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1. 发明授权

US4925024A Hermetic high frequency surface mount microelectronic package 失效
标题翻译：密封高频表面贴装微电子封装
公开(公告)号：US4925024A
公开(公告)日：1990-05-15
申请号：US239018
申请日：1988-08-26
申请人： John C. Ellenberger , Inbae Yoo , Eugene V. Burdick
发明人： John C. Ellenberger , Inbae Yoo , Eugene V. Burdick
IPC分类号： H01L23/10 , H01L23/66 , H01L25/16 , H05K1/02 , H05K3/34
CPC分类号： H01L23/66 , H01L23/10 , H01L25/165 , H01L2224/16 , H01L2924/01025 , H01L2924/01078 , H01L2924/01079 , H01L2924/16152 , H01L2924/3011 , H01L2924/3025 , H05K1/0237 , H05K3/3421
摘要： A hermetic package for microelectronic circuits comprises a ceramic base with conductive, hermetically sealed vias that connect the metal ground plane on the bottom of the base to the circuit on the top, a ceramic frame sealed to the top of the base, leads sealed between the frame and the base, and a lid sealed to the top of the frame. The vias are cofired with the ceramic base and provide good power dissipation because of their thermal conductivity and good RF grounds to isolate different stages in the circuit. Because the vias are hermetically sealed, no separate bottom component and no brazing operation is required to hermetically seal the package. The leads have a tapered section so the leads are wider outside the package reducing inductance and narrower going through the ceramic frame to reduce capacitance, thus tuning the leads to close to 50 ohm impedance. A layer of conducting silver loaded solder glass underneath the lead electrically connects the lead to the circuit and seals the lead to the base. A nonconducting layer of lead oxide solder glass over the lead seals the lead to the ceramic frame. The top surface of the frame has a metallized layer so that the lid can be hermetically sealed to the frame by soldering.
摘要翻译：用于微电子电路的密封封装包括具有导电密封通孔的陶瓷基底，其将基底的金属接地平面连接到顶部的电路，将陶瓷框架密封到基座的顶部，框架和基座，以及密封到框架顶部的盖子。通孔与陶瓷基体共烧，由于它们的导热性和良好的RF接地，隔离电路中的不同级，提供良好的功耗。由于通孔是密封的，所以不需要单独的底部部件，并且不需要钎焊操作来密封包装。引线具有锥形部分，因此引线在封装外部更宽，减小了电感，并且通过陶瓷框架更窄，以减少电容，从而将引线调谐到接近50欧姆的阻抗。在引线下方的一层导电银负载焊料玻璃将导线电连接到电路并将引线密封到基座。导线上的氧化铅焊料玻璃的非导电层将导线密封到陶瓷框架上。框架的顶面具有金属化层，使得盖可以通过焊接气密地密封到框架。

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