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    • 5. 发明授权
    • Microphone
    • 麦克风
    • US08917897B2
    • 2014-12-23
    • US13318248
    • 2011-03-16
    • Yusuke NakagawaYasuhiro HorimotoTadashi InoueToshiyuki Takahashi
    • Yusuke NakagawaYasuhiro HorimotoTadashi InoueToshiyuki Takahashi
    • H04R9/08H04R11/04H04R17/02H04R19/04H04R21/02H04R1/04H04R1/06
    • H04R1/04H01L2224/16225H04R1/06H04R19/04
    • Provided is a microphone capable of reducing a plane area seen from above, and further increasing a capacity of a back chamber of an acoustic sensor. An interposer 52 is mounted on a top surface of a circuit board 43, and an acoustic sensor 51 is mounted on the top surface thereof. A signal processing circuit 53 is accommodated in a space 70 provided in the interposer 52, and mounted on the circuit board 43. The acoustic sensor 51 is connected to the circuit board 43 through a wiring structure provided in the interposer 52. The acoustic sensor 51, the interposer 52 and the like are covered by a cover 42 put on the top surface of the circuit board 43. In the cover 42, a sound introduction hole 48 is opened in a position opposed to the front chamber of the acoustic sensor 51. The interposer 52 is formed with a ventilation notch 71 for acoustically communicating a space below a diaphragm 56 of the acoustic sensor 51 with a space inside the cover 42 and outside the interposer 52.
    • 提供了能够减少从上方看到的平面区域并进一步增加声学传感器的后室的容量的麦克风。 插入器52安装在电路板43的顶表面上,声传感器51安装在其顶表面上。 信号处理电路53容纳在设置在插入器52中的空间70中,并且安装在电路板43上。声传感器51通过设置在插入器52中的布线结构连接到电路板43.声传感器51 插入器52等被放置在电路板43的上表面上的盖42覆盖。在盖42中,声音引入孔48在与声学传感器51的前室相对的位置打开。 内插件52形成有通气凹口71,用于将声传感器51的隔膜56下方的空间与罩42内的空间和插入件52外部隔开。