专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07624910B2 Perforated composites for joining of metallic and composite materials 有权
标题翻译：用于金属和复合材料接合的穿孔复合材料
公开(公告)号：US07624910B2
公开(公告)日：2009-12-01
申请号：US11279970
申请日：2006-04-17
申请人： John E. Barnes , Robert W. Koon , Robert J. Olliffe , Stephen P. Engelstad
发明人： John E. Barnes , Robert W. Koon , Robert J. Olliffe , Stephen P. Engelstad
IPC分类号： B23K33/00 , B23K20/12
CPC分类号： C08J9/0023 , B23K20/1225 , B23K20/1275 , C08F112/08 , C08J9/0028 , C08J9/122 , C08J9/146 , C23C24/04
摘要： Embodiments in the present invention provide a system and method of joining structural members. This method involves aligning the first structural member to a metallic substrate when the first structural member has at least one tapered hole or cavity. A metallic or other like material suitable to cold spraying technology is deposited into the tapered cavity to form a shaped or tapered fastener bonded to the metallic substrate. The shape of the fastener secures the first structural member to the metallic substrate. Additionally, a protective insert may be placed within the shaped or tapered cavity to protect the first structural member during hoe cold spraying deposition when the first structural member is a composite material or other like material susceptible to erosion during the cold spraying technique. After the material has been deposited using cold spray techniques this material may be further solidified and bonded to the metallic substrate using a technique such as friction stir welding in order to increase the load carrying capacity of the in-situ shaped fastener.
摘要翻译：本发明的实施例提供了一种连接结构构件的系统和方法。该方法包括当第一结构构件具有至少一个锥形孔或空腔时将第一结构构件对准金属基底。适用于冷喷涂技术的金属或其它类似材料沉积在锥形腔中以形成结合到金属基底上的成型或锥形紧固件。紧固件的形状将第一结构构件固定到金属基底。此外，当第一结构构件是复合材料或在冷喷涂技术期间易于侵蚀的其它类似材料时，保护插入物可以放置在成形或锥形空腔内以保护第一结构构件。在使用冷喷涂技术沉积材料之后，该材料可以使用诸如摩擦搅拌焊接的技术进一步固化并结合到金属基底上，以增加原位形状的紧固件的承载能力。

2. 发明申请

US20080003401A1 METALLIC MINI HOOKS FOR JOINING OF METALLIC AND COMPOSITES 审中-公开
标题翻译：用于金属和复合材料接合的金属微型钩
公开(公告)号：US20080003401A1
公开(公告)日：2008-01-03
申请号：US11426937
申请日：2006-06-28
申请人： John E. Barnes , Robert W. Koon , Robert J. Olliffe , Stephen P. Engelstad
发明人： John E. Barnes , Robert W. Koon , Robert J. Olliffe , Stephen P. Engelstad
IPC分类号： B32B3/06
CPC分类号： B29C70/885 , B29C65/562 , B29C65/564 , B29C65/64 , B29C66/1122 , B29C66/21 , B29C66/30321 , B29C66/45 , B29C66/721 , B29C66/72141 , B29C66/742 , B29L2031/3076 , F16B5/07 , Y10T428/24008
摘要： A method for joining a first structural member and a metallic substrate is provided. This method involves drawing projections from a metallic substrate using a Co-Meld or other like process. Individual plies of composite materials may be laid upon the metallic substrate and projections. These projections penetrate the individual ply or layers of the composite material. A mechanical feature that serves as a retaining device may be located at the distal end of the projections in order to prevent separation of the composite materials from the metallic substrate. The composite materials may be infused with a resin or other material to complete the formation of the composite material. Additionally, other layers of composite material may be placed over the mechanical features located at the distal ends.
摘要翻译：提供了一种用于接合第一结构构件和金属基底的方法。该方法包括使用Co-Meld或其它类似方法从金属基底拉伸突起。复合材料的单个层可以铺设在金属基底和突起上。这些突起穿透复合材料的单层或多层。用作保持装置的机械特征可以位于突起的远端，以防止复合材料与金属基底分离。复合材料可以用树脂或其他材料注入以完成复合材料的形成。此外，复合材料的其它层可以放置在位于远端的机械特征上。

3. 发明授权

US5873973A Method for single filament transverse reinforcement in composite prepreg material 失效
标题翻译：复合预浸料材料单丝横向加固方法
公开(公告)号：US5873973A
公开(公告)日：1999-02-23
申请号：US422210
申请日：1995-04-13
申请人： Robert W. Koon , Thomas E. Steelman
发明人： Robert W. Koon , Thomas E. Steelman
IPC分类号： B29C70/24 , B29C70/54 , H01L41/08 , B32B5/12 , B32B31/00
CPC分类号： B29C70/543 , B29C70/24
摘要： A method and apparatus for producing a reinforced composite prepreg material comprising the steps of aligning discontinuous fibers by use of a strong electric field while simultaneously inserting the fibers through a mesh screen and into a ply or plies of fiber reinforced polymer matrix composite in an uncured state in a direction normal to the surface of the composite material. After the fibers are attached in the ply of fiber reinforced polymer matrix composite, the aligned fibers are forced through the composite material by applying a gentle pressure to the top of the conductive fibers while simultaneously being guided by the mesh screen. After the insertion process has been completed, the mesh screen is lifted vertically away from the composite material and any unaligned fibers are simultaneously removed. The newly formed reinforced prepreg composite films are then stacked on top of each other and pressurized and cured in an autoclave or press to produce an improved composite laminate.
摘要翻译：一种用于生产增强复合预浸料坯材料的方法和装置，包括以下步骤：通过使用强电场对准不连续纤维，同时将纤维穿过网筛插入未固化状态的纤维增强聚合物基质复合材料层或层在垂直于复合材料表面的方向上。在纤维附着在纤维增强聚合物基质复合材料层中之后，通过在导电纤维的顶部施加温和的压力同时由网筛引导，将对准的纤维强制通过复合材料。插入过程完成后，将网格屏幕从复合材料垂直地提起，并且任何未对齐的纤维被同时移除。然后将新形成的增强的预浸料复合膜层叠在一起，并在高压釜或压机中进行加压和固化，以生产改进的复合层压板。

4. 发明授权

US5999408A Enhanced heat transfer in printed circuit boards 失效
标题翻译：增强印刷电路板中的传热
公开(公告)号：US5999408A
公开(公告)日：1999-12-07
申请号：US179013
申请日：1998-10-26
申请人： Robert W. Koon , Thomas E. Steelman
发明人： Robert W. Koon , Thomas E. Steelman
IPC分类号： H01L23/373 , H05K1/02 , H05K3/28 , H05K7/20
CPC分类号： H05K1/0209 , H01L23/3733 , H01L2924/0002 , H05K2201/0323 , H05K2203/105 , H05K3/284
摘要： A structure for providing an enhanced heat transfer capability in a circuit board having electronic components and which is at least in part cooled by a gas flowing around the board. The enhanced heat transfer structure includes thermally conductive fibers attached at a first end to an exterior surface of the circuit board and jutting out generally perpendicular to the exterior surface. These fibers are used to conduct heat from the circuit board and transfer it to the gas. The fibers are attached the circuit board by electrostatic fiber flocking methods. It is preferred that these thermally conductive fibers are carbon fibers. The fibers can be attached to the exterior surface of the circuit board by a layer of adhesive. The fibers also do not necessarily have to be attached to the entire circuit board. They may be attached to only a portion of it, such as to temperature sensitive electronic board components. The enhanced heat transfer structure can be incorporated during the assembly of the board, or where the circuit board is an existing unit, the thermally conductive fibers can be attached without removing electronic components disposed thereon. Thus existing circuit boards can be retrofitted.
摘要翻译：一种用于在具有电子部件的电路板中提供增强的传热能力的结构，并且至少部分地由围绕板流动的气体冷却。增强的传热结构包括在第一端附接到电路板的外表面并且大致垂直于外表面突出的导热纤维。这些纤维用于从电路板传导热量并将其转移到气体中。纤维通过静电纤维植绒方法附着在电路板上。这些导热性纤维优选为碳纤维。纤维可以通过一层粘合剂附着到电路板的外表面。纤维也不一定必须附着在整个电路板上。它们可以仅连接到其一部分，例如附着于温度敏感的电子板部件上。增强的传热结构可以在组装板期间加入，或者在电路板是现有单元的情况下，导热纤维可以在不去除设置在其上的电子部件的情况下被安装。因此现有的电路板可以进行改造。

5. 发明授权

US5725707A Enhanced conductive joints from fiber flocking 失效
标题翻译：纤维植绒增强导电接头
公开(公告)号：US5725707A
公开(公告)日：1998-03-10
申请号：US419579
申请日：1995-04-10
申请人： Robert W. Koon , Thomas E. Steelman
发明人： Robert W. Koon , Thomas E. Steelman
IPC分类号： H01B1/04 , H01B1/24 , H01R13/24 , H01R4/58
CPC分类号： H01B1/04 , H01B1/24 , H01R13/2414 , Y10T29/49117 , Y10T29/49195 , Y10T29/49201
摘要： A method and apparatus for providing electrical conductivity between the opposing surface edges of gaps and joints in composite and metallic structures comprises fiber flocking a first and second set of conductive fibers in a direction normal to the surface edge of each side of the gap or joint. The first and second set of conductive fibers are positioned such that the conductive fibers interdigitate with respect to each other providing a compliant electrically conductive path between the opposing surface edges of the structural gaps and joints. After assembly, the defined joint or gap containing the interdigitated sets of carbon fibers may be filled with a polymer material or materials which constitute state of the art matrix materials used for conductive joints. Applications for this technology include electromagnetic shielding and low observables.
摘要翻译：用于在复合材料和金属结构中的间隙和接头的相对表面边缘之间提供导电性的方法和装置包括在垂直于间隙或接头的每一侧的表面边缘的方向上纤维地植入第一和第二组导电纤维。第一组导电纤维和第二组导电纤维被定位成使得导电纤维彼此相互指向，在结构间隙和接头的相对表面边缘之间提供柔顺的导电路径。在组装之后，包含交织的碳纤维组的限定的接头或间隙可以填充有构成用于导电接头的现有技术基体材料的聚合物材料或材料。该技术的应用包括电磁屏蔽和低可观测量。

6. 发明授权

US5898570A Enhanced heat transfer in printed circuit boards 失效
公开(公告)号：US5898570A
公开(公告)日：1999-04-27
申请号：US636611
申请日：1996-04-23
申请人： Robert W. Koon , Thomas E. Steelman
发明人： Robert W. Koon , Thomas E. Steelman
IPC分类号： H01L23/367 , H05K1/02 , H05K7/20
CPC分类号： H05K1/0209 , H01L23/3677 , H05K7/20427 , H01L2924/0002 , H05K2201/0323 , Y10T29/4935
摘要： A structure for providing an enhanced heat transfer capability in a circuit board having electronic components and which is at least in part cooled by a gas flowing around the board. The enhanced heat transfer structure includes thermally conductive fibers attached at a first end to an exterior surface of the circuit board and jutting out generally perpendicular to the exterior surface. These fibers are used to conduct heat from the circuit board and transfer it to the gas. The fibers are attached the circuit board by electrostatic fiber flocking methods. It is preferred that these thermally conductive fibers are carbon fibers. The fibers can be attached to the exterior surface of the circuit board by a layer of adhesive. The fibers also do not necessarily have to be attached to the entire circuit board. They may be attached to only a portion of it, such as to temperature sensitive electronic board components. The enhanced heat transfer structure can be incorporated during the assembly of the board, or where the circuit board is an existing unit, the thermally conductive fibers can be attached without removing electronic components disposed thereon. Thus existing circuit boards can be retrofitted.

7. 发明授权

US5852548A Enhanced heat transfer in printed circuit boards and electronic components thereof 失效
标题翻译：增强印刷电路板及其电子部件的传热
公开(公告)号：US5852548A
公开(公告)日：1998-12-22
申请号：US304018
申请日：1994-09-09
申请人： Robert W. Koon , Thomas E. Steelman
发明人： Robert W. Koon , Thomas E. Steelman
IPC分类号： H01L23/367 , H05K1/02 , H05K7/20
CPC分类号： H05K1/0209 , H01L23/3677 , H05K7/20427 , H01L2924/0002 , H05K2201/0323 , Y10T29/4935
摘要： A structure for providing an enhanced heat transfer capability in a circuit board having electronic components and which is at least in part cooled by a gas flowing around the board. The enhanced heat transfer structure includes thermally conductive fibers attached at a first end to at least a portion of the exterior surfaces of the circuit board and/or electronic components thereof. The fibers extend out from the aforementioned exterior surfaces in a generally perpendicular direction, and are used to conduct heat from the circuit board and/or electronic components, and transfer it to the surrounding gas. Electrostatic fiber flocking methods are employed to attached the fibers in the aforementioned perpendicular orientation. It is also preferred that these thermally conductive fibers are carbon fibers, and attached to the exterior surface of the circuit board by a layer of adhesive. The enhanced heat transfer structure can be incorporated during the assembly of the board, or where the circuit board is an existing unit, the thermally conductive fibers can be attached without removing electronic components disposed thereon. Thus existing circuit boards can be retrofitted.
摘要翻译：一种用于在具有电子部件的电路板中提供增强的传热能力的结构，并且至少部分地由围绕板流动的气体冷却。增强的传热结构包括在第一端附接到电路板的外表面的至少一部分和/或其电子部件的导热纤维。纤维从大致正交的方向从上述外表面延伸出来，用于从电路板和/或电子部件传导热量，并将其传送到周围的气体。采用静电纤维植绒方法将纤维以上述垂直取向连接。还优选这些导热纤维是碳纤维，并且通过粘合剂层附着到电路板的外表面。增强的传热结构可以在组装板期间加入，或者在电路板是现有单元的情况下，导热纤维可以在不去除设置在其上的电子部件的情况下被安装。因此现有的电路板可以进行改造。

8. 发明授权

US5580512A Method for making low cost oriented composite molding compound 失效
标题翻译：低成本取向复合模塑料的制备方法
公开(公告)号：US5580512A
公开(公告)日：1996-12-03
申请号：US418745
申请日：1995-04-07
申请人： Robert W. Koon , Chi H. Sheu , Brent R. Meredith
发明人： Robert W. Koon , Chi H. Sheu , Brent R. Meredith
IPC分类号： B29B11/16 , B29C70/14 , B29C70/30 , B29C43/20
CPC分类号： B29C70/14 , B29C70/305 , B29K2105/12 , B29K2307/00 , B29K2995/0005
摘要： A method for the manufacture of low cost "oriented" composite molding compounds using discontinuous fibers embedded in a resin matrix. The method involves the steps of aligning discontinuous fibers by use of a strong electric field while simultaneously inserting the fibers onto a polymer substrate comprised of an uncured resin matrix. A preferred embodiment includes the incorporation of a mesh or a glass capillary array located parallel and adjacent to the polymer substrate to further ensure fiber alignment. After the fibers are attached to the uncured resin matrix, the aligned fibers are forced to lie down parallel along the surface of the polymer substrate by mechanically forcing the fibers flat. The newly formed reinforced polymer films may then be stacked with the fibers of each ply oriented to achieve the desired mechanical properties, and then cured to produce an improved composite laminate which can be machined to form a high strength shaped member.
摘要翻译：一种使用嵌入树脂基质中的不连续纤维制造低成本“取向”复合模塑料的方法。该方法包括通过使用强电场对准不连续纤维的步骤，同时将纤维同时插入由未固化的树脂基质构成的聚合物基材上。优选的实施方案包括并入并邻近聚合物基质的网状物或玻璃毛细管阵列的结合，以进一步确保光纤对准。在将纤维附着到未固化的树脂基质上之后，通过机械地迫使纤维平坦化，使对准的纤维沿着聚合物基底的表面平行地躺下。然后可以将新形成的增强聚合物膜与各层的纤维层叠以获得期望的机械性能，然后固化以产生可加工成形成高强度成形构件的改进的复合层压板。

9. 发明授权

US5506293A Isotropic orientation of carbon fibers in resin matrix materials 失效
标题翻译：碳纤维在树脂基体材料中的各向同性取向
公开(公告)号：US5506293A
公开(公告)日：1996-04-09
申请号：US304035
申请日：1994-09-09
申请人： Thomas E. Steelman , Robert W. Koon
发明人： Thomas E. Steelman , Robert W. Koon
IPC分类号： B29C35/02 , B29C65/34 , B29C65/48 , B29C70/58 , C08K7/02 , C08J5/06 , C08K3/04 , C08L101/00
CPC分类号： C08K7/02 , B29C35/0272 , B29C65/3436 , B29C65/48 , B29C65/4855 , B29C65/4875 , B29C65/488 , B29C66/1122 , B29C66/43 , B29C70/58 , B29C65/3416 , B29C65/3492 , B29K2105/126 , B29K2307/00 , B29K2995/0005 , B29K2995/0006 , B29K2995/0013
摘要： An isotropic resin matrix material includes resin doped with fiberballs. Fiberballs are formed from a plurality of fibers generally radiating outward from a common node. These fibers are of sufficient numbers and separation at a distal end to form a spherical shape. The fiberballs are uniformly distributed throughout the resin. Preferably, the fibers making up the fiberballs are carbon fibers. The carbon fibers impart thermal and electrical conductivity, or dielectric loss characteristics in some configurations. These conductivity and loss characteristics are isotropic in they are the same no matter where the electrical or thermal energy is applied due to the radial structure and uniform distribution of the fiberballs. The fiberballs may also be saturated with a phase change material and encapsulated in a shell so as to impart a heat dissipation capacity to the resin matrix material. Heat impinging on the resin matrix material is transferred to the phase change material via the surface of the individual fibers making up the fiberball. Here again, the radial structure and uniform distribution of the fiberballs imparts an isotropic nature to the heat dissipation capacity.
摘要翻译：各向同性树脂基体材料包括掺有纤维球的树脂。纤维球由通常从公共节点向外辐射的多根纤维形成。这些纤维具有足够的数量并在远端分离以形成球形。纤维球均匀地分布在整个树脂中。优选地，构成纤维球的纤维是碳纤维。碳纤维在一些配置中赋予热导和电导率或介电损耗特性。这些导电性和损耗特性是各向同性的，它们是相同的，无论由于径向结构和纤维球的均匀分布而施加电或热能。纤维球也可以用相变材料饱和并包封在壳中，以赋予树脂基质材料散热能力。通过构成纤维球的各个纤维的表面将撞击在树脂基质材料上的热量转移到相变材料中。再次，纤维球的径向结构和均匀分布赋予散热能力各向同性的特性。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式