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    • 4. 发明授权
    • Bonding-type surface-mount crystal oscillator
    • 接合型表面贴装晶体振荡器
    • US07746184B2
    • 2010-06-29
    • US12155847
    • 2008-06-10
    • Masahiro Fukunaga
    • Masahiro Fukunaga
    • H03B1/00
    • H03H9/0547H01L2924/16195H03H9/0552H03H9/1021
    • A crystal oscillator has: a crystal unit having a container body in which a crystal blank is housed and hermetically sealed; and a mounting substrate that houses an IC chip having at least an integrated oscillating circuit that uses the crystal unit. External terminals are formed as protrusions at four corners of the outer bottom surface of the container body, and depressions corresponding to the external terminals are formed at four corners of the top surface of the mounting substrate. Bonding terminals are formed at the inner bottom surface of the depressions. The mounting substrate is electrically and mechanically bonded to the outer bottom surface of the crystal unit by fitting the external terminals into the depressions and bonding the external terminals to the corresponding bonding terminals by soldering.
    • 晶体振荡器具有:晶体单元,其具有容纳在其中容纳晶体坯料并密封的容器主体; 以及安装基板,其容纳至少具有使用该晶体单元的集成振荡电路的IC芯片。 外部端子形成为在容器主体的外部底面的四个角部的突出部,并且在安装基板的顶面的四个角部形成有与外部端子对应的凹部。 接合端子形成在凹部的内底面。 安装基板通过将外部端子装配到凹部中并通过焊接将外部端子连接到相应的接合端子而电结合到晶体单元的外部底面。
    • 5. 发明申请
    • Bonding-type surface-mount crystal oscillator
    • 接合型表面贴装晶体振荡器
    • US20080309418A1
    • 2008-12-18
    • US12155847
    • 2008-06-10
    • Masahiro Fukunaga
    • Masahiro Fukunaga
    • H03B1/00
    • H03H9/0547H01L2924/16195H03H9/0552H03H9/1021
    • A crystal oscillator has: a crystal unit having a container body in which a crystal blank is housed and hermetically sealed; and a mounting substrate that houses an IC chip having at least an integrated oscillating circuit that uses the crystal unit. External terminals are formed as protrusions at four corners of the outer bottom surface of the container body, and depressions corresponding to the external terminals are formed at four corners of the top surface of the mounting substrate. Bonding terminals are formed at the inner bottom surface of the depressions. The mounting substrate is electrically and mechanically bonded to the outer bottom surface of the crystal unit by fitting the external terminals into the depressions and bonding the external terminals to the corresponding bonding terminals by soldering.
    • 晶体振荡器具有:晶体单元,其具有容纳在其中容纳晶体坯料并密封的容器主体; 以及安装基板,其容纳至少具有使用该晶体单元的集成振荡电路的IC芯片。 外部端子形成为在容器主体的外部底面的四个角部的突出部,并且在安装基板的顶面的四个角部形成有与外部端子对应的凹部。 接合端子形成在凹部的内底面。 安装基板通过将外部端子装配到凹部中并通过焊接将外部端子连接到相应的接合端子而电结合到晶体单元的外部底面。