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1. 发明授权

US5562745A Abrasive articles, methods of making abrasive articles, and methods of using abrasive articles 失效
标题翻译：磨料制品，制造磨料制品的方法以及使用磨料制品的方法
公开(公告)号：US5562745A
公开(公告)日：1996-10-08
申请号：US386887
申请日：1995-02-10
申请人： John J. Gagliardi , Jason A. Chesley , Charles H. Houck , Walter L. Harmer , Gary L. Olson
发明人： John J. Gagliardi , Jason A. Chesley , Charles H. Houck , Walter L. Harmer , Gary L. Olson
IPC分类号： B24D3/02 , B24D3/34 , C08J5/14 , C09K3/14 , B24D3/24
CPC分类号： B24D3/344 , B24D3/342
摘要： Abrasive articles comprising a plurality of abrasive particles, a combination of potassium tetrafluoroborate and a halogenated polymer, and a binder to which the plurality of abrasive particles are adhered, and methods of making and using the abrasive articles.
摘要翻译：包括多个研磨颗粒，四氟硼酸钾和卤化聚合物的组合的磨料制品以及粘合有多个磨料颗粒的粘合剂以及制造和使用磨料制品的方法。

2. 发明授权

US06299508B1 Abrasive article with integrally molded front surface protrusions containing a grinding aid and methods of making and using 失效
标题翻译：具有整体成型的包含研磨助剂的前表面突起的研磨制品
公开(公告)号：US06299508B1
公开(公告)日：2001-10-09
申请号：US09129411
申请日：1998-08-05
申请人： John J. Gagliardi , Jason A. Chesley
发明人： John J. Gagliardi , Jason A. Chesley
IPC分类号： B24D1100
CPC分类号： B24D3/34 , B24D11/00
摘要： An abrasive article including (i) a backing, (ii) a plurality of grinding aid-containing protrusions integrally molded on the first surface of the backing, wherein the first surface of the backing is contoured by the protrusions so as to define a plurality of peaks and valleys, and (iii) a coating of abrasive particles adhered to the contoured first surface of the first backing so as to cover at least a portion of both the peaks and the valleys.
摘要翻译：一种磨料制品，其包括（i）背衬，（ii）多个在所述背衬的第一表面上整体模制的含有助磨剂的突起，其中所述背衬的所述第一表面由所述突起构成，以便限定多个峰和谷，以及（iii）粘附到第一背衬的轮廓的第一表面上的磨料颗粒的涂层，以便覆盖两个峰和谷的至少一部分。

3. 发明授权

US5578098A Coated abrasive containing erodible agglomerates 失效
标题翻译：含有可侵蚀附聚物的涂层磨料
公开(公告)号：US5578098A
公开(公告)日：1996-11-26
申请号：US567811
申请日：1995-12-06
申请人： John J. Gagliardi , Jason A. Chesley , Charles H. Houck , Richard J. Cosmano , Ernest J. Duwell
发明人： John J. Gagliardi , Jason A. Chesley , Charles H. Houck , Richard J. Cosmano , Ernest J. Duwell
IPC分类号： B24D3/34 , B24D11/00 , C09K3/14
CPC分类号： B24D11/001 , B24D11/00 , B24D3/34 , B24D3/344 , C09K3/1436 , Y10T428/254
摘要： Coated abrasive article comprising a backing bearing on at least one major surface thereof erodible agglomerates and abrasive grains, wherein the erodible agglomerates consist essentially of a grinding aid and the erodible agglomerates are in the form of rods. The erodible agglomerates can be between or above or between and above the abrasive grains. The coated abrasive article of this invention utilizes a higher level of grinding aid than coated abrasive articles of the prior art.
摘要翻译：涂覆的磨料制品在其至少一个主要表面上包含一个背衬轴承，其中可侵蚀的附聚物和磨料颗粒，其中可侵蚀的附聚物基本上由研磨助剂组成，并且可侵蚀的附聚物是棒的形式。可侵蚀的附聚物可以在磨料颗粒之间或之上或之上。本发明的涂覆的磨料制品比现有技术的涂覆磨料制品使用更高水平的研磨助剂。

4. 发明授权

US5498268A Abrasive articles and method of making abrasive articles 失效
标题翻译：磨料制品和制造磨料制品的方法
公开(公告)号：US5498268A
公开(公告)日：1996-03-12
申请号：US213550
申请日：1994-03-16
申请人： John J. Gagliardi , Jason A. Chesley
发明人： John J. Gagliardi , Jason A. Chesley
IPC分类号： B24D3/04 , B24D3/00
CPC分类号： B24D3/04
摘要： Abrasive articles that comprise a plurality of abrasive particles, a plurality of erodible agglomerates, and an abrasive binder are described. The erodible agglomerates comprise a plurality of grinding aid particles adhered together by a binder comprising a lignosulfonate.
摘要翻译：描述了包括多个磨料颗粒，多个可侵蚀附聚物和磨料粘合剂的磨料制品。可侵蚀的附聚物包括通过包含木质素磺酸盐的粘合剂粘附在一起的多个研磨助剂颗粒。

5. 发明授权

US08251774B2 Structured abrasive article, method of making the same, and use in wafer planarization 有权
标题翻译：结构化磨料制品，其制造方法，并用于晶片平面化
公开(公告)号：US08251774B2
公开(公告)日：2012-08-28
申请号：US12539798
申请日：2009-08-12
申请人： William D. Joseph , Julie Y. Qian , Jimmie R. Baran, Jr. , John J. Gagliardi
发明人： William D. Joseph , Julie Y. Qian , Jimmie R. Baran, Jr. , John J. Gagliardi
IPC分类号： B24B49/00
CPC分类号： B24B37/245 , B24B37/205 , B24D18/00
摘要： A structured abrasive article comprises an at least translucent film backing and an abrasive layer disposed on the backing. The abrasive layer comprises a plurality of shaped abrasive composites. The shaped abrasive composites comprise abrasive particles dispersed in a binder. The abrasive particles consist essentially of ceria particles having an average primary particle size of less than 100 nanometers. The binder comprises a polyether acid and a reaction product of components comprising a carboxylic(meth)acrylate and a poly(meth)acrylate, and, based on a total weight of the abrasive layer, the abrasive particles are present in an amount of at least 70 percent by weight. Methods of making and using the structured abrasive article are also disclosed.
摘要翻译：结构化磨料制品包括至少半透明的膜背衬和设置在背衬上的研磨层。研磨层包括多个成形的磨料复合材料。成形磨料复合材料包括分散在粘合剂中的磨料颗粒。研磨颗粒主要由平均初级粒径小于100纳米的二氧化铈颗粒组成。粘合剂包括聚醚酸和包含羧酸（甲基）丙烯酸酯和聚（甲基）丙烯酸酯的组分的反应产物，并且基于研磨层的总重量，磨料颗粒的量至少为 70重量％。还公开了制造和使用结构化磨料制品的方法。

6. 发明授权

US06908366B2 Method of using a soft subpad for chemical mechanical polishing 有权
标题翻译：使用软垫子进行化学机械抛光的方法
公开(公告)号：US06908366B2
公开(公告)日：2005-06-21
申请号：US10339963
申请日：2003-01-10
申请人： John J. Gagliardi
发明人： John J. Gagliardi
IPC分类号： B24B37/04 , B24D13/12 , B24D13/14 , B24B1/00
CPC分类号： B24B37/245 , B24B37/042 , B24B37/22
摘要： The present invention is directed to a method of modifying a wafer surface comprising providing a first abrasive article comprising a first three-dimensional fixed abrasive element and a first subpad generally coextensive with the first fixed abrasive element, contacting a surface of the first three-dimensional fixed abrasive element with a wafer surface, and relatively moving the first abrasive article and the wafer. The method additionally provides providing a second abrasive article comprising a second three-dimensional fixed abrasive element and a second subpad generally coextensive with the second fixed abrasive element, contacting a surface of the second three-dimensional fixed abrasive element with the wafer surface, and relatively moving the second abrasive article and the wafer. Wherein the first subpad has a deflection less than the deflection of the second subpad when measured 1.5 cm from the edge of a 1 kg weight, the weight having a contact area of 1.9 cm diameter.
摘要翻译：本发明涉及一种修改晶片表面的方法，包括提供包括第一三维固定研磨元件的第一磨料制品和与第一固定研磨元件共同延伸的第一子垫，与第一三维固定研磨元件的表面接触具有晶片表面的固定研磨元件，以及相对移动第一磨料制品和晶片。该方法另外提供了提供包括第二三维固定研磨元件的第二磨料制品和与第二固定研磨元件大体共同延伸的第二子垫，使第二三维固定研磨元件的表面与晶片表面接触，移动第二磨料制品和晶片。其中，当距离1kg重量的边缘测量1.5cm时，第一子垫具有小于第二子垫的挠曲的偏转，该重量具有1.9cm直径的接触面积。

7. 发明授权

US06475253B2 Abrasive article and method of making 有权
标题翻译：磨料制品及其制作方法
公开(公告)号：US06475253B2
公开(公告)日：2002-11-05
申请号：US09242989
申请日：1999-02-26
申请人： Scott R. Culler , John J. Gagliardi , Thomas W. Larkey , Eric G. Larson , Larry L. Martin , Jeffrey W. Nelson
发明人： Scott R. Culler , John J. Gagliardi , Thomas W. Larkey , Eric G. Larson , Larry L. Martin , Jeffrey W. Nelson
IPC分类号： B24D334
CPC分类号： B24D3/28 , B24D11/001 , B24D18/0009 , Y10T428/25 , Y10T428/252 , Y10T428/256 , Y10T428/257 , Y10T428/259
摘要： This invention pertains to a coated, bonded or non-woven abrasive article containing precisely shaped particles and a binder. These precisely shaped particles can contain abrasive grits, fillers, grinding aids and lubricants. The binder is preferably a mixture of a resole phenolic resin and a free radical curable resin, resulting in improved cutting and life span. Also disclosed is a method of forming the coated, bonded or non-woven abrasive article.
摘要翻译：本发明涉及包含精确成形的颗粒和粘合剂的涂布的，粘合的或非织造的磨料制品。这些精确成形的颗粒可以含有磨料砂粒，填料，助磨剂和润滑剂。粘合剂优选为甲阶酚醛树脂和可自由基固化树脂的混合物，从而改善了切割和使用寿命。还公开了一种形成涂覆的，粘合的或非织造的磨料制品的方法。

8. 发明授权

US06364747B1 Abrasive article with embossed isolation layer and methods of making and using 有权
标题翻译：具有浮雕隔离层的磨料制品和制造和使用方法
公开(公告)号：US06364747B1
公开(公告)日：2002-04-02
申请号：US09697201
申请日：2000-10-26
申请人： John J. Gagliardi
发明人： John J. Gagliardi
IPC分类号： B24D300
CPC分类号： B24D3/34 , B24D11/00
摘要： An abrasive article including (i) an embossed isolation layer defining inversely contoured first and second surfaces with a plurality of peaks on the first surface producing a plurality of pockets on the second surface, (ii) grinding aid-containing protrusions positioned within the pockets, and (iii) a coating of abrasive particles adhered to the contoured first surface of the isolation layer.
摘要翻译：一种磨料制品，包括（i）压花隔离层，其形成相反的轮廓的第一和第二表面，在第一表面上具有多个峰，在第二表面上产生多个袋，（ii）位于袋内的研磨助剂的突起，和（iii）粘附到隔离层的轮廓第一表面上的磨料颗粒的涂层。

9. 发明授权

US08360823B2 Splicing technique for fixed abrasives used in chemical mechanical planarization 有权
标题翻译：用于化学机械平面化的固定磨料的拼接技术
公开(公告)号：US08360823B2
公开(公告)日：2013-01-29
申请号：US12815764
申请日：2010-06-15
申请人： John J. Gagliardi
发明人： John J. Gagliardi
IPC分类号： B24B1/00 , B24B33/00
CPC分类号： B24D7/14 , B24B37/245
摘要： An abrasive article includes a support pad, a first abrasive element, a second abrasive element and a fixation mechanism. The support pad has a first major surface, a second major surface, a first edge, a second edge and a channel. The channel is formed within the first major surface and extends from the first edge to the second edge. The first and second abrasive elements are each positionable over a portion of the support pad. The fixation mechanism is positioned within the channel ad secures an edge of the first abrasive element and an edge of the second abrasive element to the support pad.
摘要翻译：研磨制品包括支撑垫，第一研磨元件，第二研磨元件和固定机构。支撑垫具有第一主表面，第二主表面，第一边缘，第二边缘和通道。通道形成在第一主表面内并且从第一边缘延伸到第二边缘。第一和第二研磨元件各自位于支撑垫的一部分上。固定机构定位在通道内，将第一研磨元件的边缘和第二研磨元件的边缘固定到支撑垫。

10. 发明授权

US08092707B2 Compositions and methods for modifying a surface suited for semiconductor fabrication 有权
标题翻译：用于修改适合于半导体制造的表面的组合物和方法
公开(公告)号：US08092707B2
公开(公告)日：2012-01-10
申请号：US11839329
申请日：2007-08-15
申请人： L. Charles Hardy , Heather K. Kranz , Thomas E. Wood , David A. Kaisaki , John J. Gagliardi , John C. Clark , Patricia M. Savu , Philip G. Clark
发明人： L. Charles Hardy , Heather K. Kranz , Thomas E. Wood , David A. Kaisaki , John J. Gagliardi , John C. Clark , Patricia M. Savu , Philip G. Clark
IPC分类号： C09K13/00
CPC分类号： H01L21/31053 , B24B37/044 , B24B37/245 , C09G1/02 , H01L21/3212
摘要： The disclosure pertains to compositions and methods for modifying or refining the surface of a wafer suited for semiconductor fabrication. The compositions include working liquids useful in modifying a surface of a wafer suited for fabrication of a semiconductor device. In some embodiments, the working liquids are aqueous solutions of initial components substantially free of loose abrasive particles, the components including water, a surfactant, and a pH buffer exhibiting at least one pKa greater than 7. In certain embodiments, the pH buffer includes a basic pH adjusting agent and an acidic complexing agent, and the working liquid exhibits a pH from about 7 to about 12. In further embodiments, the disclosure provides a fixed abrasive article comprising a surfactant suitable for modifying the surface of a wafer, and a method of making the fixed abrasive article. Additional embodiments describe methods that may be used to modify a wafer surface.
摘要翻译：本公开涉及用于改性或精制适于半导体制造的晶片表面的组合物和方法。组合物包括可用于改性适于制造半导体器件的晶片表面的工作液体。在一些实施方案中，工作液体是基本上不含松散磨料颗粒的初始组分的水溶液，组分包括水，表面活性剂和显示出至少一个pKa大于7的pH缓冲液。在某些实施方案中，pH缓冲剂包括碱性pH调节剂和酸性络合剂，并且工作液体的pH为约7至约12.在另外的实施方案中，本公开提供了包含适于改性晶片表面的表面活性剂的固定磨料制品，以及方法制造固定的磨料制品。另外的实施例描述了可用于修改晶片表面的方法。

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