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    • 3. 发明授权
    • Process for the production of coated substrates
    • 生产涂层基材的方法
    • US07399397B2
    • 2008-07-15
    • US10842312
    • 2004-05-10
    • Gabriele BuettnerHeinz-Peter KatzmannKlausjoerg Klein
    • Gabriele BuettnerHeinz-Peter KatzmannKlausjoerg Klein
    • C25D13/12
    • C25D13/20B05D1/007B05D5/12B05D7/14B05D7/546B05D2252/02B05D2252/10
    • A process for the production of coated substrates comprising the successive steps of: a) applying a coating composition A′ onto one side A″ of a metal sheet to form a coating layer A which is electrically insulating when cured and applying a coating composition B′ onto the opposite side of the metal sheet to form coating layer B which is electrically conductive when cured, wherein each of the coating compositions A′ and B′ are applied by coil coating, b) curing the two coating layers A and B, c) removing and shaping sheet metal parts provided with the cured coating layer A on one side A″ and with the cured coating layer B on the other side B″, d) optionally, assembling the coated shaped sheet metal parts to form a construction with outwardly directed sides A″ and e) electrodepositing an electrodeposition (ED) coating layer onto the electrically conductive surfaces and curing of the ED coating layer.
    • 一种用于生产涂覆基材的方法,包括以下连续步骤:a)将涂料组合物A'涂覆在金属板的一侧A“上以形成涂层A,其在固化时电绝缘并涂覆涂料组合物B 在金属片的相对侧上形成固化时导电的涂层B,其中涂覆组合物A'和B'各自通过卷材涂布施加,b)固化两个涂层A和B,c )在一侧A“上除去和成型设置有固化涂层A的金属片,并且在另一侧B”上固化涂层B,d)任选地,组装涂覆的成形金属片以形成结构 具有向外指向的侧面A“和e)将电沉积(ED)涂层电沉积到导电表面上并固化ED涂层。