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    • 1. 发明授权
    • Method for laminating polymer films
    • 聚合物膜的层压方法
    • US5110387A
    • 1992-05-05
    • US657295
    • 1991-02-19
    • John F. JasinskiRobert P. McCormickRicky C. MellingerJames K. DraperNavin N. Vyas
    • John F. JasinskiRobert P. McCormickRicky C. MellingerJames K. DraperNavin N. Vyas
    • B32B37/20
    • B32B37/203B32B37/04B32B37/1284B32B38/0036Y10T156/1044
    • The present invention discloses a method for laminating at least two polymer films. An intermediate assembly 40 is made comprising an adhesive film 20 and a dielectric polymer film 12. The method comprises the steps of: selecting an adhesive film 20 with a melting point T.sub.1, the adhesive film having inner and outer major surfaces 22, 24; selecting a polymer film 12, with a melting point T.sub.2, where T.sub.2 >T.sub.1, the polymer film having inner and outer major surfaces 14, 16; subjecting the inner surface 14 of the polymer film 12 to a high voltage electric discharge to form a treated inner surface; heating the polymer film 12 having the treated inner surface to a temperature greater than T.sub.1 ; aligning the inner adhesive surface 22 and the inner treated polymer surface 14 in opposed facing relationship; applying pressure to urge the films 12, 20 relatively together; and heating the pressed together films to a temperature greater than T.sub.1 ; whereby the adhesive film 20 adheres to the polymer film 12 to form the intermediate laminated assembly 40. The intermediate assembly 40 is bondable to another substrate 28 to form a resultant laminated assembly 42, which may be formed into an article such as connector 44 wherein the intermediate laminate 40 remains assuredly bonded to substrate 28.
    • 本发明公开了一种层压至少两种聚合物膜的方法。 制造中间组件40,其包括粘合膜20和电介质聚合物膜12.该方法包括以下步骤:选择具有熔点T1的粘合膜20,所述粘合膜具有内外主表面22,24; 选择具有熔点T2的聚合物膜12,其中T2> T1,聚合物膜具有内表面和外主表面14,16; 对聚合物膜12的内表面14进行高电压放电以形成经处理的内表面; 将具有经处理的内表面的聚合物膜12加热到大于T1的温度; 以相对的面对关系对准内部粘合剂表面22和内部处理的聚合物表面14; 施加压力以相对地一起推动膜12,20; 并且将压制在一起的膜加热到大于T1的温度; 由此粘合剂膜20粘合到聚合物膜12上以形成中间层压组件40.中间组件40可粘合到另一基底28上以形成所得到的层压组件42,其可形成诸如连接件44的制品,其中 中间层压体40保持可靠地结合到基底28。
    • 4. 发明授权
    • Non-flammable and strippable plating resist and method of using same
    • 不易燃和可剥离的电镀抗蚀剂及其使用方法
    • US5035918A
    • 1991-07-30
    • US343764
    • 1989-04-26
    • Navin N. Vyas
    • Navin N. Vyas
    • C23C18/16C25D5/02G03F7/039H05K3/00H05K3/10
    • C25D5/022C23C18/1605C23C18/1608C23C18/1612C23C18/1637C23C18/182C23C18/54C25D5/024G03F7/039H05K3/108H05K3/0032
    • This invention is directed to a non-flammable plating resist with improved adhesion and edge covering characteristics which permits its selective removal by an ordinary laser ablation process or an energy efficient laser assisted process, and to the preferred method in using same to selectively plate a metal substrate, such as a nickel plated, electrically conductive metal with a precious metal. The preferred method comprises the steps of applying a thin uniform layer of such resist onto the substrate and drying the same in situ to a thickness greater than 100 microinches and less than 500 microinches, and drying same in situ, where such resist (a) is resistant to deterioration by chemical plating solutions of such precious metal, (b) is readily strippable in alkaline solutions, and (c) has a flashpoint in excess of 100.degree. F. A preferred formulation for such resist comprises, by weight, the following:______________________________________ Styrene acrylic co-polymer 61.5% suspension Butyl cellosolve 3.1% Butyl carbitol 7.4% Water, essentially the balance. ______________________________________ Thereafter, selected areas of said resist coated substrate are subjected to a controlled excimer laser pulse to remove such resist within said areas by an ablation process or a "patch blow off" energy efficient process, followed by plating the exposed areas of said substrate with a precious metal, and stripping said resist from the remaining portions of said metal substrate.
    • 本发明涉及一种不易燃的电镀抗蚀剂,其具有改进的粘附性和边缘覆盖特性,其允许通过普通的激光烧蚀工艺或能量有效的激光辅助工艺选择性去除,以及使用它来选择性地镀金属的优选方法 衬底,例如带有贵金属的镀镍导电金属。 优选的方法包括以下步骤:将这种抗蚀剂的薄均匀层施加到基底上并将其原位干燥至大于100微英寸且小于500微英寸的厚度,并将其原位干燥,其中该抗蚀剂(a)为 (b)易于在碱性溶液中剥离,并且(c)具有超过100°F的闪点。用于这种抗蚀剂的优选制剂包含重量百分比如下: - 丙烯酸丙烯酸共聚物61.5% - 悬浮 - 丁基溶纤剂3.1% - 丁基卡必醇7.4% - 水,基本上是平衡。 - 此后,所述抗蚀剂涂覆的基底的选定区域经受受控的准分子激光脉冲,以通过消融过程或“补片吹除”能量效率过程在所述区域内去除所述抗蚀剂,随后用 贵金属,并从所述金属基材的剩余部分剥离所述抗蚀剂。