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    • 10. 发明授权
    • Mask-saving production of complementary lateral high-voltage transistors with a RESURF structure
    • 使用RESURF结构掩盖了生产互补的横向高压晶体管
    • US08207031B2
    • 2012-06-26
    • US12593310
    • 2008-03-26
    • Christoph EllmersThomas UhligFelix FuernhammerMichael StoisiekMichael Gross
    • Christoph EllmersThomas UhligFelix FuernhammerMichael StoisiekMichael Gross
    • H01L21/8238
    • H01L21/823807H01L21/823814H01L27/0922
    • Methods of forming, on a substrate, a first lateral high-voltage MOS transistor and a second lateral high-voltage MOS transistor complementary to said first one are disclosed. According to one embodiment, the method includes (1) providing a substrate of a first conductivity type including a first active region for said first lateral high-voltage MOS transistor and a second active region for said second lateral high-voltage MOS transistor and (2) forming at least one first doped region of the first conductivity type in the first active region and forming in the second active region a drain extension region of the second conductivity type extending from a substrate surface to an interior of the substrate, including a concurrent implantation of dopants through openings of one and the same mask into the first and second active regions. Forming of the at least one first doped region may be a sub step of a superior step of forming a double RESURF structure in the first lateral high-voltage MOS transistor, and forming the double RESURF structure may include forming doped RESURF regions as two first doped regions, one thereof above and one thereof below the drift region of the first lateral high-voltage MOS transistor, and as two further doped regions, one thereof above and one thereof below the drain extension regions of the second lateral high-voltage MOS transistor, wherein the first doped RESURF regions have an inverse conductivity type with respect to the drift region and the further doped regions have inverse conductivity type as compared to the drain extension region.
    • 公开了在基板上形成与所述第一横向高压MOS晶体管和第二横向高压MOS晶体管互补的方法。 根据一个实施例,该方法包括(1)提供第一导电类型的衬底,其包括用于所述第一横向高压MOS晶体管的第一有源区和用于所述第二横向高压MOS晶体管的第二有源区和(2 )在所述第一有源区中形成所述第一导电类型的至少一个第一掺杂区域,并且在所述第二有源区域中形成从衬底表面延伸到所述衬底内部的所述第二导电类型的漏极延伸区域,所述漏极延伸区域包括同时植入 的掺杂剂通过同一掩模的开口进入第一和第二活性区域。 形成至少一个第一掺杂区域可以是在第一横向高压MOS晶体管中形成双重RESURF结构的优异步骤的子步骤,并且形成双重RESURF结构可以包括形成掺杂的RESURF区域作为两个第一掺杂 区域,其中一个位于第一横向高压MOS晶体管的漂移区以下,其中一个位于第二横向高压MOS晶体管的漏极延伸区之下,其中一个位于第二横向高压MOS晶体管的漏极延伸区之下, 其中所述第一掺杂RESURF区域相对于所述漂移区域具有反向导电类型,并且所述另外的掺杂区域与所述漏极延伸区域相比具有反向导电类型。