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1. 发明授权

US06423174B1 Apparatus and insertless method for forming cavity substrates using coated membrane 失效
标题翻译：使用涂覆膜形成腔体衬底的装置和无插入方法
公开(公告)号：US06423174B1
公开(公告)日：2002-07-23
申请号：US08668291
申请日：1996-06-21
申请人： Jon A. Casey , Govindarajan Natarajan , Robert W. Pasco , Vincent P. Peterson
发明人： Jon A. Casey , Govindarajan Natarajan , Robert W. Pasco , Vincent P. Peterson
IPC分类号： B32B3120
CPC分类号： B32B18/00 , B32B37/0023 , B32B2038/042 , B32B2309/12 , B32B2315/02 , C04B35/10 , C04B35/581 , C04B35/6455 , C04B2235/658 , C04B2237/343 , C04B2237/366 , C04B2237/62 , C04B2237/64 , H01L21/4807
摘要： The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavities in semiconductor substrates wherein a coated membrane sheet is placed over the cavity prior to lamination and caused to conform to the contour of the cavity, thus preventing collapse of, or damage to, the cavity shelves during the lamination process. After the lamination process, the coated membrane is conveniently removed without causing damage to the cavity shelves or paste pull-outs.
摘要翻译：本发明一般涉及一种用于在半导体衬底中形成空腔的新装置和方法，而不需要使用插入件。更具体地，本发明包括一种用于在半导体衬底中制造空腔的装置和方法，其中在层压之前将涂覆的膜片放置在空腔上方并使其符合空腔的轮廓，从而防止凹陷或损坏，层压过程中的腔架。在层压处理之后，方便地去除涂覆的膜，而不会损坏腔架或糊状物拉出。

2. 发明授权

US5759320A Method of forming cavity substrates using compressive pads 失效
标题翻译：使用压缩垫形成空腔基板的方法
公开(公告)号：US5759320A
公开(公告)日：1998-06-02
申请号：US834302
申请日：1997-04-13
申请人： Govindarajan Natarajan , Robert W. Pasco , Charles H. Perry , Vincent P. Peterson
发明人： Govindarajan Natarajan , Robert W. Pasco , Charles H. Perry , Vincent P. Peterson
IPC分类号： H01L21/48 , B32B31/20
CPC分类号： B32B37/26 , B32B37/0023 , H01L21/4807 , Y10T156/10
摘要： The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavities in semiconductor substrates wherein a cured thick compressible elastic pad is placed over the cavity prior to lamination and caused to conform to the contour of the cavity, thus preventing collapse of, or damage to, the cavity shelves or corners during the lamination process. After the lamination process, the cured thick compressible elastic pad is conveniently removed from the cavity area without causing any damage to the cavity shelves or corners or having any paste pull-outs. This pad can be reused multiple number of times to form these MLC cavity substrates.
摘要翻译：本发明一般涉及一种用于在半导体衬底中形成空腔的新装置和方法，而不需要使用插入件。更具体地说，本发明包括一种用于在半导体衬底中制造空腔的装置和方法，其中在层压之前将固化的厚的可压缩弹性垫放置在空腔上方并使其符合空腔的轮廓，从而防止破坏或损坏到层压过程中的腔架或角落。在层压处理之后，固化的厚的可压缩弹性垫可以方便地从空腔区域移除，而不会对腔架或角落造成任何损坏或具有任何糊状物抽出。该垫可以重复使用多次以形成这些MLC空腔衬底。

3. 发明授权

US06562169B2 Multi-level web structure in use for thin sheet processing 失效
标题翻译：用于薄板加工的多层网状结构
公开(公告)号：US06562169B2
公开(公告)日：2003-05-13
申请号：US09765027
申请日：2001-01-17
申请人： Govindarajan Natarajan , Raschid J. Bezama , Jon A. Casey , Amy C. Flack , Robert W. Pasco , Arnold W. Terpening , Renee L. Weisman
发明人： Govindarajan Natarajan , Raschid J. Bezama , Jon A. Casey , Amy C. Flack , Robert W. Pasco , Arnold W. Terpening , Renee L. Weisman
IPC分类号： B32B3118
CPC分类号： B32B18/00 , C04B2235/6562 , C04B2237/068 , C04B2237/122 , C04B2237/123 , C04B2237/366 , H05K1/0306 , H05K3/4611 , H05K3/4629 , Y10T156/1056 , Y10T156/1057
摘要： A method of processing greensheets, wherein the following steps are performed: a) providing a greensheet having a width, length, thickness, a first side and a second side; b) bonding to the first side of the greensheet at least one strip, wherein the strip lies in a first plane; c) bonding to the second side of the green sheet at least one strip, wherein the strip lies in a second plane; d) processing the greensheet; and e) removing the strips from the processed greensheet.
摘要翻译：一种处理毛坯的方法，其中执行以下步骤：a）提供具有宽度，长度，厚度，第一侧面和第二侧面的毛坯; b）将至少一个条带结合到毛坯的第一侧，其中所述条带位于第一平面中; c）将至少一个条带连接到所述生片的第二侧，其中所述条位于第二平面中; d）处理所述毛坯; 从处理过的毛坯上去除条带。

4. 发明授权

US5788808A Apparatus for forming cavity substrates using compressive pads 失效
标题翻译：用于使用压缩垫形成腔体衬底的装置
公开(公告)号：US5788808A
公开(公告)日：1998-08-04
申请号：US834304
申请日：1997-04-15
申请人： Govindarajan Natarajan , Robert W. Pasco , Charles H. Perry , Vincent P. Peterson
发明人： Govindarajan Natarajan , Robert W. Pasco , Charles H. Perry , Vincent P. Peterson
IPC分类号： H01L21/48 , B32B31/20
CPC分类号： B32B37/0023 , B32B37/26 , H01L21/4807 , B32B2315/02 , H01L2924/15787
摘要： The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavities in semiconductor substrates wherein a cured thick compressible elastic pad is placed over the cavity prior to lamination and caused to conform to the contour of the cavity, thus preventing collapse of, or damage to, the cavity shelves or corners during the lamination process. After the lamination process, the cured thick compressible elastic pad is conveniently removed from the cavity area without causing any damage to the cavity shelves or corners or having any paste pull-outs. This pad can be reused multiple number of times to form these MLC cavity substrates.
摘要翻译：本发明一般涉及一种用于在半导体衬底中形成空腔的新装置和方法，而不需要使用插入件。更具体地说，本发明包括一种用于在半导体衬底中制造空腔的装置和方法，其中在层压之前将固化的厚的可压缩弹性垫放置在空腔上方并使其符合空腔的轮廓，从而防止破坏或损坏到层压过程中的腔架或角落。在层压处理之后，固化的厚的可压缩弹性垫可以方便地从空腔区域移除，而不会对腔架或角落造成任何损坏或具有任何糊状物抽出。该垫可以重复使用多次以形成这些MLC空腔衬底。

5. 发明授权

US06607780B1 Process of forming a ceramic structure using a support sheet 失效
标题翻译：使用支撑片形成陶瓷结构的工艺
公开(公告)号：US06607780B1
公开(公告)日：2003-08-19
申请号：US09578580
申请日：2000-05-25
申请人： Govindarajan Natarajan , John U. Knickerbocker , Robert W. Pasco
发明人： Govindarajan Natarajan , John U. Knickerbocker , Robert W. Pasco
IPC分类号： B05D512
CPC分类号： H01L21/486 , H05K1/0306 , H05K3/4061 , H05K3/4614 , H05K3/4629 , H05K2201/09581 , H05K2203/0152 , H05K2203/0156 , Y10T29/49126 , Y10T156/1057 , Y10T428/24917 , Y10T428/24926
摘要： The present invention relates generally to a new ceramic structure and process thereof. Basically, the present invention relates to a structure and method for forming laminated structures and more particularly to a structure and method for fabricating multi-layer ceramic products using very thin green sheets and/or green sheets with very dense electrically conductive patterns on top of a stronger support sheet. The structure and method of the present invention enables the screening, stacking and handling of very thin green sheets and/or green sheets with very dense metallized patterns in the manufacture of multi-layer ceramic packages. The thin green sheets were tacked/bonded to thicker and stronger support sheets to form a sub-structure which had excellent stability in screening and enabled further processing. The sheets are anchored or pinned in such a way as to allow the processing of the green sheet with the subsequent easy removal of the support sheet.
摘要翻译：本发明一般涉及一种新的陶瓷结构及其工艺。基本上，本发明涉及一种用于形成层压结构的结构和方法，更具体地涉及一种使用非常薄的生坯片和/或具有非常致密导电图案的生片在多层陶瓷产品的顶部制造多层陶瓷产品的结构和方法更强的支撑板。本发明的结构和方法能够在制造多层陶瓷封装中筛选，堆叠和处理具有非常密集金属化图案的非常薄的生片和/或生片。薄的生片被粘合到较厚和更坚固的支撑片上以形成在筛选中具有优异稳定性并能够进一步加工的亚结构。这些片材以这样的方式锚定或固定，以便随后可以容易地移除支撑片材来处理生片。

6. 发明授权

US06726984B2 Ceramic structure using a support sheet 有权
标题翻译：陶瓷结构使用支撑片
公开(公告)号：US06726984B2
公开(公告)日：2004-04-27
申请号：US10403239
申请日：2003-03-28
申请人： Govindarajan Natarajan , John U. Knickerbocker , Robert W. Pasco
发明人： Govindarajan Natarajan , John U. Knickerbocker , Robert W. Pasco
IPC分类号： B32B300
CPC分类号： H01L21/486 , H05K1/0306 , H05K3/4061 , H05K3/4614 , H05K3/4629 , H05K2201/09581 , H05K2203/0152 , H05K2203/0156 , Y10T29/49126 , Y10T156/1057 , Y10T428/24917 , Y10T428/24926
摘要： The present invention relates generally to a new ceramic structure and process thereof. Basically, the present invention relates to a structure and method for forming laminated structures and more particularly to a structure and method for fabricating multi-layer ceramic products using very thin green sheets and/or green sheets with very dense electrically conductive patterns on top of a stronger support sheet. The structure and method of the present invention enables the screening, stacking and handling of very thin green sheets and/or green sheets with very dense metallized patterns in the manufacture of multi-layer ceramic packages. The thin green sheets were tacked/bonded to thicker and stronger support sheets to form a sub-structure which had excellent stability in screening and enabled further processing. The sheets are anchored or pinned in such a way as to allow the processing of the green sheet with the subsequent easy removal of the support sheet.
摘要翻译：本发明一般涉及一种新的陶瓷结构及其工艺。基本上，本发明涉及一种用于形成层压结构的结构和方法，更具体地涉及一种使用非常薄的生坯片和/或具有非常致密导电图案的生片在多层陶瓷产品的顶部制造多层陶瓷产品的结构和方法更强的支撑板。本发明的结构和方法能够在多层陶瓷封装的制造中筛选，堆叠和处理非常薄的生片和/或具有非常密集金属化图案的生片。薄的生片被粘合到较厚和更坚固的支撑片上以形成在筛选中具有优异稳定性并能够进一步加工的亚结构。这些片材以这样的方式锚定或固定，以便随后可以容易地移除支撑片材来处理生片。

7. 发明授权

US06395337B1 Substrate with ceramic coating for camber modification and method for making 失效
标题翻译：具有陶瓷涂层的基体用于外观修改和制造方法
公开(公告)号：US06395337B1
公开(公告)日：2002-05-28
申请号：US09364845
申请日：1999-07-30
申请人： Raschid J. Bezama , Govindarajan Natarajan , Robert W. Pasco
发明人： Raschid J. Bezama , Govindarajan Natarajan , Robert W. Pasco
IPC分类号： B05D302
CPC分类号： B32B18/00 , C04B35/10 , C04B35/581 , C04B41/009 , C04B41/5022 , C04B41/86 , C04B2111/00844 , C04B2237/064 , C04B2237/341 , C04B2237/343 , C04B2237/366 , C04B2237/564 , H01L21/481 , H05K1/0306 , H05K3/4629 , C04B41/4539 , C04B41/4578
摘要： A multilayer ceramic substrate contains a ceramic coating which is different in composition than the main body of the multilayer ceramic substrate to control camber of the multilayer ceramic substrate during sintering. The primary component of the ceramic coating is a secondary component of the main body of the multilayer ceramic substrate.
摘要翻译：多层陶瓷基板包含与多层陶瓷基板的主体不同的陶瓷涂层，以在烧结期间控制多层陶瓷基板的弯度。陶瓷涂层的主要成分是多层陶瓷基体的主体的次要成分。

8. 发明授权

US06319554B1 Method and apparatus for surface metallization 失效
标题翻译：表面金属化方法和装置
公开(公告)号：US06319554B1
公开(公告)日：2001-11-20
申请号：US09329893
申请日：1999-06-10
申请人： Govindarajan Natarajan , Robert W. Pasco
发明人： Govindarajan Natarajan , Robert W. Pasco
IPC分类号： C23C1608
CPC分类号： H05K3/24 , C23C16/08 , C23C16/44
摘要： The present invention relates generally to a CVD (Chemical Vapor Deposition) process where at least one source metal, such as, nickel (Ni) or alloys thereof, for example, Ni/Cu, Ni/Co, are deposited on metal surfaces which are capable of receiving the source metal, such as, refractory metal, for example, molybdenum, tungsten or alloys thereof, using at least one gaseous Iodide source, such as, an iodic fluid, for example, hydriodic acid gas. The source metal is securely held in place by at least one high strength inert material. The CVD of nickel or alloys thereof, on the surface of refractory metal, such as, molybdenum (Mo) or tungsten (W), where the nickel source is physically isolated from the refractory metal surface to be plated using at least one high strength inert material that is in physical floating contact with the refractory metal surface that needs to be coated with at least one layer of nickel or alloy thereof, and where the nickel source and the high strength inert material are embodied as a single bonded structure.
摘要翻译：本发明一般涉及一种CVD（化学气相沉积）方法，其中至少一种源金属例如镍（Ni）或其合金，例如Ni / Cu，Ni / Co沉积在金属表面上，能够使用至少一种碘化物源（例如碘酸液体，例如氢碘酸气体）接收源金属，例如难熔金属，例如钼，钨或其合金。源金属通过至少一种高强度惰性材料牢固地保持在适当位置。在难熔金属表面，例如钼（Mo）或钨（W）的镍或其合金的CVD，其中镍源使用至少一种高强度惰性物质从要镀覆的难熔金属表面物理隔离与需要涂覆有至少一层镍或其合金的难熔金属表面物理浮动接触的材料，以及其中镍源和高强度惰性材料被实施为单一结合结构的材料。

9. 发明授权

US06509687B1 Metal/dielectric laminate with electrodes and process thereof 失效
标题翻译：具有电极的金属/电介质层压板及其工艺
公开(公告)号：US06509687B1
公开(公告)日：2003-01-21
申请号：US09450530
申请日：1999-11-30
申请人： Govindarajan Natarajan , Raschid J. Bezama , John U. Knickerbocker , Robert W. Pasco
发明人： Govindarajan Natarajan , Raschid J. Bezama , John U. Knickerbocker , Robert W. Pasco
IPC分类号： H01J2964
CPC分类号： H01J29/467 , H01J31/127
摘要： The present invention relates generally to a new electrode forming metal/magnetic-ceramic laminate with through-holes and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area ceramic laminate magnet with a significant number of holes, integrated metal plate(s) and co-sintered electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display (MMD), and electron beam source, and methods of manufacture thereof.
摘要翻译：本发明一般涉及具有通孔的新型电极形成金属/磁陶瓷层压体及其工艺。更具体地，本发明包括用于制造具有大量孔的大面积陶瓷层压体磁体的新方法，用于电子和电子束控制的集成金属板和共烧结电极。本发明还涉及磁矩阵显示器（MMD）和电子束源，及其制造方法。

10. 发明授权

US06332782B1 Spatial transformation interposer for electronic packaging 失效
标题翻译：电子封装空间转换插件
公开(公告)号：US06332782B1
公开(公告)日：2001-12-25
申请号：US09597919
申请日：2000-06-19
申请人： Raschid J. Bezama , Govindarajan Natarajan , Robert W. Pasco
发明人： Raschid J. Bezama , Govindarajan Natarajan , Robert W. Pasco
IPC分类号： H01R1200
CPC分类号： H05K1/141 , H01L2224/16225 , H01L2924/15174 , H01L2924/15311 , H01R13/24 , H05K1/113 , H05K3/3436 , H05K3/368 , H05K7/1061 , H05K2201/049 , H05K2201/09836 , H05K2201/10378 , H05K2201/10734
摘要： An interconnect substrate structure for electrical interconnection between two electronic modules having differing conductive array parameters. The interconnect structure comprises an interposer having a top surface and a bottom surface; a first set of conductive arrays having a first conductive array parameter on the top surface, and a second set of conductive arrays having a second conductive array parameter on the bottom surface, the second conductive array and the first conductive array having differing parameters. A plurality of conductors traverses a thickness of the interposer, with the conductors comprising a conductive material optionally coated with a dielectric material, the conductors having a first end at the first conductive arrays and a second end at the second conductive arrays, whereby the conductors connecting the first and second conductive arrays therein are adapted to spatially transform the differing parameters to provide an electrical interconnection. A conductive matrix surrounds the conductors. The first set of conductive arrays comprise the same conductive array parameters as a first electronic module and the second set of conductive arrays comprise the same conductive array parameters as a second electronic module.
摘要翻译：一种互连衬底结构，用于具有不同导电阵列参数的两个电子模块之间的电互连。互连结构包括具有顶表面和底表面的插入件; 具有在顶表面上具有第一导电阵列参数的第一组导电阵列和在底表面上具有第二导电阵列参数的第二组导电阵列，所述第二导电阵列和第一导电阵列具有不同的参数。多个导体横穿插入件的厚度，导体包括任选地涂覆有电介质材料的导电材料，导体在第一导电阵列处具有第一端，在第二导电阵列处具有第二端，由此导体连接其中的第一和第二导电阵列适于空间转换不同的参数以提供电互连。导电矩阵围绕导体。第一组导电阵列包括与第一电子模块相同的导电阵列参数，并且第二组导电阵列包括与第二电子模块相同的导电阵列参数。

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