专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US4695700A Dual detector system for determining endpoint of plasma etch process 失效
标题翻译：用于确定等离子体蚀刻工艺终点的双检测器系统
公开(公告)号：US4695700A
公开(公告)日：1987-09-22
申请号：US663903
申请日：1984-10-22
申请人： John D. Provence , Frederick W. Brown , John I. Jones
发明人： John D. Provence , Frederick W. Brown , John I. Jones
IPC分类号： H01J37/32 , B23K15/00
CPC分类号： H01J37/32935 , H01J37/3244
摘要： A dual detector spectroscopic endpoint determination system is used which has dual channels that enables the combination of channels to increase gain, cancel out background noise, and to use either one or more spectroscopic channels.
摘要翻译：使用双检测器光谱终点确定系统，其具有双通道，其使得通道的组合能够增加增益，抵消背景噪声以及使用一个或多个光谱通道。

2. 发明授权

US4659413A Automated single slice cassette load lock plasma reactor 失效
标题翻译：自动单片盒装载锁定等离子体反应堆
公开(公告)号：US4659413A
公开(公告)日：1987-04-21
申请号：US664448
申请日：1984-10-24
申请人： Cecil J. Davis , John E. Spencer , Randall E. Johnson , Rhett B. Jucha , Frederick W. Brown , Stanford P. Kohan
发明人： Cecil J. Davis , John E. Spencer , Randall E. Johnson , Rhett B. Jucha , Frederick W. Brown , Stanford P. Kohan
IPC分类号： H01J37/18 , H01L21/306 , B44C1/22 , C03C15/00 , C23F1/02
CPC分类号： H01J37/185
摘要： A plasma etch system that processes one slice at a time is disclosed. The system is comprised of an entry loadlock, an exit loadlock, a main chamber, vacuum pumps, RF power supply, RF matching network, a heat exchanger, throttle valve and pressure control gas flow distribution and a microprocessor controller. A multiple slice cassette full of slices is housed in the entry load lock and after pumping to process pressure, a single slice at a time is moved by an articulated arm from the cassette through an isolation gate to the main process chamber. The slice is etched and removed from the main process chamber through a second isolation gate by a second articulated arm to a cassette in the exit loadlock. The process is repeated until all semiconductor wafers have been etched. The cassette loadlock system is able to evacuate a whole cassette of semiconductor wafers for processing which lowers the particulate environment for the slices and, provides a more stable environment for the slices by removal of moisture and preventing static discharges and additionally provides a safety feature that protects the operators from harsh or toxic gases that are traditionally used in semiconductor type plasma reactor.
摘要翻译：公开了一次处理一个片的等离子体蚀刻系统。该系统包括入口负载锁，出口负载锁，主室，真空泵，RF电源，RF匹配网络，热交换器，节流阀和压力控制气体流量分配以及微处理器控制器。充满切片的多切片盒被容纳在进入加载锁中，并且在泵送处理压力之后，一次一个切片由关节臂从盒通过隔离门移动到主处理室。该切片通过第二隔离门从主处理室被蚀刻并从第二铰接臂移除到出口加载锁中的盒。重复该过程，直到所有半导体晶片被蚀刻。盒式负载锁定系统能够抽出整个半导体晶片盒进行处理，这降低了切片的颗粒环境，并且通过去除湿气并防止静电放电为切片提供更稳定的环境，并且另外提供了保护传统上用于半导体等离子体反应器的恶劣或有毒气体的操作者。

3. 发明授权

US4657620A Automated single slice powered load lock plasma reactor 失效
标题翻译：自动单片动力装载等离子体反应堆
公开(公告)号：US4657620A
公开(公告)日：1987-04-14
申请号：US663905
申请日：1984-10-22
申请人： Cecil J. Davis , John E. Spencer , Dan T. Hockersmith , Randall C. Hildenbrand , Frederick W. Brown , Stanford P. Kohan
发明人： Cecil J. Davis , John E. Spencer , Dan T. Hockersmith , Randall C. Hildenbrand , Frederick W. Brown , Stanford P. Kohan
IPC分类号： H01L21/302 , H01J37/32 , H01L21/3065 , H01L21/306 , B44C1/22 , C03C15/00 , C23F1/02
CPC分类号： H01J37/32
摘要： A plasma reactor for the manufacturing of semiconductor devices has powered loadlocks and a main process chamber where slices can be processed one slice at a time with pre-etch plasma treatments before the main etching processing and afterwards receive a post etch treatment. The system comprises powered loadlocks, a main chamber, vacuum pumps radio frequency power supplier, radio frequency matching networks, heat exchangers and throttle valve and pressure controllers, gas flow distribution and microprocessor controllers. The semiconductor wafers are automatically fed one at a time from storage cassettes through isolation gates with articulated mechanical arms to a powered entry loadlock for pre-etching processes. At the completion of the pre-etching processing, the semiconductor wafer is transferred to the main chamber automatically for the main etch process and then to the powered exit loadlock for post etch treatment and finally to an output cassette.
摘要翻译：用于制造半导体器件的等离子体反应器具有动力负载锁和主处理室，其中可以在主蚀刻处理之前用预蚀刻等离子体处理一次一片地处理切片，然后进行后蚀刻处理。该系统包括动力装载锁，主室，真空泵射频电源，射频匹配网，热交换器和节流阀和压力控制器，气流分配和微处理器控制器。半导体晶片一次一个地从存储盒通过具有关节式机械臂的隔离门自动馈送到用于预蚀刻工艺的动力入口负载锁。在完成预蚀刻处理之前，将半导体晶片自动转移到主室用于主蚀刻工艺，然后转移到用于后蚀刻处理的动力出口负载锁，最后转移到输出盒。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式