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    • 2. 发明授权
    • Manufacture of a multilayer laminate
    • 制造多层层压板
    • US5556532A
    • 1996-09-17
    • US333991
    • 1994-11-02
    • Joachim Markowski
    • Joachim Markowski
    • H05K3/00H05K3/38C25F5/00
    • H05K3/385H05K2203/0315H05K2203/1157H05K3/0085
    • Black- or brown-oxidised copper laminates that are to be integrated into an electrical multilayer laminate in a subsequent process step are electrochemically reduced in order to avoid the formation of so-called "pink rings". To that end, they are connected as the cathode of an electrolysis in a suitable electrolyte. The atomic hydrogen produced in statu nascendi during the electrolysis completely or partially reduces the copper oxide layer on the metallic regions of the copper laminates, whereby the resistance of the surfaces of the metallic regions of the copper laminates to subsequent acid attack is considerably improved. The electrochemical reduction may optionally be coupled with a chemical reduction or precede a chemical reduction.
    • 在后续工艺步骤中要整合到电气多层压板中的黑色或棕色氧化的铜层压板电化学降低,以避免形成所谓的“粉红色环”。 为此,它们以合适的电解液中的电解阴极连接。 在电解过程中产生的原子氢完全或部分地还原铜层压板的金属区域上的氧化铜层,从而显着地提高了铜层压板的金属区域的表面对随后的酸侵蚀的电阻。 电化学还原可以任选地与化学还原或化学还原之前偶联。