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1. 发明申请

US20120319319A1 FORMING FEEDTHROUGHS FOR HERMETICALLY SEALED HOUSINGS USING TWO-MATERIAL POWDER INJECTION MOLDING 有权
标题翻译：使用两种粉末注射成型制成的密封外壳的成型工艺
公开(公告)号：US20120319319A1
公开(公告)日：2012-12-20
申请号：US13512172
申请日：2010-11-26
申请人： John L. Parker , David Robinson , David Thomas , Mark Fretz
发明人： John L. Parker , David Robinson , David Thomas , Mark Fretz
IPC分类号： B29C45/16
CPC分类号： A61N1/3754 , A61N1/3756 , B22F3/225 , B28B1/24 , B29C33/302 , B29C45/0001 , C04B2111/00137 , C04B2235/6022
摘要： Methods of forming a feedthrough using a mold that defines a cavity when closed and includes one or more cores configured to move in and out of the mold cavity. The methods include injecting non-electrically conductive powder injection molding (PIM) feedstock into the mold cavity to form an insulative body around a portion of each of the cores disposed in the mold cavity, removing each of the cores from the insulative body to form one or more core cavities in the insulative body, injecting electrically conductive PIM feedstock into the core cavities to form one or more conductors in the core cavities, respectively, and sintering the insulative body and the conductors to form the feedthrough.
摘要翻译：使用模具形成馈通的方法，所述模具在关闭时限定空腔，并且包括配置成移入和移出模腔的一个或多个芯体。所述方法包括将非导电粉末注射成型（PIM）原料注入到模腔中以在设置在模腔中的每个芯的一部分周围形成绝缘体，从绝缘体去除每个芯以形成一个或更多个芯腔，分别将导电PIM原料注入到芯腔中以在芯腔中形成一个或多个导体，并且烧结绝缘体和导体以形成馈通。

2. 发明申请

US20120306128A1 METHODS FOR FORMING FEEDTHROUGHS FOR HERMETICALLY SEALED HOUSINGS USING POWDER INJECTION MOLDING 有权
标题翻译：使用粉末注射成型形成密封外壳的方法
公开(公告)号：US20120306128A1
公开(公告)日：2012-12-06
申请号：US13512115
申请日：2010-11-26
申请人： John L. Parker , David Robinson , David Thomas , Mark Fretz
发明人： John L. Parker , David Robinson , David Thomas , Mark Fretz
IPC分类号： C04B35/64
CPC分类号： A61N1/3754 , A61N1/3756 , B22F3/225 , B28B1/24 , B29C33/302 , B29C45/0001 , C04B2111/00137 , C04B2235/6022
摘要： Methods of forming feedthroughs for hermetically sealed housings using powder injection molding, including positioning a plurality of separate electrically conductive elements in a mold, injecting non-electrically conductive powder injection molding (PIM) feedstock into the mold to form a plurality of insulative bodies around the conductive elements, sintering the insulative bodies to form the plurality of feedthroughs physically connected to one another via the conductive elements; and severing the conductive elements between neighboring insulative bodies.
摘要翻译：使用粉末注射成型形成用于密封壳体的馈通件的方法，包括在模具中定位多个单独的导电元件，将非导电粉末注射成型（PIM）原料注入模具中，以在多个绝缘体周围形成多个绝缘体导电元件，烧结绝缘体以形成通过导电元件彼此物理连接的多个馈通; 并切断相邻绝缘体之间的导电元件。

3. 发明授权

US09089715B2 Forming feedthroughs for hermetically sealed housings using two-material powder injection molding 有权
标题翻译：使用双材料粉末注塑成型密封外壳的馈通
公开(公告)号：US09089715B2
公开(公告)日：2015-07-28
申请号：US13512172
申请日：2010-11-26
申请人： John L. Parker , David Robinson , David Thomas , Mark Fretz
发明人： John L. Parker , David Robinson , David Thomas , Mark Fretz
IPC分类号： B29C45/16 , A61N1/375 , C04B111/00 , B28B1/24 , B29C33/30 , B22F3/22 , B29C45/00
CPC分类号： A61N1/3754 , A61N1/3756 , B22F3/225 , B28B1/24 , B29C33/302 , B29C45/0001 , C04B2111/00137 , C04B2235/6022
摘要： Methods of forming a feedthrough using a mold that defines a cavity when closed and includes one or more cores configured to move in and out of the mold cavity. The methods include injecting non-electrically conductive powder injection molding (PIM) feedstock into the mold cavity to form an insulative body around a portion of each of the cores disposed in the mold cavity, removing each of the cores from the insulative body to form one or more core cavities in the insulative body, injecting electrically conductive PIM feedstock into the core cavities to form one or more conductors in the core cavities, respectively, and sintering the insulative body and the conductors to form the feedthrough.
摘要翻译：使用模具形成馈通的方法，所述模具在关闭时限定空腔，并且包括配置成移入和移出模腔的一个或多个芯体。所述方法包括将非导电粉末注射成型（PIM）原料注入到模腔中以在设置在模腔中的每个芯的一部分周围形成绝缘体，从绝缘体去除每个芯以形成一个或更多个芯腔，分别将导电PIM原料注入到芯腔中以在芯腔中形成一个或多个导体，并且烧结绝缘体和导体以形成馈通。

4. 发明授权

US09072910B2 Methods for forming feedthroughs for hermetically sealed housings using powder injection molding 有权
标题翻译：用于使用粉末注射成型形成用于密封外壳的馈通件的方法
公开(公告)号：US09072910B2
公开(公告)日：2015-07-07
申请号：US13512115
申请日：2010-11-26
申请人： John L. Parker , David Robinson , David Thomas , Mark Fretz
发明人： John L. Parker , David Robinson , David Thomas , Mark Fretz
IPC分类号： B28B1/24 , A61N1/375 , C04B111/00
CPC分类号： A61N1/3754 , A61N1/3756 , B22F3/225 , B28B1/24 , B29C33/302 , B29C45/0001 , C04B2111/00137 , C04B2235/6022
摘要： Methods of forming feedthroughs for hermetically sealed housings using powder injection molding, including positioning a plurality of separate electrically conductive elements in a mold, injecting non-electrically conductive powder injection molding (PIM) feedstock into the mold to form a plurality of insulative bodies around the conductive elements, sintering the insulative bodies to form the plurality of feedthroughs physically connected to one another via the conductive elements; and severing the conductive elements between neighboring insulative bodies.
摘要翻译：使用粉末注射成型形成用于密封壳体的馈通件的方法，包括在模具中定位多个单独的导电元件，将非导电粉末注射成型（PIM）原料注入模具中，以在多个绝缘体周围形成多个绝缘体导电元件，烧结绝缘体以形成通过导电元件彼此物理连接的多个馈通; 并切断相邻绝缘体之间的导电元件。

5. 发明授权

US08897888B2 Knitted electrode assembly and integrated connector for an active implantable medical device 有权
标题翻译：用于有源植入式医疗器械的针织电极组件和集成连接器
公开(公告)号：US08897888B2
公开(公告)日：2014-11-25
申请号：US12549457
申请日：2009-08-28
申请人： John L. Parker , David Robinson
发明人： John L. Parker , David Robinson
IPC分类号： A61N1/05 , A61M25/00 , A61N1/375
CPC分类号： A61N1/05 , A61M25/0009 , A61N1/0472 , A61N1/0484 , A61N1/0529 , A61N1/375
摘要： An active implantable medical device (AIMD). The AIMD comprises: a knitted electrode assembly comprising: at least one biocompatible, electrically non-conductive filament arranged in substantially parallel rows each stitched to an adjacent row, and at least one biocompatible, electrically conductive filament having a first end intertwined with a first row of the at least one non-conductive filament, and a second end intertwined with a second row of the at least one non-conductive filament, wherein the first and second rows are spaced from one another.
摘要翻译：主动植入医疗器械（AIMD）。 AIMD包括：编织电极组件，其包括：至少一个生物相容的，不导电的细丝，其布置成大致平行的行，每个行缝合到相邻排，以及至少一个生物相容的导电细丝，其具有缠绕在第一排的所述至少一个非导电细丝，以及与所述至少一个非导电细丝的第二排缠绕的第二端，其中所述第一和第二行彼此间隔开。

6. 发明申请

US20100070008A1 KNITTED ELECTRODE ASSEMBLY FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE 有权
标题翻译：用于有源可植入医疗装置的针刺电极组件
公开(公告)号：US20100070008A1
公开(公告)日：2010-03-18
申请号：US12549899
申请日：2009-08-28
申请人： John L. Parker , David Robinson
发明人： John L. Parker , David Robinson
IPC分类号： A61N1/00 , D04B1/00 , D04B1/22
CPC分类号： A61N1/05 , A61M25/0009 , A61N1/0472 , A61N1/0484 , A61N1/0529 , A61N1/375
摘要： An active implantable medical device (AIMD). The AIMD comprises an electronics module; and a knitted electrode assembly comprising: at least one biocompatible, electrically non-conductive filament arranged in substantially parallel rows each stitched to an adjacent row, and at least one biocompatible, electrically conductive filament intertwined with the at least one non-conductive filament, and configured to be electrically connected to the electronics module.
摘要翻译：主动植入医疗器械（AIMD）。 AIMD包括电子模块; 以及针织电极组件，其包括：至少一个生物相容的，不导电的细丝，其布置成大致平行的行，每个线缝合到相邻的行，以及与所述至少一个非导电细丝缠结的至少一个生物相容的导电细丝，以及被配置为电连接到电子模块。

7. 发明授权

US08923984B2 Knitted electrode assembly for an active implantable medical device 有权
标题翻译：用于有源可植入医疗装置的针织电极组件
公开(公告)号：US08923984B2
公开(公告)日：2014-12-30
申请号：US12549899
申请日：2009-08-28
申请人： John L. Parker , David Robinson
发明人： John L. Parker , David Robinson
IPC分类号： A61N1/05 , A61M25/00 , A61N1/375
CPC分类号： A61N1/05 , A61M25/0009 , A61N1/0472 , A61N1/0484 , A61N1/0529 , A61N1/375
摘要： An active implantable medical device (AIMD). The AIMD comprises an electronics module; and a knitted electrode assembly comprising: at least one biocompatible, electrically non-conductive filament arranged in substantially parallel rows each stitched to an adjacent row, and at least one biocompatible, electrically conductive filament intertwined with the at least one non-conductive filament, and configured to be electrically connected to the electronics module.
摘要翻译：主动植入式医疗器械（AIMD）。 AIMD包括电子模块; 以及针织电极组件，其包括：至少一个生物相容的，不导电的细丝，其布置成大致平行的行，每个线缝合到相邻的行，以及与所述至少一个非导电细丝缠结的至少一个生物相容的导电细丝，以及被配置为电连接到电子模块。

8. 发明申请

US20100069835A1 KNITTED CATHETER 审中-公开
标题翻译：针织导管
公开(公告)号：US20100069835A1
公开(公告)日：2010-03-18
申请号：US12549801
申请日：2009-08-28
申请人： John L. Parker , David Robinson
发明人： John L. Parker , David Robinson
IPC分类号： A61M25/092 , A61M25/01 , A61B10/02 , D04B39/00
CPC分类号： A61N1/05 , A61M25/0009 , A61N1/0472 , A61N1/0484 , A61N1/0529 , A61N1/375
摘要： A medical device, comprising: an elongate tubular knitted catheter comprising at least one biocompatible, electrically non-conductive filament arranged in longitudinally adjacent substantially parallel rows each stitched to an adjacent row.
摘要翻译：一种医疗装置，包括：细长的管状针织导管，其包括至少一个生物相容的非导电细丝，其布置成纵向相邻的基本上平行的行，每个行缝合到相邻的行。

9. 发明申请

US20100070007A1 KNITTED ELECTRODE ASSEMBLY AND INTEGRATED CONNECTOR FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE 有权
标题翻译：用于有源可植入医疗器械的针刺电极组件和集成连接器
公开(公告)号：US20100070007A1
公开(公告)日：2010-03-18
申请号：US12549457
申请日：2009-08-28
申请人： John L. Parker , David Robinson
发明人： John L. Parker , David Robinson
IPC分类号： A61N1/00 , D04B1/00 , D04B1/22
CPC分类号： A61N1/05 , A61M25/0009 , A61N1/0472 , A61N1/0484 , A61N1/0529 , A61N1/375
摘要： An active implantable medical device (AIMD). The AIMD comprises: a knitted electrode assembly comprising: at least one biocompatible, electrically non-conductive filament arranged in substantially parallel rows each stitched to an adjacent row, and at least one biocompatible, electrically conductive filament having a first end intertwined with a first row of the at least one non-conductive filament, and a second end intertwined with a second row of the at least one non-conductive filament, wherein the first and second rows are spaced from one another.
摘要翻译：主动植入医疗器械（AIMD）。 AIMD包括：编织电极组件，其包括：至少一个生物相容的，不导电的细丝，其布置成大致平行的行，每个行缝合到相邻排，以及至少一个生物相容的导电细丝，其具有缠绕在第一排的所述至少一个非导电细丝，以及与所述至少一个非导电细丝的第二排缠绕的第二端，其中所述第一和第二行彼此间隔开。

10. 发明申请

US20120215057A1 MULTI-MODE HEARING PROSTHESIS 审中-公开
标题翻译：多模式听觉预测
公开(公告)号：US20120215057A1
公开(公告)日：2012-08-23
申请号：US13454732
申请日：2012-04-24
申请人： John L. Parker
发明人： John L. Parker
IPC分类号： A61F11/04 , H04R25/00
CPC分类号： H04R25/606 , H04R25/353 , H04R2430/03 , H04R2460/13
摘要： A multi-mode hearing prosthesis for enhancing the hearing of a recipient, comprising: a sound input element configured to receive a sound signal component; a frequency spectral analysis module configured to analyze the sound signal component and to categorize the component into at least a high- or lower-frequency component; a bone conduction processor configured to generate bone conduction stimulation signals from at least one of said high- and lower-frequency component for bone conduction stimulation of the recipient's skull; and a second stimulation processor configured to generate auditory stimulation signals from at least one of said high- and lower-frequency components for stimulating the recipient.
摘要翻译：一种用于增强接收者的听力的多模式听觉假体，包括：声音输入元件，被配置为接收声音信号分量; 频谱分析模块，被配置为分析所述声音信号分量并将所述分量分类为至少高频或低频分量; 骨传导处理器被配置为从所述高频和低频分量中的至少一个产生骨传导刺激信号，用于接受者头骨的骨传导刺激; 以及第二刺激处理器，被配置为从所述高频和低频分量中的至少一个产生听觉刺激信号，以刺激接收者。

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