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    • 8. 发明授权
    • Process for the manufacture of printed circuits
    • 印刷电路制造工艺
    • US4859263A
    • 1989-08-22
    • US169830
    • 1988-03-17
    • Heinz-Jurgen DziurlaHans-Leo WeberDieter FreitagWerner Waldenrath
    • Heinz-Jurgen DziurlaHans-Leo WeberDieter FreitagWerner Waldenrath
    • B41M5/26H05K3/04H05K3/22
    • H05K3/046H05K2203/0528H05K2203/1105
    • A method for manufacturing printed electrical circuits which comprise a substrate and copper foil applied thereto by hot embossing in a predetermined circuit pattern, said method comprising(a) providing a laminate which comprises the sequence of a printed circuit substrate, a heat activated adhesive layer, a copper foil and a carrier film which is electrically conductive,(b) passing an electrical current between two electrodes and through the carrier film wherein one electrode has sufficiently large film contact area whereby substantially no resistance heating results from the current density and the other electrode serves as an embossing tool and is of sufficiently small film contact area whereby sufficient resistance heating results from the current density to activate the adhesive layer to bond the copper foil to the substrate in the pattern of said other electrode, and(c) removing from the laminate the carrier film and such copper foil overlying areas where the adhesive was not heat activated thereby leaving a copper foil pattern bonded to the substrate.
    • 一种制造印刷电路的方法,其包括以预定电路图案通过热压印施加到其上的基板和铜箔,所述方法包括(a)提供包括印刷电路基板,热活化粘合剂层, 铜箔和导电的载体膜,(b)在两个电极之间通过电流并通过载体膜,其中一个电极具有足够大的膜接触面积,从而基本上不受电流密度的影响,另一个电极 用作压花工具,并且具有足够小的膜接触面积,从而由电流密度产生足够的电阻加热,以激活粘合剂层,以将铜箔与基板以所述另一个电极的图案结合,以及(c) 将载体膜和这种铜箔叠合在不粘合剂的区域上 热激活,从而留下结合到基底的铜箔图案。