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    • 8. 发明申请
    • Soldering Apparatus and Solder Tip
    • 焊接设备和焊接头
    • US20090050673A1
    • 2009-02-26
    • US12127810
    • 2008-05-27
    • Charles Peter AlthoffE. Scott EmersonJeffrey M. KalmanJohn R. NottinghamRenard J. PasserellClifford M. ProsekWilliam Eugene RabbittJ. Evan SpirkJohn W. Spirk
    • Charles Peter AlthoffE. Scott EmersonJeffrey M. KalmanJohn R. NottinghamRenard J. PasserellClifford M. ProsekWilliam Eugene RabbittJ. Evan SpirkJohn W. Spirk
    • B23K3/02B23K3/06
    • B23K3/047B23K3/0478B23K3/0615B23K3/08
    • The present application discloses a fixture-free, hands-free soldering apparatus having a base support assembly and a solder assembly. The base support assembly has a base member supporting a power supply and an electronic temperature, time and speed control system, and an actuator for remotely actuating the solder assembly without the use of the operator's hands or fixtures. The solder assembly is supported on the base member by vertically movable support arms. A main body supports a spool of solder, a solder feed mechanism operated by the actuator and a solder mechanism having adjustable operating temperature, speed and position. The main body and adjustable solder mechanism of the solder assembly adjust the angle and position of the solder being fed by the solder feed mechanism and an adjustable solder head supporting a concave solder tip. In addition to vertical movement, the main body is rotatable by about 60 degrees with respect to a central horizontal plane along the main body. The adjustable solder head of the solder assembly is also rotatable by over 100 degrees with respect to a central vertical plane along the main body. A pressure or motion sensor positioned on the adjustable soldering mechanism may be used to signal the contact to the mechanism by work pieces, and delays solder from being fed by the solder feed mechanism, until the desired time has elapsed for the pieces to reach a minimum desired temperature. A fume removal system removes soldering fumes from the work area during operation of the solder apparatus.
    • 本申请公开了一种具有基座支撑组件和焊料组件的无夹具的免提焊接装置。 基座支撑组件具有支撑电源和电子温度,时间和速度控制系统的基座部件,以及用于在不使用操作者的手或固定装置的情况下远程致动焊接组件的致动器。 焊料组件通过可垂直移动的支撑臂支撑在基座构件上。 主体支撑焊料卷轴,由致动器操作的焊料进给机构和具有可调节的工作温度,速度和位置的焊接机构。 焊料组件的主体和可调节的焊接机构调节由焊料馈送机构馈送的焊料的角度和位置以及支撑凹陷焊料尖端的可调焊头。 除了垂直运动之外,主体相对于沿着主体的中心水平面旋转约60度。 焊料组件的可调节焊头相对于主体的中心垂直平面也可旋转超过100度。 定位在可调节焊接机构上的压力或运动传感器可以用于通过工件向机构发出接触信号,并且延迟焊料由焊料进给机构馈送,直到所需时间达到最小值 所需温度。 烟道去除系统在焊接设备的操作期间从工作区域去除焊接烟雾。