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    • 6. 发明授权
    • Method for preventing P1 punchthrough
    • 防止P1穿透的方法
    • US5972749A
    • 1999-10-26
    • US2783
    • 1998-01-05
    • John J. WangYuesong HeKent Kuohua Chang
    • John J. WangYuesong HeKent Kuohua Chang
    • H01L21/02H01L21/314H01L21/8239H01L21/8238H01L21/8247
    • H01L28/40H01L27/1052H01L21/3143Y10S438/97
    • A method and apparatus for an integrated circuit on a semiconductor substrate having good metal contact points. A first polysilicon layer is formed onto the substrate, and is etched to provide contact regions to the substrate. An ONO layer is formed onto the first polysilicon layer. A second polysilicon layer is formed onto the ONO layer, and a metal silicide layer is formed onto the second polysilicon layer. The second polysilicon layer and the metal silicide layer are etched at particular locations in order to form contact regions to the first polysilicon layer and to the substrate. A selective layer is formed onto the second polysilicon layer, the selective layer being etch selective with respect to the first polysilicon layer. An interlayer dielectric is formed onto the selective layer. A first etching is performed to provide a contact path through the interlayer dielectric, and then a second etching is performed to provide a contact path through the selective layer. Based on these two contact paths, a contact point can be provided externally to the first polysilicon layer.
    • 一种具有良好金属接触点的半导体衬底上集成电路的方法和装置。 第一多晶硅层形成在衬底上,并被蚀刻以提供与衬底的接触区域。 在第一多晶硅层上形成ONO层。 在ONO层上形成第二多晶硅层,在第二多晶硅层上形成金属硅化物层。 在特定位置蚀刻第二多晶硅层和金属硅化物层,以便形成与第一多晶硅层和衬底的接触区域。 选择层形成在第二多晶硅层上,选择层相对于第一多晶硅层具有蚀刻选择性。 在选择层上形成层间电介质。 执行第一蚀刻以提供通过层间电介质的接触路径,然后执行第二蚀刻以提供穿过选择层的接触路径。 基于这两个接触路径,可以在第一多晶硅层的外部设置接触点。
    • 8. 发明授权
    • Food cutting apparatus
    • 食品切割机
    • US4993157A
    • 1991-02-19
    • US519808
    • 1990-05-07
    • John J. Wang
    • John J. Wang
    • A21C15/04B26B25/00
    • B26B25/007A21C15/04B26B25/005Y10T83/7587
    • An apparatus for effecting precise slicing and division of various sheet-like food members, such as cake, pizza and the like. The apparatus includes a housing including a manually manipulatable drive gear positioned medially thereof, with the drive gear rotatable by use of a rotatable incrementally divided handle projecting orthogonally and upwardly relative to the housing, with a plurality of reciprocatable gear racks directed exteriorly of the housing through each opposed side thereof in cooperation with the gear to adjust spacing of cutting wheels, each mounted at a remote terminal end of each gear rack.
    • 一种用于实现各种片状食物如蛋糕,比萨饼等的精确切片和分割的装置。 该装置包括壳体,其包括在其中间定位的可手动操纵的驱动齿轮,其中驱动齿轮通过使用可相对于壳体正交和向上突出的可旋转的递增分割手柄旋转,多个往复运动的齿轮架指向壳体外部 与齿轮配合的每个相对侧,以调节切割轮的间距,每个安装在每个齿条的远程终端。
    • 9. 发明授权
    • Soil decontamination with wick drains
    • 污水排污的土壤去污
    • US4582611A
    • 1986-04-15
    • US639247
    • 1984-08-09
    • John J. Wang
    • John J. Wang
    • B01D29/15B09C1/02E21B43/30B01D35/02
    • B01D29/15B09C1/02E21B43/30
    • A process for removing contaminants from soil or aquifers. The process uses wick drains which include an outer filter medium supported by a rigid inner perforate member. The wick drains are inserted into the contaminated soil or aquifer, water is injected into one or more of the wick drains, and water and contaminants are removed from one or more wick drains. The wick drains are inserted by placing the wick drains in mandrels and driving them into the soil or aquifers, in a manner similar to that in which piles are driven, at a rate of up to about 8,000 to 10,000 linear feet per day.
    • 一种从土壤或含水层中去除污染物的方法。 该方法使用芯排水管,其包括由刚性内部穿孔构件支撑的外部过滤介质。 将排水管插入污染的土壤或含水层中,将水注入一个或多个排水管,并从一个或多个排水管中取出水和污染物。 通过将芯排水管放置在心轴中并以与每天驱动的桩类似的方式驱动它们进入土壤或含水层,以每天高达约8,000至10,000线性英尺的速率插入排水芯。