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1. 发明申请

US20100001906A1 RADIO FREQUENCY (RF) INTEGRATED CIRCUIT (IC) PACKAGES HAVING CHARACTERISTICS SUITABLE FOR MASS PRODUCTION 有权
标题翻译：无线电频率（RF）集成电路（IC）具有适合大规模生产的特性的封装
公开(公告)号：US20100001906A1
公开(公告)日：2010-01-07
申请号：US12168328
申请日：2008-07-07
申请人： Johannes A.G. Akkermans , Brian A. Floyd , Duixian Liu
发明人： Johannes A.G. Akkermans , Brian A. Floyd , Duixian Liu
IPC分类号： H01Q9/04 , H01Q13/10 , H01P11/00
CPC分类号： H01Q9/0457 , H01L23/66 , H01L24/48 , H01L2223/6677 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/09701 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15313 , H01L2924/15323 , H01Q21/0075 , H01Q21/065 , Y10T29/49016 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A radio-frequency integrated circuit chip package with N integrated aperture-coupled patch antennas, N being at least one, includes a cover portion with N generally planar patches, and a main portion coupled to the cover portion. The main portion in turn comprises at least one generally planar ground plane spaced inwardly from the N generally planar patches and substantially parallel thereto. The ground plane is formed with at least N coupling aperture slots therein. The slots are substantially opposed to the patches. The main portion also includes N feed lines spaced inwardly from the N generally planar patches and substantially parallel thereto, and at least one radio frequency chip coupled to the feed lines and the ground plane. The cover portion and the main portion cooperatively define an antenna cavity, with the N generally planar patches located in the antenna cavity. Fabrication techniques are also described. In some embodiments, N is two or more and a phased array is formed.
摘要翻译：具有N个集成孔径耦合贴片天线的射频集成电路芯片封装，N为至少一个，包括具有N个大致平坦的贴片的盖部分和耦合到盖部分的主要部分。主要部分又包括至少一个大致平面的接地平面，该接地平面与N个大体上平坦的贴片间隔开并基本上与其平行。接地平面在其中至少形成有N个耦合孔隙。狭槽基本上与贴片相对。主要部分还包括从N个大体上平坦的贴片向内间隔开并且基本上与其平行的N个馈送线，以及耦合到馈电线和接地平面的至少一个射频芯片。盖部分和主要部分协作地限定天线腔，其中N个大体平面的贴片位于天线腔中。还描述了制造技术。在一些实施例中，N是两个或更多个并且形成相控阵列。

2. 发明申请

US20090256752A1 RADIO FREQUENCY (RF) INTEGRATED CIRCUIT (IC) PACKAGES WITH INTEGRATED APERTURE-COUPLED PATCH ANTENNA(S) IN RING AND/OR OFFSET CAVITIES 有权
标题翻译：无线电频率（RF）集成电路（IC）包装与环形和/或偏移CAVIENS中的集成光纤耦合天线
公开(公告)号：US20090256752A1
公开(公告)日：2009-10-15
申请号：US12102051
申请日：2008-04-14
申请人： Johannes A.G. Akkermans , Brian A. Floyd , Duixian Liu
发明人： Johannes A.G. Akkermans , Brian A. Floyd , Duixian Liu
IPC分类号： H01Q9/04 , H01P11/00
CPC分类号： H01Q21/065 , G06K19/07749 , G06K19/07786 , H01L23/3121 , H01L23/66 , H01L2223/6677 , H01L2224/16 , H01L2224/16227 , H01L2924/01079 , H01L2924/09701 , H01L2924/15153 , H01L2924/15323 , H01Q1/2283 , H01Q1/38 , H01Q9/0457 , H01Q21/061 , H01Q23/00 , Y10T29/49016
摘要： A radio-frequency integrated circuit chip package has N integrated aperture-coupled patch antennas, N being at least two, and includes N generally planar patches, and at least one generally planar ground plane spaced inwardly from the N generally planar patches and substantially parallel thereto. The ground plane is formed with at least N coupling aperture slots therein, and the slots are substantially opposed to the patches. N feed lines are spaced inwardly from the ground plane and substantially parallel thereto, and at least one radio frequency chip is spaced inwardly from the feed lines and coupled to the feed lines and the ground plane. A first substrate layer is spaced inwardly from the feed lines, and is formed with a chip-receiving cavity, with the chip located in the chip-receiving cavity. A second substrate layer is interposed in a region between the ground plane and a plane defined by the patch, the patch is formed in a first metal layer, the ground plane is formed in a second metal layer, and the second substrate layer defines an antenna cavity in which the N generally planar patches are located. “Island” and “offset” configurations, as well as fabrication methods, are also disclosed.
摘要翻译：射频集成电路芯片封装具有N个集成的孔耦合贴片天线，N为至少两个，并且包括N个通常为平面的贴片，以及至少一个大致平面的接地平面，与N个大致平坦的贴片间隔开并基本上与之平行。。接地平面在其中形成有至少N个耦合孔隙，并且槽基本上与贴片相对。 N个进料管线从接地平面向内隔开并基本上与其平行，并且至少一个射频芯片与进料管线向内间隔开并连接到进料管线和接地平面。第一衬底层从馈电线向内隔开，并且形成有芯片接收腔，芯片位于芯片接收腔中。第二基板层插入在接地平面和由贴片限定的平面之间的区域中，贴片形成在第一金属层中，接地平面形成在第二金属层中，第二基板层限定天线其中N个大体平面的贴片位于其中。还公开了“岛”和“偏移”结构以及制造方法。

3. 发明授权

US08256685B2 Compact millimeter wave packages with integrated antennas 有权
标题翻译：具有集成天线的紧凑型毫米波封装
公开(公告)号：US08256685B2
公开(公告)日：2012-09-04
申请号：US12494671
申请日：2009-06-30
申请人： Ho Chung Chen , Brian A. Floyd , Duixian Liu
发明人： Ho Chung Chen , Brian A. Floyd , Duixian Liu
IPC分类号： G06K19/06
CPC分类号： G06K19/07749 , H01L23/66 , H01L2223/6627 , H01L2223/6677 , H01L2224/48091 , H01L2224/48227 , H01L2924/09701 , H01L2924/1903 , H01Q1/2283 , H01L2924/00014
摘要： A radio-frequency integrated circuit chip package has at least one integrated antenna. The package includes at least one generally planar ground plane formed with at least one slot therein. A first substrate structure has an outer surface and an inner surface. The at least one generally planar ground plane is formed on the outer surface of the first substrate structure. At least one feed line is spaced inwardly from the ground plane and parallel thereto. The at least one feed line has an inner surface and an outer surface and is a transmission line formed on the inner surface of the first substrate structure with the outer surface of the at least one feed line adjacent the inner surface of the first substrate structure. At least one radio frequency chip is coupled to the feed line and the ground plane. A second substrate structure, spaced inwardly from the feed line, defines a chip-receiving cavity. The chip is located in the chip-receiving cavity. The inner surface of the at least one feed line borders the chip-receiving cavity. An antenna patch may be provided. Planar phased array embodiments, assemblies with motherboards and heat sinks, and fabrication techniques are also disclosed.
摘要翻译：射频集成电路芯片封装具有至少一个集成的天线。该封装包括至少一个在其中形成有至少一个槽的大致平面的接地平面。第一衬底结构具有外表面和内表面。至少一个大致平面的接地平面形成在第一基板结构的外表面上。至少一个进料管线从接地平面向内隔开并与其平行。所述至少一个进料管线具有内表面和外表面，并且是形成在所述第一基材结构的内表面上的传输线，所述至少一个进料管线的外表面邻近所述第一基材结构的内表面。至少一个射频芯片被耦合到馈线和接地平面。从馈电线向内隔开的第二衬底结构限定了芯片接收腔。芯片位于芯片接收腔中。所述至少一个馈送线的内表面与所述芯片接收腔相接。可以提供天线贴片。还公开了平面相控阵实施例，具有主板和散热器的组件以及制造技术。

4. 发明授权

US07696930B2 Radio frequency (RF) integrated circuit (IC) packages with integrated aperture-coupled patch antenna(s) in ring and/or offset cavities 有权
标题翻译：射频（RF）集成电路（IC）封装，在环和/或偏移空腔中集成了孔耦合贴片天线
公开(公告)号：US07696930B2
公开(公告)日：2010-04-13
申请号：US12102051
申请日：2008-04-14
申请人： Johannes A. G. Akkermans , Brian A. Floyd , Duixian Liu
发明人： Johannes A. G. Akkermans , Brian A. Floyd , Duixian Liu
IPC分类号： H01Q1/38
CPC分类号： H01Q21/065 , G06K19/07749 , G06K19/07786 , H01L23/3121 , H01L23/66 , H01L2223/6677 , H01L2224/16 , H01L2224/16227 , H01L2924/01079 , H01L2924/09701 , H01L2924/15153 , H01L2924/15323 , H01Q1/2283 , H01Q1/38 , H01Q9/0457 , H01Q21/061 , H01Q23/00 , Y10T29/49016
摘要： A radio-frequency integrated circuit chip package has N integrated aperture-coupled patch antennas, N being at least two, and includes N generally planar patches, and at least one generally planar ground plane spaced inwardly from the N generally planar patches and substantially parallel thereto. The ground plane is formed with at least N coupling aperture slots therein, and the slots are substantially opposed to the patches. N feed lines are spaced inwardly from the ground plane and substantially parallel thereto, and at least one radio frequency chip is spaced inwardly from the feed lines and coupled to the feed lines and the ground plane. A first substrate layer is spaced inwardly from the feed lines, and is formed with a chip-receiving cavity, with the chip located in the chip-receiving cavity. A second substrate layer is interposed in a region between the ground plane and a plane defined by the patch, the patch is formed in a first metal layer, the ground plane is formed in a second metal layer, and the second substrate layer defines an antenna cavity in which the N generally planar patches are located. “Island” and “offset” configurations, as well as fabrication methods, are also disclosed.
摘要翻译：射频集成电路芯片封装具有N个集成的孔耦合贴片天线，N为至少两个，并且包括N个通常为平面的贴片，以及至少一个大致平面的接地平面，与N个大致平坦的贴片间隔开并基本上与之平行。。接地平面在其中形成有至少N个耦合孔隙，并且槽基本上与贴片相对。 N个进料管线从接地平面向内隔开并基本上与其平行，并且至少一个射频芯片与进料管线向内间隔开并连接到进料管线和接地平面。第一衬底层从馈电线向内隔开，并且形成有芯片接收腔，芯片位于芯片接收腔中。第二基板层插入在接地平面和由贴片限定的平面之间的区域中，贴片形成在第一金属层中，接地平面形成在第二金属层中，第二基板层限定天线其中N个大体平面的贴片位于其中。还公开了“岛”和“偏移”结构以及制造方法。

5. 发明授权

US08269671B2 Simple radio frequency integrated circuit (RFIC) packages with integrated antennas 有权
标题翻译：具有集成天线的简单射频集成电路（RFIC）封装
公开(公告)号：US08269671B2
公开(公告)日：2012-09-18
申请号：US12360538
申请日：2009-01-27
申请人： Ho Chung Chen , Brian A. Floyd , Duixian Liu
发明人： Ho Chung Chen , Brian A. Floyd , Duixian Liu
IPC分类号： H01Q1/24
CPC分类号： H01Q9/0407 , H01L23/04 , H01L23/66 , H01L24/16 , H01L24/48 , H01L2223/6616 , H01L2223/6633 , H01L2223/6677 , H01L2224/16235 , H01L2224/48235 , H01L2224/73253 , H01L2924/00014 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/19039 , H01Q1/2283 , H01Q21/065 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A radio-frequency integrated circuit chip package has N integrated patch antennas, N being at least one. The package includes a cover portion with N generally planar patches, and a main portion coupled to the cover portion. The main portion in turn includes at least one generally planar ground plane spaced inwardly from the N generally planar patches and parallel thereto. The ground plane is formed without any coupling apertures therein. The main portion also includes N feed lines spaced inwardly from the N generally planar patches and parallel thereto, and spaced outwardly from the generally planar ground plane and parallel thereto. Furthermore, the main portion includes at least one radio frequency chip coupled to the feed lines and the ground plane. The cover portion and the main portion cooperatively define an antenna cavity, and the N generally planar patches and the chip are located in the antenna cavity. The package is formed without reflectors. Fabrication techniques are also described.
摘要翻译：射频集成电路芯片封装具有N个集成贴片天线，N为至少一个。该包装包括具有N个大体上平坦的贴片的盖部分和联接到盖部分的主要部分。主要部分又包括至少一个大致平面的接地平面，与N个大致平坦的贴片间隔开并与其平行。接地平面形成在其中没有任何耦合孔。主要部分还包括从N个大体上平坦的贴片向内间隔开并与之平行的N个馈送线，并且与大致平面的接地平面向外间隔开并与其平行。此外，主要部分包括耦合到馈线和接地平面的至少一个射频芯片。盖部分和主要部分协同地限定天线腔，并且N个大致平面的贴片和芯片位于天线腔中。包装形成无反光镜。还描述了制造技术。

6. 发明申请

US20100327068A1 COMPACT MILLIMETER WAVE PACKAGES WITH INTEGRATED ANTENNAS 有权
标题翻译：具有集成天线的紧凑型毫米波包
公开(公告)号：US20100327068A1
公开(公告)日：2010-12-30
申请号：US12494671
申请日：2009-06-30
申请人： Ho Chung Chen , Brian A. Floyd , Duixian Liu
发明人： Ho Chung Chen , Brian A. Floyd , Duixian Liu
IPC分类号： G06K19/06 , H01Q1/38 , H01L21/00
CPC分类号： G06K19/07749 , H01L23/66 , H01L2223/6627 , H01L2223/6677 , H01L2224/48091 , H01L2224/48227 , H01L2924/09701 , H01L2924/1903 , H01Q1/2283 , H01L2924/00014
摘要： A radio-frequency integrated circuit chip package has at least one integrated antenna. The package includes at least one generally planar ground plane formed with at least one slot therein. A first substrate structure has an outer surface and an inner surface. The at least one generally planar ground plane is formed on the outer surface of the first substrate structure. At least one feed line is spaced inwardly from the ground plane and parallel thereto. The at least one feed line has an inner surface and an outer surface and is a transmission line formed on the inner surface of the first substrate structure with the outer surface of the at least one feed line adjacent the inner surface of the first substrate structure. At least one radio frequency chip is coupled to the feed line and the ground plane. A second substrate structure, spaced inwardly from the feed line, defines a chip-receiving cavity. The chip is located in the chip-receiving cavity. The inner surface of the at least one feed line borders the chip-receiving cavity. An antenna patch may be provided. Planar phased array embodiments, assemblies with motherboards and heat sinks, and fabrication techniques are also disclosed.
摘要翻译：射频集成电路芯片封装具有至少一个集成天线。该封装包括至少一个在其中形成有至少一个槽的大致平面的接地平面。第一衬底结构具有外表面和内表面。至少一个大致平面的接地平面形成在第一基板结构的外表面上。至少一个进料管线从接地平面向内隔开并与其平行。所述至少一个进料管线具有内表面和外表面，并且是形成在所述第一基材结构的内表面上的传输线，所述至少一个进料管线的外表面邻近所述第一基材结构的内表面。至少一个射频芯片被耦合到馈线和接地平面。从馈电线向内隔开的第二衬底结构限定了芯片接收腔。芯片位于芯片接收腔中。所述至少一个馈送线的内表面与所述芯片接收腔相接。可以提供天线贴片。还公开了平面相控阵实施例，具有主板和散热器的组件以及制造技术。

7. 发明授权

US07728774B2 Radio frequency (RF) integrated circuit (IC) packages having characteristics suitable for mass production 有权
标题翻译：射频（RF）集成电路（IC）封装具有适合批量生产的特性
公开(公告)号：US07728774B2
公开(公告)日：2010-06-01
申请号：US12168328
申请日：2008-07-07
申请人： Johannes A. G. Akkermans , Brian A. Floyd , Duixian Liu
发明人： Johannes A. G. Akkermans , Brian A. Floyd , Duixian Liu
IPC分类号： H01Q1/38
CPC分类号： H01Q9/0457 , H01L23/66 , H01L24/48 , H01L2223/6677 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/09701 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15313 , H01L2924/15323 , H01Q21/0075 , H01Q21/065 , Y10T29/49016 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A radio-frequency integrated circuit chip package with N integrated aperture-coupled patch antennas, N being at least one, includes a cover portion with N generally planar patches, and a main portion coupled to the cover portion. The main portion in turn comprises at least one generally planar ground plane spaced inwardly from the N generally planar patches and substantially parallel thereto. The ground plane is formed with at least N coupling aperture slots therein. The slots are substantially opposed to the patches. The main portion also includes N feed lines spaced inwardly from the N generally planar patches and substantially parallel thereto, and at least one radio frequency chip coupled to the feed lines and the ground plane. The cover portion and the main portion cooperatively define an antenna cavity, with the N generally planar patches located in the antenna cavity. Fabrication techniques are also described. In some embodiments, N is two or more and a phased array is formed.
摘要翻译：具有N个集成孔径耦合贴片天线的射频集成电路芯片封装，N为至少一个，包括具有N个大致平坦的贴片的盖部分和耦合到盖部分的主要部分。主要部分又包括至少一个大致平面的接地平面，该接地平面与N个大体上平坦的贴片间隔开并基本上与其平行。接地平面在其中至少形成有N个耦合孔隙。狭槽基本上与贴片相对。主要部分还包括从N个大体上平坦的贴片向内间隔开并且基本上与其平行的N个馈送线，以及耦合到馈电线和接地平面的至少一个射频芯片。盖部分和主要部分协作地限定天线腔，其中N个大体平面的贴片位于天线腔中。还描述了制造技术。在一些实施例中，N是两个或更多个并且形成相控阵列。

8. 发明授权

US09268017B2 Near-field millimeter wave imaging 有权
公开(公告)号：US09268017B2
公开(公告)日：2016-02-23
申请号：US13545437
申请日：2012-07-10
申请人： Aydin Babakhani , Duixian Liu , Scott K. Reynolds , Mihai A. Sanduleanu
发明人： Aydin Babakhani , Duixian Liu , Scott K. Reynolds , Mihai A. Sanduleanu
IPC分类号： G01S13/89 , H01Q1/22 , H01Q7/00 , H01Q21/06
CPC分类号： G01S13/89 , H01Q1/2283 , H01Q7/00 , H01Q21/061
摘要： Systems and method for near-field millimeter wave imaging are provided, in particular, near-field millimeter wave imaging systems and methods that enable sub-wavelength resolution imaging by scanning objects with sub-wavelength probe elements and capturing and measuring phase and intensity of reflected energy to generate images.

9. 发明授权

US08558637B2 Circuit device with signal line transition element 有权
标题翻译：具有信号线过渡元件的电路装置
公开(公告)号：US08558637B2
公开(公告)日：2013-10-15
申请号：US12778130
申请日：2010-05-12
申请人： Duixian Liu , Ho-Chung Chen , Brian Allan Floyd
发明人： Duixian Liu , Ho-Chung Chen , Brian Allan Floyd
IPC分类号： H03H7/38
CPC分类号： H01P5/028 , H01L2223/6677 , H01L2224/16227 , H01L2224/73253 , H01L2924/15153 , H01L2924/15313 , H01L2924/15323
摘要： A circuit device includes a multilayer circuit carrier, a first signal transmission line, a second signal transmission line, a signal line transition element, a first impedance transformer, and a second impedance transformer. The multilayer circuit carrier includes a first layer and a second layer. The first signal transmission line is on the surface of the first layer. The second signal transmission line is on the surface of the second layer. The signal line transition element passes through the first layer and the second layer, and has a first signal terminal and a second signal terminal. The first impedance transformer is on the surface of the first layer and electrically connected between the first signal transmission line and the first signal terminal. The second impedance transformer is on the surface of the second layer and electrically connected between the second signal transmission line and the second signal terminal.
摘要翻译：电路装置包括多层电路载体，第一信号传输线，第二信号传输线，信号线过渡元件，第一阻抗变压器和第二阻抗变压器。多层电路载体包括第一层和第二层。第一信号传输线在第一层的表面上。第二信号传输线在第二层的表面上。信号线过渡元件通过第一层和第二层，并具有第一信号端和第二信号端。第一阻抗变换器位于第一层的表面上并电连接在第一信号传输线和第一信号端之间。第二阻抗变换器位于第二层的表面上并电连接在第二信号传输线和第二信号端之间。

10. 发明授权

US08294620B2 Integrated dual-band antenna for laptop applications 有权
标题翻译：用于笔记本电脑应用的集成双频天线
公开(公告)号：US08294620B2
公开(公告)日：2012-10-23
申请号：US10370976
申请日：2003-02-20
申请人： Ephraim B. Flint , Brian P. Gaucher , Duixian Liu
发明人： Ephraim B. Flint , Brian P. Gaucher , Duixian Liu
IPC分类号： H01Q1/24 , H01Q21/30
CPC分类号： H01Q1/2275 , H01Q1/22 , H01Q1/2266 , H01Q1/44 , H01Q5/378 , H01Q9/0421 , H01Q9/42
摘要： Dual-band antennas that are embedded within portable devices such as laptop computers. In one aspect, a dual-band antenna for a portable device (e.g., laptop computer) includes a first element having a resonant frequency in a first frequency band and a second element having a resonant frequency in a second frequency band, wherein the first element is connected to a signal feed, wherein the second element is grounded, and wherein the first and second elements are integrated within a portable device.
摘要翻译：嵌入便携式设备（如笔记本电脑）中的双频天线。一方面，用于便携式设备（例如，膝上型计算机）的双频天线包括在第一频带具有谐振频率的第一元件和在第二频带中具有谐振频率的第二元件，其中第一元件连接到信号馈送，其中第二元件接地，并且其中第一和第二元件被集成在便携式设备内。

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