专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US6153141A Semiconductor packaging method 失效
标题翻译：半导体封装方法
公开(公告)号：US6153141A
公开(公告)日：2000-11-28
申请号：US155881
申请日：1993-11-23
申请人： Jong Kyung Kim , Dong Jin Moak , Chang Hun Hyum , Chul Huh
发明人： Jong Kyung Kim , Dong Jin Moak , Chang Hun Hyum , Chul Huh
IPC分类号： B29C31/04 , B29C45/02 , H01L21/56 , B29C31/08 , B29C33/02
CPC分类号： B29C31/041 , B29C45/02 , H01L21/56 , H01L2924/0002
摘要： A container (10), which holds a molding material (12), is attached to a mold. The molding material passes from the container to the mold through an orifice (18) during the molding process. The container is gradiently heated with the hottest part of the container near the orifice, the heat gradually decreasing towards the opposite end of the container. The hotter molding material deforms faster than the cooler material and as the plastic is forced into the mold, the air escapes past the molding material along the container walls in the direction of the cooler material. A mechanism (16), preferably a narrow ram having a slightly conical shape (22), forces the molding material into the mold. The conical shape allows the air to pass by the mechanism out the end of the container opposite the orifice.
摘要翻译：将保持成型材料（12）的容器（10）附接到模具。成型材料在模制过程中通过孔口（18）从容器通过模具。容器与容器的最热部分靠近孔口进行梯度加热，热量朝着容器的相对端逐渐减小。较热的成型材料比较冷的材料变得更快，当塑料被迫进入模具时，空气沿冷却器材料的方向沿容器壁逸出模制材料。机构（16）优选地具有略微圆锥形状（22）的窄柱塞迫使模制材料进入模具。锥形形状允许空气通过机构从与孔相对的容器的端部出来。

IPRDB

热门服务

关于我们

友情链接

联系方式