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1. 发明授权

US07157990B1 Radio frequency device and method using a carbon nanotube array 有权
标题翻译：射频装置和使用碳纳米管阵列的方法
公开(公告)号：US07157990B1
公开(公告)日：2007-01-02
申请号：US10850152
申请日：2004-05-21
申请人： John Douglas Adam , Robert Miles Young
发明人： John Douglas Adam , Robert Miles Young
IPC分类号： H03H9/46 , H03H9/52 , H03H9/24
CPC分类号： H03H9/02259 , H03H9/2405 , H03H9/505 , H03H2009/02488 , Y10S977/723 , Y10S977/724 , Y10S977/742 , Y10S977/932
摘要： A radio frequency (RF) filter includes a substrate, first and second dielectric layers formed on first and second portions of the substrate, a ground plane formed on a third portion of said substrate, a carbon nanotube array, and first and second electrodes. The third portion of the substrate includes, at least in part, the area between the first and second portions thereof. The carbon nanotube array is formed on a portion of said ground plane between the first and second dielectric layers. The first and second electrodes are formed on the first and second dielectric layers, such that an RF signal may be input to and output from the carbon nanotube array via the first and second signal guides. A third electrode is disposed over the carbon nanotube array and is used to voltage bias the array.
摘要翻译：射频（RF）滤波器包括衬底，形成在衬底的第一和第二部分上的第一和第二电介质层，形成在所述衬底的第三部分上的接地平面，碳纳米管阵列以及第一和第二电极。衬底的第三部分至少部分地包括其第一和第二部分之间的区域。在第一和第二电介质层之间的所述接地平面的一部分上形成碳纳米管阵列。第一和第二电极形成在第一和第二电介质层上，使得RF信号可以经由第一和第二信号引导件输入到碳纳米管阵列并从碳纳米管阵列输出。第三电极设置在碳纳米管阵列上方并用于对阵列施加偏压。

2. 发明授权

US11600760B2 Cooler device with aluminum oxide insulators 有权
公开(公告)号：US11600760B2
公开(公告)日：2023-03-07
申请号：US16696372
申请日：2019-11-26
申请人： Aaron Ashley Hathaway , John X. Przybysz , Robert Miles Young , Edward R. Engbrecht
发明人： Aaron Ashley Hathaway , John X. Przybysz , Robert Miles Young , Edward R. Engbrecht
IPC分类号： H01L39/06 , F25B21/02 , H01L39/02 , H01L39/24
摘要： A solid state cooler device is disclosed that comprises a first normal metal pad, a first aluminum layer and a second aluminum layer disposed on the first normal metal pad and separated from one another by a gap, a first aluminum oxide layer formed on the first aluminum layer, and a second aluminum oxide layer formed on the second aluminum layer, and a first superconductor pad disposed on the first aluminum oxide layer and a second superconductor pad disposed on the second aluminum oxide layer. The device further comprises a first conductive pad coupled to the first superconductor pad, and a second conductive pad coupled to the second superconductor pad, wherein hot electrons are removed from the first normal metal pad when a bias voltage is applied between the first conductive pad and the second conductive pad.

3. 发明授权

US09257647B2 Phase change material switch and method of making the same 有权
标题翻译：相变材料开关及其制作方法
公开(公告)号：US09257647B2
公开(公告)日：2016-02-09
申请号：US13828351
申请日：2013-03-14
申请人： Pavel Borodulin , Nabil Abdel-Meguid El-Hinnawy , Robert Miles Young , Robert S. Howell , John R. Mason, Jr. , Brian Paul Wagner , Matthew Russell King , Evan B. Jones , Michael J. Lee , Marc Eisenzweig Sherwin
发明人： Pavel Borodulin , Nabil Abdel-Meguid El-Hinnawy , Robert Miles Young , Robert S. Howell , John R. Mason, Jr. , Brian Paul Wagner , Matthew Russell King , Evan B. Jones , Michael J. Lee , Marc Eisenzweig Sherwin
IPC分类号： H01L45/00
CPC分类号： H01L45/1625 , H01L45/06 , H01L45/1206 , H01L45/1226 , H01L45/126 , H01L45/1286 , H01L45/144 , H01L45/1641 , H01L45/1666
摘要： A phase change material (PCM) switch is disclosed that includes a resistive heater element, and a PCM element proximate the resistive heater element. A thermally conductive electrical insulating barrier layer positioned between the PCM heating element and the resistive heating element, and conductive lines extend from ends of the PCM element and control lines extend from ends of the resistive heater element.
摘要翻译：公开了一种相变材料（PCM）开关，其包括电阻加热器元件和靠近电阻加热器元件的PCM元件。定位在PCM加热元件和电阻加热元件之间的导热电绝缘阻挡层，导电线从PCM元件的端部延伸，控制线从电阻加热元件的端部延伸。

4. 发明申请

US20140264230A1 PHASE CHANGE MATERIAL SWITCH AND METHOD OF MAKING THE SAME 有权
标题翻译：相变材料开关及其制造方法
公开(公告)号：US20140264230A1
公开(公告)日：2014-09-18
申请号：US13828351
申请日：2013-03-14
申请人： PAVEL BORODULIN , Nabil Abdel-Meguid El-Hinnawy , Robert Miles Young , Robert S. Howell , John R. Mason , Brian Paul Wagner , Matthew Russell King , Evan B. Jones , Michael J. Lee , Mark Eisenzweig Sherwin
发明人： PAVEL BORODULIN , Nabil Abdel-Meguid El-Hinnawy , Robert Miles Young , Robert S. Howell , John R. Mason , Brian Paul Wagner , Matthew Russell King , Evan B. Jones , Michael J. Lee , Mark Eisenzweig Sherwin
IPC分类号： H01L45/00
CPC分类号： H01L45/1625 , H01L45/06 , H01L45/1206 , H01L45/1226 , H01L45/126 , H01L45/1286 , H01L45/144 , H01L45/1641 , H01L45/1666
摘要： A phase change material (PCM) switch is disclosed that includes a resistive heater element, and a PCM element proximate the resistive heater element. A thermally conductive electrical insulating barrier layer positioned between the PCM heating element and the resistive heating element, and conductive lines extend from ends of the PCM element and control lines extend from ends of the resistive heater element
摘要翻译：公开了一种相变材料（PCM）开关，其包括电阻加热器元件和靠近电阻加热器元件的PCM元件。位于PCM加热元件和电阻加热元件之间的导热电绝缘阻挡层，导线从PCM元件的端部延伸，控制线从电阻加热元件的端部延伸

5. 发明授权

US11333413B2 Solid state cooler device 有权
公开(公告)号：US11333413B2
公开(公告)日：2022-05-17
申请号：US16554203
申请日：2019-08-28
申请人： Robert Miles Young , Aaron Ashley Hathaway , John X. Przybysz , Gregory R. Boyd , Zachary A. Stegen , Edward R. Engbrecht , Aaron A. Pesetski , Marc Eisenzweig Sherwin
发明人： Robert Miles Young , Aaron Ashley Hathaway , John X. Przybysz , Gregory R. Boyd , Zachary A. Stegen , Edward R. Engbrecht , Aaron A. Pesetski , Marc Eisenzweig Sherwin
IPC分类号： F25B21/00 , F25D31/00 , H01L39/06 , H01L23/00
摘要： A solid state cooler device is provided that includes a substrate, a first and second conductive pad disposed on the substrate, a first and second superconductor pad each having a side with a plurality of conductive pad contact interfaces spaced apart from one another and being in contact with a surface of respective first and second conductive pads, and a first and second insulating layer disposed between respective first and second superconductor pads, and respective ends of a normal metal layer. A bias voltage is applied between one of a first conductive pad or first superconductor pad and one of the second conductive pad or the second superconductor pad to remove hot electrons from the normal metal layer, and the contact area of the plurality of first and second conductive pad contact interfaces inhibits the transfer of heat back to the first and second superconductor pads.

6. 发明授权

US10700270B2 PCM switch and method of making the same 有权
公开(公告)号：US10700270B2
公开(公告)日：2020-06-30
申请号：US15188754
申请日：2016-06-21
申请人： Pavel Borodulin , Nabil Abdel-Meguid El-Hinnawy , Robert Miles Young
发明人： Pavel Borodulin , Nabil Abdel-Meguid El-Hinnawy , Robert Miles Young
IPC分类号： H01H11/00 , H01L45/00 , G11C13/00
摘要： One example includes a method for making a switch. The method includes forming an insulating layer over a substrate. The method also includes forming a resistive heating material over the insulating layer. The method also includes depositing a thermally conductive electrically insulating barrier layer over the heating material. The method also includes forming a phase-change material (PCM) component over the barrier layer spaced apart and proximal to the resistive heating material. The method also includes forming a quench layer proximal to at least one of the resistive heating material and the PCM component. The method further includes forming conductive lines from ends of the PCM component and control lines from ends of the resistive heating material.

7. 发明授权

US10644218B1 Multichip device with temperature isolating bump bonds 有权
公开(公告)号：US10644218B1
公开(公告)日：2020-05-05
申请号：US16352512
申请日：2019-03-13
申请人： Aaron Ashley Hathaway , Robert Miles Young , Patrick Alan Loney , Justin Hackley
发明人： Aaron Ashley Hathaway , Robert Miles Young , Patrick Alan Loney , Justin Hackley
IPC分类号： H01L39/12 , H01L25/04
CPC分类号： H01L39/12 , H01L25/04
摘要： A superconducting structure is provided that comprises a first superconducting device coupled to a second superconducting device employing a plurality of superconducting bump bond structures. Each of the plurality of superconducting bump bond structures comprise a first normal metal layer disposed on the top surface of a given one of a plurality of first contact pads, a second normal metal layer disposed on the top surface of a given one of a plurality of second contact pads, and a superconducting metal layer disposed between the first normal metal layer and the second normal metal layer. The metal thicknesses of each of the first normal metal layer, the second normal metal layer, and the specific material of the superconducting metal and normal metal are selected to inhibit the transfer of heat between the first superconducting device and the second superconducting device.

8. 发明授权

US10490374B2 Phase-change material distributed switch systems 有权
公开(公告)号：US10490374B2
公开(公告)日：2019-11-26
申请号：US14485211
申请日：2014-09-12
申请人： Pavel Borodulin , Nabil Abdel-Meguid El-Hinnawy , Robert Miles Young , Matthew Russell King , Michael J. Lee
发明人： Pavel Borodulin , Nabil Abdel-Meguid El-Hinnawy , Robert Miles Young , Matthew Russell King , Michael J. Lee
IPC分类号： H01H37/46 , H01L45/00 , H01P1/12 , H01P1/18
CPC分类号： H01H37/46 , H01L45/06 , H01L45/1206 , H01L45/1286 , H01L45/144 , H01P1/127 , H01P1/184
摘要： One embodiment of the invention includes a phase-change material switch. The switch includes a first terminal that receives an input signal and a second terminal. The switch includes an actuation portion that receives a control signal in one of a first state to emit a first heat profile and a second state to emit a second heat profile. The switch further includes a switch portion comprising a phase-change material arranged as a plurality of longitudinal strips that each interconnect the first terminal and the second terminal and that are each in proximity with the actuation portion. The phase-change material can be selectable between a conducting state in response to the first heat profile to conduct an input signal from the first terminal to the second terminal and a blocking state in response to the second heat profile to block the input signal from the first terminal to the second terminal.

9. 发明申请

US20210063060A1 SOLID STATE COOLER DEVICE 有权
公开(公告)号：US20210063060A1
公开(公告)日：2021-03-04
申请号：US16554203
申请日：2019-08-28
申请人： Robert Miles Young , Aaron Ashley Hathaway , John X. Przybysz , Gregory R. Boyd , Zachary A. Stegen , Edward R. Engbrecht , Aaron A. Pesetski , Marc Eisenzweig Sherwin
发明人： Robert Miles Young , Aaron Ashley Hathaway , John X. Przybysz , Gregory R. Boyd , Zachary A. Stegen , Edward R. Engbrecht , Aaron A. Pesetski , Marc Eisenzweig Sherwin
IPC分类号： F25B21/00 , H01L39/06 , F25D31/00
摘要： A solid state cooler device is provided that includes a substrate, a first and second conductive pad disposed on the substrate, a first and second superconductor pad each having a side with a plurality of conductive pad contact interfaces spaced apart from one another and being in contact with a surface of respective first and second conductive pads, and a first and second insulating layer disposed between respective first and second superconductor pads, and respective ends of a normal metal layer. A bias voltage is applied between one of a first conductive pad or first superconductor pad and one of the second conductive pad or the second superconductor pad to remove hot electrons from the normal metal layer, and the contact area of the plurality of first and second conductive pad contact interfaces inhibits the transfer of heat back to the first and second superconductor pads.

10. 发明授权

US10229864B1 Cryogenic integrated circuit having a heat sink coupled to separate ground planes through differently sized thermal vias 有权
公开(公告)号：US10229864B1
公开(公告)日：2019-03-12
申请号：US15704919
申请日：2017-09-14
申请人： Patrick Loney , Robert Miles Young , Daniel Robert Queen , Aaron Ashley Hathaway , John X. Przybysz
发明人： Patrick Loney , Robert Miles Young , Daniel Robert Queen , Aaron Ashley Hathaway , John X. Przybysz
IPC分类号： H05K1/02 , H01L27/18 , H01L23/367 , H01L23/373 , H01L23/433
摘要： An integrated circuit is provided that comprises a thermal sink layer, a first ground plane associated with a first set of circuits that have a first operational temperature requirement, and a first thermally conductive via that couples the first ground plane to the thermal sink layer. The circuit further comprises a second ground plane associated with a second set of circuits that have a second operational temperature requirement that is higher than the first operational temperature requirement, and a second thermally conductive via that couples the second ground plane to the thermal sink layer, wherein the first thermally conductive via has a greater volume of thermal conductive material than the second thermally conductive via to remove heat from the first set of circuits with less gradient than the second set of circuits.

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