002 , H01L2924/3011 , Y10S438/942 , H01L2924/00
摘要： A submount substrate for mounting a light emitting device and a method of fabricating the same, wherein since a submount substrate for mouthing a light emitting device in which a Zener diode device is integrated can be fabricated by means of a silicon bulk micromachining process without using a diffusion mask, some steps of processes related to the diffusion mask can be eliminated to reduce the manufacturing costs, and wherein since a light emitting device can be flip-chip bonded directly to a submount substrate for a light emitting device in which a Zener diode device is integrated, a process of packaging the light emitting device and the voltage regulator device can be simplified.
摘要翻译：一种用于安装发光器件的副安装座基板及其制造方法，其特征在于，由于用于使齐纳二极管器件集成在其中的发光器件的吸嘴用底座基板可以通过硅体微加工工艺制造而不使用扩散掩模，可以消除与扩散掩模相关的一些工艺步骤以降低制造成本，并且其中由于发光器件可以直接倒装芯片贴合到用于发光器件的底座衬底，其中齐纳二极管器件是集成的，可以简化封装发光器件和电压调节器器件的过程。

4. 发明申请

US20080035942A1 Light emitting device package and method for manufacturing the same 审中-公开
标题翻译：发光器件封装及其制造方法
公开(公告)号：US20080035942A1
公开(公告)日：2008-02-14
申请号：US11890543
申请日：2007-08-07
申请人： Geun Kim , Yu Ho Won , Chil Keun Park , Ki Chang Song
发明人： Geun Kim , Yu Ho Won , Chil Keun Park , Ki Chang Song
IPC分类号： H01L33/00
CPC分类号： H01L33/505 , H01L24/97 , H01L33/486 , H01L2224/16225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/00 , H01L2224/81 , H01L2224/0401
摘要： A light emitting device package capable of emitting uniform white light and a method for manufacturing the same are disclosed. The light emitting device package includes a package body, an electrode formed on at least one surface of the package body, a light emitting device mounted on the package body, and a phosphor layer enclosing the light emitting device while having a uniform thickness around the light emitting device.
摘要翻译：公开了能够发出均匀的白光的发光器件封装及其制造方法。发光器件封装包括封装主体，形成在封装主体的至少一个表面上的电极，安装在封装主体上的发光器件以及围绕发光器件的发光器件周围均匀的荧光体层发光装置。

5. 发明申请

US20070019397A1 SURFACE LIGHT SOURCE DEVICE AND BACKLIGHT UNIT HAVING THE SAME 审中-公开
标题翻译：表面光源装置和具有该光源的背光单元
公开(公告)号：US20070019397A1
公开(公告)日：2007-01-25
申请号：US11457391
申请日：2006-07-13
申请人： Ho Chun , Seog Cho , Kyeong Jung , Kil Kim , Geun Kim
发明人： Ho Chun , Seog Cho , Kyeong Jung , Kil Kim , Geun Kim
IPC分类号： G09F13/04
CPC分类号： H01J61/305 , G02F1/133604 , H01J65/046
摘要： Provided are a surface light source device and a backlight unit having the same. The surface light source device includes a main body with a plurality of lighting parts, and at least one electrode disposed on the lighting parts for discharging, said electrode being shaped in a partially different dimension depending the temperature difference(Δt) in the lighting parts. The electrode compensates brightness uniformity lowering below a predetermined value due to the temperature difference(Δt).
摘要翻译：提供了一种表面光源装置和具有该光源装置的背光单元。表面光源装置包括具有多个照明部分的主体和设置在照明部分上用于放电的至少一个电极，所述电极根据照明部分中的温差（Deltat）以部分不同的尺寸成形。由于温差（Deltat），电极将亮度均匀性降低到预定值以下。

6. 发明申请

US20050274974A1 Zener diode and method for fabricating the same 审中-公开
标题翻译：齐纳二极管及其制造方法
公开(公告)号：US20050274974A1
公开(公告)日：2005-12-15
申请号：US11148291
申请日：2005-06-09
申请人： Geun Kim , Seung Lee
发明人： Geun Kim , Seung Lee
IPC分类号： H01L21/328 , H01L21/329 , H01L29/30 , H01L29/866 , H01L33/00
CPC分类号： H01L29/66106 , H01L21/2251 , H01L29/866
摘要： The present invention is directed to a Zener diode and a method for fabricating the same. According to the present invention, a voltage regulator device can be fabricated by carrying out a diffusion process without using a diffusion mask. Further, a PNP (or NPN) Zener diode having a bidirectional threshold voltage characteristic or a PN Zener diode can be fabricated without any photolithographic process or using the minimum number of processes. Therefore, the number of processing steps can be reduced and the yield thereof can be increased.
摘要翻译：本发明涉及齐纳二极管及其制造方法。根据本发明，可以通过在不使用扩散掩模的情况下进行扩散处理来制造电压调节器装置。此外，可以制造具有双向阈值电压特性的PNP（或NPN）齐纳二极管或PN齐纳二极管，而无需任何光刻工艺或使用最少数量的工艺。因此，可以减少处理步骤的数量并且可以提高其收率。

7. 发明申请

US20070200131A1 Light emitting device package and method of manufacturing the same 有权
标题翻译：发光器件封装及其制造方法
公开(公告)号：US20070200131A1
公开(公告)日：2007-08-30
申请号：US11707140
申请日：2007-02-16
申请人： Geun Kim
发明人： Geun Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L25/167 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00012
摘要： A light emitting device package and a method of manufacturing the same are disclosed. The light emitting device package includes a package structure, two diffusion layers formed on the package structure such that the two diffusion layers are electrically separated from each other, and first and second electrodes insulated from the package structure by an insulation film. The first and second electrodes are electrically connected with the two diffusion layers, respectively.
摘要翻译：公开了一种发光器件封装及其制造方法。发光器件封装包括封装结构，形成在封装结构上的两个扩散层，使得两个扩散层彼此电分离，以及通过绝缘膜与封装结构绝缘的第一和第二电极。第一和第二电极分别与两个扩散层电连接。

8. 发明申请

US20060261292A1 Light emitting device package and method for manufacturing the same 有权
标题翻译：发光器件封装及其制造方法
公开(公告)号：US20060261292A1
公开(公告)日：2006-11-23
申请号：US11434507
申请日：2006-05-16
申请人： Geun Kim , Seung Lee
发明人： Geun Kim , Seung Lee
IPC分类号： H01L33/00 , G02B27/00
CPC分类号： H01L33/62 , H01L24/24 , H01L24/48 , H01L24/82 , H01L33/44 , H01L33/507 , H01L33/508 , H01L33/54 , H01L2224/05155 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/73265 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2224/8592 , H01L2224/92244 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2924/20752 , H01L2924/3025 , H01L2924/00 , H01L2224/45099
摘要： The present invention relates to a light emitting device package and a method for manufacturing the same. The present invention has advantages in that a light emitting device is electrically connected to other devices without use of wire bonding, thereby saving a space for wire bonding and reducing the size of a package.
摘要翻译：本发明涉及一种发光器件封装及其制造方法。本发明的优点在于，发光器件与其他器件电连接而不使用引线接合，从而节省了引线接合的空间并减小了封装的尺寸。

9. 发明申请

US20060192295A1 Semiconductor package flip chip interconnect having spacer 有权
标题翻译：具有间隔件的半导体封装倒装芯片互连
公开(公告)号：US20060192295A1
公开(公告)日：2006-08-31
申请号：US11282293
申请日：2005-11-17
申请人： Jae Lee , Geun Kim , Sheila Alvarez , Robinson Quiazon , Hin Goh , Frederick Dahilig
发明人： Jae Lee , Geun Kim , Sheila Alvarez , Robinson Quiazon , Hin Goh , Frederick Dahilig
IPC分类号： H01L23/48 , H01L21/48
CPC分类号： H01L23/49513 , H01L23/16 , H01L23/3107 , H01L23/4952 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/0401 , H01L2224/0603 , H01L2224/06505 , H01L2224/10165 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13144 , H01L2224/136 , H01L2224/1403 , H01L2224/14505 , H01L2224/16 , H01L2224/16245 , H01L2224/81136 , H01L2224/8114 , H01L2224/81193 , H01L2224/81801 , H01L2924/01027 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A flip chip lead frame package includes a die and a lead frame having a die paddle and leads, and has a spacer to maintain a separation between the die and the die paddle. Also, methods for making the package are disclosed.
摘要翻译：倒装芯片引线框架封装包括管芯和具有管芯焊盘和引线的引线框架，并且具有间隔件以保持管芯和管芯焊盘之间的间隔。此外，公开了制造包装的方法。

10. 发明申请

US20060192274A1 Semiconductor package having double layer leadframe 有权
公开(公告)号：US20060192274A1
公开(公告)日：2006-08-31
申请号：US11274925
申请日：2005-11-14
申请人： Jason Lee , Geun Kim
发明人： Jason Lee , Geun Kim
IPC分类号： H01L23/495
CPC分类号： H01L23/49537 , H01L21/561 , H01L23/3107 , H01L23/49548 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L24/97 , H01L2224/32245 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48465 , H01L2224/4943 , H01L2224/73265 , H01L2224/85 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/0106 , H01L2924/01078 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2224/83 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A leadframe chip scale package includes a double leadframe assembly. The first leadframe has a central die paddle and peripheral leads, and the second leadframe, superimposed over the first leadframe in the package, has peripheral leads. The peripheral leads of both leadframes are situated in at least one row along an edge of the package, and in some embodiments in a row along each of the four edges of the package. The leads are patterned such that when the second leadframe is superimposed over the first leadframe, the leads do not contact each other; in a plan view, the leads of the first leadframe appear to be interdigitated with the leads of the second leadframe. The input/output contact portions of the first leadframe are exposed in a row of first contacts near or, usually, at the edge of the package, and the input/output contact portions of the second leadframe are exposed in a row of second contacts inboard from the row of first contacts. The contacts in the second row are staggered in relation to the contacts in the first row. Also, methods for making the package include providing a first leadframe having a die paddle and leads; providing a second leadframe having leads; providing an adhesive on a surface of one of the leadframes; aligning the leadframes (the second leadframe over the first leadframe); adhering the leadframes at the adhesive; wire bonding to connect the die to the double leadframe by connecting alternate pads on the die (1st, 3rd, 5th, etc.) with bond sites on one of the leadframes and by connecting the other pads on the die (2nd, 4th, 6th, etc.) with bond sites on the other one of the leadframes; encapsulating; and singulating. The invention provides for nearly double the number of input/output contacts as can be made in a conventional leadframe package, made using similar processes and design rules.

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