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    • 7. 发明申请
    • METHOD OF FORMING CONDUCTIVE PATTERN AND SUBSTRATE HAVING CONDUCTIVE PATTERN MANUFACTURED BY THE SAME METHOD
    • 形成导电图案的方法和具有由该方法制造的导电图案的基板
    • US20100193224A1
    • 2010-08-05
    • US12701278
    • 2010-02-05
    • Jung-Ho PARK
    • Jung-Ho PARK
    • H05K1/02B05D5/12H05K1/09
    • H05K3/245H05K3/1283H05K2203/1131H05K2203/121
    • The present invention relates to a method for manufacturing a board that includes a conductive pattern, which comprises the steps of 1) discharging a conductive inorganic composition that includes a conductive inorganic metal particle on a substrate; 2) discharging a conductive organic composition that includes a conductive organic metal complex on the conductive inorganic composition; and 3) sintering the conductive inorganic composition and the conductive organic composition, and a board that includes a conductive pattern manufactured by using the same. A board that includes a conductive pattern according to the present invention may have high conductivity even though it is sintered at a lower sintering temperature than a board that includes a conductive pattern formed by using only an organic material or only an inorganic material.
    • 本发明涉及一种包括导电图案的板的制造方法,其包括以下步骤:1)将包含导电无机金属颗粒的导电无机组合物排出到基板上; 2)在导电无机组合物上放电包含导电有机金属络合物的导电有机组合物; 和3)烧结导电无机组合物和导电有机组合物,以及包含通过使用其的导电图案的板。 即使在比仅包含有机材料或仅使用无机材料形成的导电图案的板的烧结温度低的情况下烧结,也可以含有本发明的导电图案的电路板。