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1. 发明授权

US07972875B2 Optical systems fabricated by printing-based assembly 有权
标题翻译：基于印刷的组装制造的光学系统
公开(公告)号：US07972875B2
公开(公告)日：2011-07-05
申请号：US11981380
申请日：2007-10-31
申请人： John Rogers , Ralph Nuzzo , Matthew Meitl , Etienne Menard , Alfred J. Baca , Michael Motala , Jong-Hyun Ahn , Sang-II Park , Chang-Jae Yu , Heung-Cho Ko , Mark Stoykovich , Jongseung Yoon
发明人： John Rogers , Ralph Nuzzo , Matthew Meitl , Etienne Menard , Alfred J. Baca , Michael Motala , Jong-Hyun Ahn , Sang-II Park , Chang-Jae Yu , Heung-Cho Ko , Mark Stoykovich , Jongseung Yoon
IPC分类号： H01L21/00
CPC分类号： H01L25/50 , B81C2201/0185 , B82Y10/00 , H01L21/00 , H01L25/042 , H01L25/0753 , H01L25/167 , H01L27/1214 , H01L27/124 , H01L27/1285 , H01L27/1292 , H01L27/14627 , H01L27/14636 , H01L27/14643 , H01L29/78603 , H01L29/78681 , H01L31/02005 , H01L31/02008 , H01L31/02168 , H01L31/02325 , H01L31/02327 , H01L31/0288 , H01L31/03046 , H01L31/043 , H01L31/0525 , H01L31/0543 , H01L31/0547 , H01L31/0693 , H01L31/0725 , H01L31/167 , H01L31/1804 , H01L31/1824 , H01L31/1868 , H01L31/1876 , H01L31/1892 , H01L33/005 , H01L33/0079 , H01L33/06 , H01L33/30 , H01L33/483 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/62 , H01L2924/0002 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2933/0091 , H01S5/021 , H01S5/02284 , H01S5/183 , H01S5/3013 , H01S5/34326 , H01S5/423 , Y02E10/52 , Y02E10/547 , Y02P70/521 , H01L2924/00
摘要： Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.
摘要翻译：提供了至少部分地通过基于印刷的组装和器件部件的集成制造的光学器件和系统。在具体实施方案中，本发明提供包括大面积高性能宏电子器件的可印刷半导体元件的发光系统，光收集系统，光感测系统和光伏系统。本发明的光学系统包括通过印刷技术组装，组织和/或与其它器件部件集成的半导体元件，所述打印技术表现出与使用常规高温处理方法制造的基于单晶半导体的器件相似的性能特征和功能。本发明的光学系统具有通过提供一系列有用的装置功能的打印所访问的装置几何形状和构造，例如形状因子，部件密度和部件位置。本发明的光学系统包括表现出一系列有用的物理和机械性能的装置和装置阵列，包括灵活性，可塑性，适形性和可拉伸性。

2. 发明申请

US20080055581A1 DEVICES AND METHODS FOR PATTERN GENERATION BY INK LITHOGRAPHY 审中-公开
标题翻译：用于图形生成的设备和方法
公开(公告)号：US20080055581A1
公开(公告)日：2008-03-06
申请号：US11675659
申请日：2007-02-16
申请人： John Rogers , Etienne Menard
发明人： John Rogers , Etienne Menard
IPC分类号： G03B27/04 , G03C5/00
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00 , G03F1/50 , H01L51/0017
摘要： The present invention provides methods, devices and device components for fabricating patterns on substrate surfaces, particularly patterns comprising structures having microsized and/or nanosized features of selected lengths in one, two or three dimensions and including relief and recess features with variable height, depth or height and depth. Composite patterning devices comprising a plurality of polymer layers each having selected mechanical and thermal properties and physical dimensions provide high resolution patterning on a variety of substrate surfaces and surface morphologies. Gray-scale ink lithography photomasks for gray-scale pattern generation or molds for generating embossed relief features on a substrate surface are provided. The particular shape of the fabricated patterned can be manipulated by varying the three-dimensional recess pattern on an elastomeric patterning device which is brought into conformal contact with a substrate to localize patterning agent to the recess portion of the pattern.
摘要翻译：本发明提供了用于在衬底表面上制造图案的方法，装置和器件部件，特别是包括具有一维，两维或三维中选定长度的微尺寸和/或纳米尺寸特征的结构的图案，并且包括具有可变高度，深度的浮雕和凹陷特征高度和深度。包括多个具有选择的机械和热性质和物理尺寸的聚合物层的复合图案形成装置在各种基底表面和表面形态上提供高分辨率图案。提供用于灰度图案生成的灰度级油墨光刻光掩模或用于在基板表面上产生浮雕浮雕特征的模具。所制造的图案的特定形状可以通过改变弹性体图案形成装置上的三维凹陷图案来进行操作，所述弹性图案形成装置与衬底形成保形接触以将图案化剂定位到图案的凹部。

3. 发明授权

US08722458B2 Optical systems fabricated by printing-based assembly 有权
标题翻译：基于印刷的组装制造的光学系统
公开(公告)号：US08722458B2
公开(公告)日：2014-05-13
申请号：US13100774
申请日：2011-05-04
申请人： John Rogers , Ralph Nuzzo , Matthew Meitl , Etienne Menard , Alfred J. Baca , Michael Motala , Jong-Hyun Ahn , Sang-Il Park , Chang-Jae Yu , Heung Cho Ko , Mark Stoykovich , Jongseung Yoon
发明人： John Rogers , Ralph Nuzzo , Matthew Meitl , Etienne Menard , Alfred J. Baca , Michael Motala , Jong-Hyun Ahn , Sang-Il Park , Chang-Jae Yu , Heung Cho Ko , Mark Stoykovich , Jongseung Yoon
IPC分类号： H01L21/00 , H01L29/18
CPC分类号： H01L25/50 , B81C2201/0185 , B82Y10/00 , H01L21/00 , H01L25/042 , H01L25/0753 , H01L25/167 , H01L27/1214 , H01L27/124 , H01L27/1285 , H01L27/1292 , H01L27/14627 , H01L27/14636 , H01L27/14643 , H01L29/78603 , H01L29/78681 , H01L31/02005 , H01L31/02008 , H01L31/02168 , H01L31/02325 , H01L31/02327 , H01L31/0288 , H01L31/03046 , H01L31/043 , H01L31/0525 , H01L31/0543 , H01L31/0547 , H01L31/0693 , H01L31/0725 , H01L31/167 , H01L31/1804 , H01L31/1824 , H01L31/1868 , H01L31/1876 , H01L31/1892 , H01L33/005 , H01L33/0079 , H01L33/06 , H01L33/30 , H01L33/483 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/62 , H01L2924/0002 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2933/0091 , H01S5/021 , H01S5/02284 , H01S5/183 , H01S5/3013 , H01S5/34326 , H01S5/423 , Y02E10/52 , Y02E10/547 , Y02P70/521 , H01L2924/00
摘要： Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.
摘要翻译：提供了至少部分地通过基于印刷的组装和器件部件的集成制造的光学器件和系统。在具体实施方案中，本发明提供包括大面积高性能宏电子器件的可印刷半导体元件的发光系统，光收集系统，光感测系统和光伏系统。本发明的光学系统包括通过印刷技术组装，组织和/或与其它器件部件集成的半导体元件，所述打印技术表现出与使用常规高温处理方法制造的基于单晶半导体的器件相似的性能特征和功能。本发明的光学系统具有通过提供一系列有用的装置功能的打印所访问的装置几何形状和构造，例如形状因子，部件密度和部件位置。本发明的光学系统包括表现出一系列有用的物理和机械性能的装置和装置阵列，包括灵活性，可塑性，适形性和可拉伸性。

4. 发明申请

US20100283069A1 Optical systems fabricated by printing-based assembly 有权
标题翻译：基于印刷的组装制造的光学系统
公开(公告)号：US20100283069A1
公开(公告)日：2010-11-11
申请号：US11981380
申请日：2007-10-31
申请人： John Rogers , Ralph Nuzzo , Matthew Meitl , Etienne Menard , Alfred J. Baca , Michael Motala , Jong-Hyun Ahn , Sang-Il Park , Chang-Jae Yu , Heung-Cho Ko , Mark Stoykovich , Jongseung Yoon
发明人： John Rogers , Ralph Nuzzo , Matthew Meitl , Etienne Menard , Alfred J. Baca , Michael Motala , Jong-Hyun Ahn , Sang-Il Park , Chang-Jae Yu , Heung-Cho Ko , Mark Stoykovich , Jongseung Yoon
IPC分类号： H01L33/58 , H01L33/00 , H01L31/18 , H01L31/0232
CPC分类号： H01L25/50 , B81C2201/0185 , B82Y10/00 , H01L21/00 , H01L25/042 , H01L25/0753 , H01L25/167 , H01L27/1214 , H01L27/124 , H01L27/1285 , H01L27/1292 , H01L27/14627 , H01L27/14636 , H01L27/14643 , H01L29/78603 , H01L29/78681 , H01L31/02005 , H01L31/02008 , H01L31/02168 , H01L31/02325 , H01L31/02327 , H01L31/0288 , H01L31/03046 , H01L31/043 , H01L31/0525 , H01L31/0543 , H01L31/0547 , H01L31/0693 , H01L31/0725 , H01L31/167 , H01L31/1804 , H01L31/1824 , H01L31/1868 , H01L31/1876 , H01L31/1892 , H01L33/005 , H01L33/0079 , H01L33/06 , H01L33/30 , H01L33/483 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/62 , H01L2924/0002 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2933/0091 , H01S5/021 , H01S5/02284 , H01S5/183 , H01S5/3013 , H01S5/34326 , H01S5/423 , Y02E10/52 , Y02E10/547 , Y02P70/521 , H01L2924/00
摘要： The present invention provides optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchability. Optical systems of the present invention include, however, devices and device arrays provided on conventional rigid or semi-rigid substrates, in addition to devices and device arrays provided on flexible, shapeable and/or stretchable substrates.
摘要翻译：本发明提供至少部分地通过基于印刷的装配和装置部件的集成制造的光学装置和系统。在具体实施方案中，本发明提供包括大面积高性能宏电子器件的可印刷半导体元件的发光系统，光收集系统，光感测系统和光伏系统。本发明的光学系统包括通过印刷技术组装，组织和/或与其它器件部件集成的半导体元件，所述打印技术表现出与使用常规高温处理方法制造的基于单晶半导体的器件相似的性能特征和功能。本发明的光学系统具有通过提供一系列有用的装置功能的打印所访问的装置几何形状和构造，例如形状因子，部件密度和部件位置。本发明的光学系统包括表现出一系列有用的物理和机械性能的装置和装置阵列，包括灵活性，可塑性，适应性和拉伸性。然而，本发明的光学系统除了在柔性，可塑性和/或可拉伸的基底上提供的装置和装置阵列外，还包括设置在常规刚性或半刚性基底上的装置和装置阵列。

5. 发明申请

US20080108171A1 RELEASE STRATEGIES FOR MAKING TRANSFERABLE SEMICONDUCTOR STRUCTURES, DEVICES AND DEVICE COMPONENTS 有权
标题翻译：发布可转换半导体结构，器件和器件组件的策略
公开(公告)号：US20080108171A1
公开(公告)日：2008-05-08
申请号：US11858788
申请日：2007-09-20
申请人： John Rogers , Ralph Nuzzo , Matthew Meitl , Heung Cho Ko , Jongseung Yoon , Etienne Menard , Alfred Baca
发明人： John Rogers , Ralph Nuzzo , Matthew Meitl , Heung Cho Ko , Jongseung Yoon , Etienne Menard , Alfred Baca
IPC分类号： H01L31/18 , H01L21/30
CPC分类号： H01L31/0735 , B81C1/0046 , B81C2201/0191 , B82Y10/00 , B82Y20/00 , B82Y40/00 , H01L21/7813 , H01L29/155 , H01L29/20 , H01L31/03046 , H01L31/068 , H01L31/0687 , H01L31/072 , H01L31/0725 , H01L31/184 , H01L31/1844 , H01L33/0079 , H01L2924/0002 , Y02E10/52 , Y02E10/544 , Y02E10/547 , Y02P70/521 , Y10T156/1195 , H01L2924/00
摘要： Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.
摘要翻译：提供了通过提供具有多个功能层和多个释放层的多层结构来制造器件或器件部件的方法，并且通过分离一个或多个释放层从多层结构释放功能层以产生多个可转让结构。可转移结构被印刷到由器件衬底支撑的器件衬底或器件部件上。该方法和系统提供制造高质量和低成本的光伏器件，可转移的半导体结构（光电）器件和器件部件的手段。

6. 发明申请

US20070032089A1 Printable Semiconductor Structures and Related Methods of Making and Assembling 有权
标题翻译：可打印半导体结构及相关制作与组装方法
公开(公告)号：US20070032089A1
公开(公告)日：2007-02-08
申请号：US11421654
申请日：2006-06-01
申请人： Ralph Nuzzo , John Rogers , Etienne Menard , Keon Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu , Heung Ko
发明人： Ralph Nuzzo , John Rogers , Etienne Menard , Keon Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu , Heung Ko
IPC分类号： H01L21/302
CPC分类号： H01L29/72 , B81C2201/0185 , B82Y10/00 , H01L21/02628 , H01L21/30 , H01L21/3083 , H01L21/31612 , H01L27/1285 , H01L27/1292 , H01L29/045 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/1606 , H01L29/66265 , H01L29/66462 , H01L29/7781 , H01L29/78603 , H01L29/78681 , H01L29/78684 , H01L29/78696 , H01L31/0392 , H01L31/03925 , H01L31/03926 , H01L31/18 , H01L31/1804 , H01L2924/0002 , H01L2924/12041 , H01L2924/13091 , Y02E10/547 , Y02P70/521 , H01L2924/00
摘要： The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.
摘要翻译：本发明提供了用于制造，传输和组装具有选定的物理尺寸，形状，组成和空间取向的高质量可印刷半导体元件的高产率路径。本发明的组合物和方法提供了高精度的记录转印和将微尺寸和/或纳米半导体结构的阵列集成到包括大面积衬底和/或柔性衬底的衬底上。此外，本发明提供了从诸如散装硅晶片的低成本散装材料制造可印刷的半导体元件的方法，以及能够实现通用和商业上有吸引力的基于印刷的制造平台的智能材料处理策略，以制造广泛的功能性半导体器件。

7. 发明申请

US20050238967A1 Composite patterning devices for soft lithography 有权
标题翻译：用于软光刻的复合图案形成装置
公开(公告)号：US20050238967A1
公开(公告)日：2005-10-27
申请号：US11115954
申请日：2005-04-27
申请人： John Rogers , Etienne Menard
发明人： John Rogers , Etienne Menard
IPC分类号： C04B24/38 , C04B28/14 , G03F7/00 , G03F9/00
CPC分类号： B82Y10/00 , B82Y30/00 , B82Y40/00 , C04B24/383 , C04B28/14 , C04B2111/00181 , G03F7/0002
摘要： The present invention provides methods, devices and device components for fabricating patterns on substrate surfaces, particularly patterns comprising structures having microsized and/or nanosized features of selected lengths in one, two or three dimensions. The present invention provides composite patterning devices comprising a plurality of polymer layers each having selected mechanical properties, such as Young's Modulus and flexural rigidity, selected physical dimensions, such as thickness, surface area and relief pattern dimensions, and selected thermal properties, such as coefficients of thermal expansion, to provide high resolution patterning on a variety of substrate surfaces and surface morphologies.
摘要翻译：本发明提供用于在衬底表面上制造图案的方法，装置和器件部件，特别是包括具有一维，二维或三维尺寸选定长度的微小尺寸和/或纳米尺寸特征的结构的图案。本发明提供了复合图案形成装置，其包括多个聚合物层，每个聚合物层各自具有选择的机械性质，例如杨氏模量和弯曲刚度，所选择的物理尺寸，例如厚度，表面积和浮雕图案尺寸，以及选定的热性能，例如系数的热膨胀，以在各种基底表面和表面形态上提供高分辨率图案。

8. 发明授权

US08585423B2 Submersible electrical connector 有权
标题翻译：潜水电连接器
公开(公告)号：US08585423B2
公开(公告)日：2013-11-19
申请号：US13524326
申请日：2012-06-15
申请人： Michael Christopher Marklove , John Rogers , Jonathan Hardisty
发明人： Michael Christopher Marklove , John Rogers , Jonathan Hardisty
IPC分类号： H01R13/52
CPC分类号： H01R13/521
摘要： A connector for use underwater or in a wet or severe environment comprises first and second connector parts adapted to be interengaged to establish an electrical connection. The first connector part has at least one pin, and the second connector part has at least one electrical contact for engagement by the pin when the connector parts are interengaged. The pin comprises an axially extending electrically conductive portion and an axially extending electrically insulating sleeve around said conductive portion, and the pin is supported by and projects axially forwardly from a support whereby its insulating sleeve is exposed along a longitudinally extending portion thereof to ambient conditions when the connector parts are disengaged. The connector part has a protective rigid metal sleeve member arranged to extend at least partly along the first portion of the insulating sleeve and at least partly along the second portion thereof.
摘要翻译：用于水下或在潮湿或恶劣环境中的连接器包括适于相互接合以建立电连接的第一和第二连接器部件。第一连接器部分具有至少一个销，并且第二连接器部分具有至少一个电接触件，用于当连接器部件相互接合时由销接合。销包括轴向延伸的导电部分和围绕所述导电部分的轴向延伸的电绝缘套管，并且销被支撑并且从支撑件轴向向前突出，由此其绝缘套筒沿着其纵向延伸的部分暴露于环境条件，连接器部件脱开。连接器部分具有保护刚性金属套筒构件，其布置成至少部分地沿着绝缘套筒的第一部分延伸并且至少部分地沿其绝缘套筒的第二部分延伸。

9. 发明申请

US20120088385A1 Submersible Electrical Connector 有权
公开(公告)号：US20120088385A1
公开(公告)日：2012-04-12
申请号：US13329840
申请日：2011-12-19
申请人： Michael Christopher Marklove , John Rogers , Jonathan Hardisty
发明人： Michael Christopher Marklove , John Rogers , Jonathan Hardisty
IPC分类号： H01R13/523
CPC分类号： H01R13/521
摘要： A connector for use underwater or in a wet or severe environment comprises first and second connector parts adapted to be interengaged to establish an electrical connection. The first connector part has at least one pin, and the second connector part has at least one electrical contact for engagement by the pin when the connector parts are interengaged. The pin comprises an axially extending electrically conductive portion and an axially extending electrically insulating sleeve around said conductive portion, and the pin is supported by and projects axially forwardly from a support whereby its insulating sleeve is exposed along a longitudinally extending portion thereof to ambient conditions when the connector parts are disengaged. The connector part has a protective rigid metal sleeve member arranged to extend at least partly along the first portion of the insulating sleeve and at least partly along the second portion thereof.

10. 发明申请

US20120002856A1 METHOD FOR PERFORMING MICRO-PERIMETRY EXAMS BASED ON A RETINAL VOLUME IMAGE AND A WELL REGISTERED FUNDUS IMAGE 有权
标题翻译：基于RETINAL体积图像和良好的注册基因图像进行微观周期的方法
公开(公告)号：US20120002856A1
公开(公告)日：2012-01-05
申请号：US12866953
申请日：2008-12-10
申请人： Duncan McLean , Justin Pedro , John Rogers
发明人： Duncan McLean , Justin Pedro , John Rogers
IPC分类号： G06K9/00
CPC分类号： A61B3/024 , A61B3/102 , A61B3/1225 , A61B3/1241
摘要： A method of performing a retinal examination is described wherein perimetry points are selected in three dimensional imaging data of the retinal tissue. The corresponding points in register with these perimetry points are mapped to an en-face image. These corresponding points are used as stimulus locations for a micro-perimetry examination.
摘要翻译：描述了进行视网膜检查的方法，其中在视网膜组织的三维成像数据中选择视野图。将这些周边点注册的对应点映射到面部图像。这些对应点用作微观测量检查的刺激位置。

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