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    • 10. 发明授权
    • Preparation of photoformed plastic multistrate by via formation first
    • 首先通过通孔形成制备光致变形塑料多药
    • US4572764A
    • 1986-02-25
    • US681189
    • 1984-12-13
    • Roxy N. Fan
    • Roxy N. Fan
    • H05K3/00H05K3/10H05K3/18H05K3/24H05K3/46B44C1/22B05D5/12G03C5/00
    • H05K3/0023H05K3/184H05K3/4661H05K2201/0347H05K2201/0376H05K2201/09509H05K2203/0525H05K2203/072H05K2203/1415H05K3/102H05K3/246Y10T29/49155Y10T29/49165Y10T29/49204
    • Process for preparing multilayer printed circuits comprising laminating to a substrate bearing a circuit pattern or electrically conductive surface a photosensitive layer which is tacky or becomes tacky upon exposure; exposing the laminate to actinic radiation through a via image related to the underlying circuit pattern, if present; optionally removing the removable via image of the photosensitive layer in either the exposed or unexposed areas, e.g., with a solvent or peeling apart by removal of a cover sheet, if present; laminating to the remaining tacky photosensitive layer a layer of a second photosensitive composition; exposing the laminate to actinic radiation through a registered image pattern of at least one overlying segment of the via image area and conductive circuit pattern to form an image surface having nontacky areas and removable circuit image areas; removing the removable circuit image areas of the photosensitive layer in the exposed or unexposed areas with a solvent therefor, or peeling apart by means of a cover sheet, if present, the removable via image areas of the lower photosensitive, if present, are removed by a solvent therefor; embedding finely divided material, e.g., copper, into the tacky areas; optionally curing the laminate by means of actinic radiation and/or heat; plating electrolessly to form an interconnected electrically conductive circuit. Additional circuit layers can be added.
    • 制备多层印刷电路的方法包括层压到承载电路图形或导电表面的基底上,所述光敏层在曝光时发粘或变粘, 通过与底层电路图案相关的通孔图像将层压体暴露于光化辐射(如果存在) 任选地在暴露或未曝光的区域(例如用溶剂)中去除感光层的可移除通孔图像,或者通过去除覆盖片(如果存在)剥离; 将第二感光组合物的层层压到剩余的粘性感光层上; 通过所述通孔图像区域和导电电路图案的至少一个覆盖段的注册图像图案将所述层压体暴露于光化辐射,以形成具有非粘性区域和可移除电路图像区域的图像表面; 通过其溶剂去除曝光或未曝光区域中的感光层的可移除电路图像区域,或者通过覆盖片剥离(如果存在),可以通过下部光敏剂的可移除通孔图像区域(如果存在的话)被 其溶剂; 将细碎的材料例如铜嵌入粘性区域中; 任选地通过光化辐射和/或加热固化层压体; 电化学镀以形成互连的导电电路。 可以添加额外的电路层。