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    • 4. 发明申请
    • WAFER TESTING SYSTEMS AND ASSOCIATED METHODS OF USE AND MANUFACTURE
    • 测试系统和相关的使用和制造方法
    • US20120074976A1
    • 2012-03-29
    • US13247981
    • 2011-09-28
    • Aaron DurbinDavid KeithMorgan T. Johnson
    • Aaron DurbinDavid KeithMorgan T. Johnson
    • G01R31/20
    • G01R1/07378G01R1/04G01R1/0408G01R1/0491G01R31/2601G01R31/2607G01R31/2886G01R31/2889
    • A wafer testing system and associated methods of use and manufacture are disclosed herein. In one embodiment, the wafer testing system includes an assembly for releaseably attaching a wafer to a wafer translator and the wafer translator to an interposer by means of separately operable vacuums, or pressure differentials. The assembly includes a wafer translator support ring coupled to the wafer translator, wherein a first flexible material extends from the wafer translator support ring so as to enclose the space between the wafer translator and the interposer so that the space may be evacuated by a first vacuum through one or more first evacuation paths. The assembly can further include a wafer support ring coupled to the wafer and the chuck, wherein a second flexible material extends from wafer support ring so as to enclose the space between the wafer and the wafer translator so that the space may be evacuated by a second vacuum through one or more second evacuation pathways.
    • 本文公开了晶片测试系统及其相关的使用和制造方法。 在一个实施例中,晶片测试系统包括用于通过单独可操作的真空或压力差将晶片可释放地附接到晶片转换器和晶片转换器到组件。 组件包括耦合到晶片转换器的晶片转换器支撑环,其中第一柔性材料从晶片转换器支撑环延伸,以便包围晶片转换器和插入器之间的空间,使得空间可以被第一真空抽真空 通过一个或多个第一疏散路径。 组件还可以包括耦合到晶片和卡盘的晶片支撑环,其中第二柔性材料从晶片支撑环延伸,以便包围晶片和晶片转换器之间的空间,使得空间可被第二个 通过一个或多个第二排空路径进行真空。
    • 9. 发明授权
    • Method and apparatus for opening a zipper after it has been spot sealed
    • 点焊后打开拉链的方法和装置
    • US5873969A
    • 1999-02-23
    • US916119
    • 1997-08-22
    • David KeithThomas P. O'Connor
    • David KeithThomas P. O'Connor
    • B31B19/90B32B7/04B29C47/00
    • B31B19/00B31B2219/9016Y10T156/1067Y10T156/12
    • A method and apparatus for manufacturing recloseable plastic bags with engageable mating profiles where the bags are provided open for the consumer. The profiles are initially provided in the fully engaged condition within an elongate, longitudinally cut tube. The profiles are then periodically fused, tacked, or attached together at the approximate locations where the tube is to be cut into bags. Upon tacking, the profiles are pulled apart by frictionally engaging an area on the outside of the film, near the profiles, and between the tacks. The film is then forced away from the profiles, which at least partially pulls one profile from the other. Thereafter, the tube may be cut and sealed into bags as would otherwise normally occur.
    • 一种用于制造可接合的塑料袋的方法和装置,其具有可接合的配合型材,其中为消费者提供袋。 型材最初在完全接合的状态下设置在细长的纵向切割的管内。 然后将轮廓在管被切割成袋的大致位置周期性地熔合,粘合或附着在一起。 在紧固时,轮廓通过摩擦地接合胶片外部的区域,轮廓附近以及在两个间隙之间被拉开。 然后,该胶片被迫离开轮廓,其至少部分地从另一个轮廓拉出一个轮廓。 此后,可以将管切割并密封成袋,否则通常会发生。
    • 10. 发明授权
    • Wafer testing systems and associated methods of use and manufacture
    • 晶圆测试系统及相关使用和制造方法
    • US08405414B2
    • 2013-03-26
    • US13247981
    • 2011-09-28
    • Aaron DurbinDavid KeithMorgan T. Johnson
    • Aaron DurbinDavid KeithMorgan T. Johnson
    • G01R31/20
    • G01R1/07378G01R1/04G01R1/0408G01R1/0491G01R31/2601G01R31/2607G01R31/2886G01R31/2889
    • A wafer testing system and associated methods of use and manufacture are disclosed herein. In one embodiment, the wafer testing system includes an assembly for releaseably attaching a wafer to a wafer translator and the wafer translator to an interposer by means of separately operable vacuums, or pressure differentials. The assembly includes a wafer translator support ring coupled to the wafer translator, wherein a first flexible material extends from the wafer translator support ring so as to enclose the space between the wafer translator and the interposer so that the space may be evacuated by a first vacuum through one or more first evacuation paths. The assembly can further include a wafer support ring coupled to the wafer and the chuck, wherein a second flexible material extends from wafer support ring so as to enclose the space between the wafer and the wafer translator so that the space may be evacuated by a second vacuum through one or more second evacuation pathways.
    • 本文公开了晶片测试系统及其相关的使用和制造方法。 在一个实施例中,晶片测试系统包括用于通过单独可操作的真空或压力差将晶片可释放地附接到晶片转换器和晶片转换器到组件。 组件包括耦合到晶片转换器的晶片转换器支撑环,其中第一柔性材料从晶片转换器支撑环延伸,以便包围晶片转换器和插入器之间的空间,使得空间可以被第一真空抽真空 通过一个或多个第一疏散路径。 组件还可以包括耦合到晶片和卡盘的晶片支撑环,其中第二柔性材料从晶片支撑环延伸,以便包围晶片和晶片转换器之间的空间,使得空间可被第二个 通过一个或多个第二排空路径进行真空。