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1. 发明授权

US06179599B2 Sealing ejector pin 失效
标题翻译：密封顶针
公开(公告)号：US06179599B2
公开(公告)日：2001-01-30
申请号：US09269984
申请日：1999-04-05
申请人： Johannes Lambertus Gerardus Maria Venrooij , Marcel Gerardus Antonius Tomassen
发明人： Johannes Lambertus Gerardus Maria Venrooij , Marcel Gerardus Antonius Tomassen
IPC分类号： B29C4502
CPC分类号： B29C45/4005 , B29C45/401 , B29C2045/4015 , B29C2045/4094 , Y10S425/047
摘要： The invention relates to an ejector pin receivable in a mold part of a mold for encapsulating electronic components mounted on a carrier, wherein the substantially cylindrical ejector pin is provided with a side wall in which at least one recess is arranged close to the end which makes contact with the product for ejecting. The invention also relates to a mold part in which an opening is arranged for guiding an ejector pin, wherein at least one recess is arranged in the wall of the opening. The invention further includes a mold for encapsulating electronic components, in addition to a method for sealing an interspace between an ejector pin and an opening in a mold part.
摘要翻译：本发明涉及可接收在模具中用于封装安装在载体上的电子部件的模具部分中的顶针，其中，大致圆柱形的推杆具有侧壁，其中至少一个凹部布置成靠近端部，与产品接触以进行喷射。本发明还涉及一种模具部件，其中布置有用于引导推杆的开口，其中至少一个凹部布置在开口的壁中。本发明还包括用于密封电子部件的模具，以及用于密封顶模销和模具部件中的开口之间的间隙的方法。

2. 发明授权

US06848174B2 Apparatus and method for processing electronic components 失效
标题翻译：用于处理电子部件的装置和方法
公开(公告)号：US06848174B2
公开(公告)日：2005-02-01
申请号：US10204518
申请日：2001-02-21
申请人： Johannes Lambertus Gerardus Maria Venrooij , Adrianus Henricus Ignatius Maria Verkuijlen
发明人： Johannes Lambertus Gerardus Maria Venrooij , Adrianus Henricus Ignatius Maria Verkuijlen
IPC分类号： H01L21/56 , H01L21/00 , H01L21/687 , H05K3/30 , B23P23/00
CPC分类号： H01L21/67236 , H01L21/67126 , H01L21/67271 , H01L21/68707 , Y10T29/4913 , Y10T29/49146 , Y10T29/49171 , Y10T29/5137 , Y10T29/5138 , Y10T29/5147 , Y10T29/53 , Y10T29/5313
摘要： The invention relates to an apparatus for processing electronic components, such as semi-conductor products, comprising at least two processing stations, at least one supply/discharge position for electronic components, a robot arm with engaging means for engaging the electronic components for displacing electronic components between the supply/discharge position and the processing stations, and a control for actuating the robot arm and the processing stations. The invention also relates to an assembly of at least two such apparatuses and to a method for processing electronic components which can be performed by means of the apparatus according to the invention.
摘要翻译：本发明涉及一种用于处理诸如半导体产品的电子部件的装置，包括至少两个处理站，用于电子部件的至少一个供应/排放位置，具有用于接合电子部件以用于移动电子部件的接合装置的机器人臂供给/排出位置和加工站之间的部件，以及用于致动机器人手臂和加工台的控制装置。本发明还涉及至少两个这样的设备的组件以及可以借助于根据本发明的设备来执行电子部件的方法。

3. 发明授权

US5656305A System for dosed conveying and selecting of cylindrical pellets for molding apparatus for lead frames 失效
标题翻译：用于定向输送和选择用于引线框架成型装置的圆柱形颗粒的系统
公开(公告)号：US5656305A
公开(公告)日：1997-08-12
申请号：US491877
申请日：1995-06-23
申请人： Johannes Lambertus Gerardus Maria Venrooij
发明人： Johannes Lambertus Gerardus Maria Venrooij
IPC分类号： B23Q7/12 , B23Q7/10 , B29C31/04 , B29C31/06 , B29C31/08 , B29C45/02 , B29C45/18 , B65G47/14 , B29C45/14
CPC分类号： B29C31/08 , B23Q7/10 , B29C45/1808 , B65G47/1421 , B29C2045/1891 , B29C31/06 , B29C45/02 , B29C45/14655 , B29K2105/255 , B29L2031/3406 , H01L2924/0002
摘要： The invention relates to a system for dosed conveying and selecting of pellets for a moulding apparatus for lead frames, with which it is possible to prevent crumbled pellets or fragments and/or dust thereof being able to reach the molding apparatus arranged in a so-called clean room. For this purpose the system has structure for successively conveying pellets one by one, structure for selecting to length and feeding pellets to a transporting path, structure for reducing the transporting speed of conveyed pellets, structure for separating the pellets one by one and tranferring the pellets to a transport carrier, and means for transferring pellets from the transport carrier to a conveying device to a mold of a molding apparatus.
摘要翻译： PCT No.PCT / EP93 / 03555。 371日期：1995年6月23日 102（e）1995年6月23日PCT 1993年12月13日PCT PCT。 WO94 / 14585 PCT公开日期：1994年7月7日本发明涉及一种用于定量输送和选择用于引线框架的成型设备的颗粒的系统，通过该系统可以防止破碎的颗粒或碎片和/或其灰尘能够到达布置的成型设备在一个所谓的洁净室。为此，该系统具有一个接一个地连续输送颗粒的结构，用于选择长度并将颗粒输送到输送路径的结构，用于降低输送的颗粒的输送速度的结构，逐个分离颗粒的结构，并将颗粒以及用于将颗粒从运输工具转移到输送装置到模制设备的模具的装置。

4. 发明授权

US07771184B2 Press with plate-like frame parts, and method for operating such a plate press 有权
标题翻译：按板状框架部件按压，以及操作这种印版机的方法
公开(公告)号：US07771184B2
公开(公告)日：2010-08-10
申请号：US11919130
申请日：2006-04-25
申请人： Johannes Lambertus Gerardus Maria Venrooij , Adrianus Henricus Ignatius Maria Verkuijlen
发明人： Johannes Lambertus Gerardus Maria Venrooij , Adrianus Henricus Ignatius Maria Verkuijlen
IPC分类号： B29C45/08 , B29C45/12 , B29C45/23
CPC分类号： B29C45/02 , B29C33/24 , B29C45/14655 , B29C45/2701 , B29C45/67 , B29C45/68
摘要： The present invention relates to a press for encapsulating electronic components, comprising: two displaceable mold parts (5,6), feed means for encapsulating material, and a drive mechanism connecting onto the mold parts. In a first embodiment the drive mechanism is provided with a fluid bed (14) and a first fluid feed (15) whereby their connection can be interrupted by a displacer (16). In a further embodiment a displacer (28) is provided in the feed channel (26) to place the encapsulating material (25) under pressure. Furthermore, the present invention relates to methods for encapsulating electronic components with encapsulating material in such presses.
摘要翻译：本发明涉及一种用于封装电子部件的压力机，包括：两个可移位的模具部件（5,6），用于封装材料的进给装置和连接到模具部件上的驱动机构。在第一实施例中，驱动机构设置有流化床（14）和第一流体供给（15），由此它们的连接可被置换器（16）中断。在进一步的实施例中，置换器（28）设置在进料通道（26）中以将密封材料（25）置于压力下。此外，本发明涉及在这种压机中用封装材料密封电子部件的方法。

5. 发明申请

US20090115098A1 Mould Part and Method for Encapsulating Electronic Components 审中-公开
标题翻译：封装电子元件的模具零件和方法
公开(公告)号：US20090115098A1
公开(公告)日：2009-05-07
申请号：US11658711
申请日：2005-07-26
申请人： Franciscus Bernardus Antonius De Vries , Wilhelmus Gerardus Jozef Gal , Johannes Lambertus Gerardus Maria Venrooij
发明人： Franciscus Bernardus Antonius De Vries , Wilhelmus Gerardus Jozef Gal , Johannes Lambertus Gerardus Maria Venrooij
IPC分类号： B29C45/14
CPC分类号： B29C45/34 , B29C45/14655 , B29C45/2669 , H01L21/565 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： The invention relates to a mould part for applying in a device for encapsulating electronic components mounted on a carrier, comprising: at least one mould cavity recessed into a contact side, a contact surface at least partially enclosing the mould cavity for medium-tight connection to the carrier of the electronic component, a feed channel for encapsulating material recessed into the contact surface and connecting to the mould cavity, a first outlet channel for gas, and an extraction space recessed into the contact surface. The invention also relates to a device for encapsulating electronic components mounted on a carrier and to a method for encapsulating electronic components mounted on a carrier.
摘要翻译：本发明涉及一种用于施加在用于封装安装在载体上的电子部件的装置中的模具部件，包括：凹入接触侧的至少一个模腔，至少部分地封闭模腔的接触表面，用于中密连接电子部件的载体，用于密封凹入到接触表面中并连接到模具腔的材料的进料通道，用于气体的第一出口通道和凹入接触表面的提取空间。本发明还涉及用于封装安装在载体上的电子部件的装置以及用于封装安装在载体上的电子部件的方法。

6. 发明申请

US20090045548A1 Press with plate-like frame parts, and method for operating such a plate press 有权
标题翻译：按板状框架部件按压，以及操作这种印版机的方法
公开(公告)号：US20090045548A1
公开(公告)日：2009-02-19
申请号：US11919130
申请日：2006-04-25
申请人： Johannes Lambertus Gerardus Maria Venrooij , Adrianus Henricus Ignatius Maria Verkuijlen
发明人： Johannes Lambertus Gerardus Maria Venrooij , Adrianus Henricus Ignatius Maria Verkuijlen
IPC分类号： B29C45/14
CPC分类号： B29C45/02 , B29C33/24 , B29C45/14655 , B29C45/2701 , B29C45/67 , B29C45/68
摘要： The present invention relates to a press for encapsulating electronic components, comprising: two displaceable mould parts (5,6), feed means for encapsulating material, and a drive mechanism connecting onto the mould parts. In a first embodiment the drive mechanism is provided with a fluid bed (14) and a first fluid feed (15) whereby their connection can be interrupted by a displacer (16). In a further embodiment a displacer (28) is provided in the feed channel (26) to place the encapsulating material (25) under pressure. Furthermore, the present invention relates to methods for encapsulating electronic components with encapsulating material in such presses.
摘要翻译：本发明涉及一种用于封装电子部件的压力机，包括：两个可移位的模具部件（5,6），用于封装材料的进给装置和连接到模具部件上的驱动机构。在第一实施例中，驱动机构设置有流化床（14）和第一流体供给（15），由此它们的连接可被置换器（16）中断。在进一步的实施例中，置换器（28）设置在进料通道（26）中以将密封材料（25）置于压力下。此外，本发明涉及在这种压机中用封装材料密封电子部件的方法。

7. 发明授权

US6165405A Press for encapsulating electronic components and methods for use of the press 失效
标题翻译：用于封装电子元件和使用压机的方法
公开(公告)号：US6165405A
公开(公告)日：2000-12-26
申请号：US155177
申请日：1998-10-19
申请人： Wilhelmus Hendrikus Johannes Harmsen , Lambertus Franciscus Wilhelmus Van Haren , Johannes Lambertus Gerardus Maria Venrooij
发明人： Wilhelmus Hendrikus Johannes Harmsen , Lambertus Franciscus Wilhelmus Van Haren , Johannes Lambertus Gerardus Maria Venrooij
IPC分类号： H01L21/56 , B29C33/22 , B29C45/02 , B29C45/66 , B29L31/34 , H01L21/00
CPC分类号： H01L21/67126 , B29C33/22 , B29C45/021 , B29C45/661
摘要： A device for encapsulating electronic components mounted on lead frames in a mold assembled from two mold halves movable relative to each other and closable onto each other. The device for causing the mold halves to move and to close are formed by a rotatable eccentric which can be coupled to one of the mold halves with interposing of at least one connecting rod. The invention also relates to a method for driving such a connecting rod. Another aspect of the invention relates to an encapsulating device wherein a one mold half is connectable to the device for causing the mold halves to move and close and the second mold half is connectable to a counter-plate which forms part of the device, which counter-plate is displaceable between two end positions. Yet another aspect of the invention relates to an encapsulating device with a counter-plate that includes a plurality of stacked, substantially plate-like parts, between which parts at least one shaft is placed. A further aspect of the invention is formed by a device for exerting pressure on encapsulating material including at least two screw spindles.
摘要翻译： PCT No.PCT / NL97 / 00142 Sec。 371日期：1998年10月19日 102（e）日期1998年10月19日PCT 1997年3月29日PCT公布。公开号WO97 / 35701 日期1997年10月2日一种用于将安装在引线框架上的电子部件封装在由相对于彼此可相对移动的两个半模组装的模具中的装置。用于使半模移动和关闭的装置由可旋转的偏心轮形成，该偏心轮可以插入至少一个连杆而连接到一个半模。本发明还涉及一种驱动这种连杆的方法。本发明的另一方面涉及一种封装装置，其中一个半模可连接到所述装置，以使所述半模移动和关闭，并且所述第二半模可连接到构成所述装置的一部分的对置板板可在两个端部位置之间移位。本发明的另一方面涉及一种具有对板的封装装置，所述对置板包括多个堆叠的基本上板状的部件，所述部件之间至少设有一个轴。本发明的另一方面由用于对包括至少两个螺杆心轴的包封材料施加压力的装置形成。

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