专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20110005824A1 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20110005824A1
公开(公告)日：2011-01-13
申请号：US12544100
申请日：2009-08-19
申请人： Jin Yong AN , Suk Hyeon Cho , Ji Hong Jo
发明人： Jin Yong AN , Suk Hyeon Cho , Ji Hong Jo
IPC分类号： H05K1/11 , H05K3/20
CPC分类号： H05K3/4658 , H05K1/113 , H05K3/20 , H05K3/4682 , H05K2201/0352 , H05K2201/096 , Y10T29/49128
摘要： This invention relates to a printed circuit board and a method of manufacturing the same, in which an outermost layer of the printed circuit board includes a fine circuit and the manufacturing cost of the printed circuit board is reduced.
摘要翻译：印刷电路板及其制造方法技术领域本发明涉及一种印刷电路板及其制造方法，其中印刷电路板的最外层包括精细电路，并且印刷电路板的制造成本降低。

2. 发明申请

US20080000680A1 Printed circuit board and method of manufacturing the same 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20080000680A1
公开(公告)日：2008-01-03
申请号：US11819925
申请日：2007-06-29
申请人： Suk Hyeon Cho , Byoung Youl Min , Je Gwang Yoo , Hae Nam Seo , Byung Moon Kim , Ji Hong Jo , Han Seo Cho
发明人： Suk Hyeon Cho , Byoung Youl Min , Je Gwang Yoo , Hae Nam Seo , Byung Moon Kim , Ji Hong Jo , Han Seo Cho
IPC分类号： H05K1/03
CPC分类号： H05K1/0206 , H01L23/3735 , H01L23/5389 , H01L24/25 , H01L24/82 , H01L2224/04105 , H01L2224/19 , H01L2224/2518 , H01L2224/82039 , H01L2224/92144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/14 , H01L2924/3025 , H05K1/0204 , H05K1/185 , H05K3/06 , H05K3/4038 , H05K3/4602 , H05K3/4647 , H05K3/4652 , H05K2201/09509 , H05K2201/096 , H05K2203/0733 , Y10T29/49126 , Y10T29/49155
摘要： Disclosed herein are a printed circuit board and a method of manufacturing the same, which can achieve reliable heat resistance because heat radiation characteristics are improved, and processing costs of which are reduced because processing times are shortened.
摘要翻译：这里公开了一种印刷电路板及其制造方法，其可以提高热辐射特性，从而可以实现可靠的耐热性，并且由于加工时间缩短，其加工成本降低。

3. 发明授权

US07499258B2 Embedded multilayer chip capacitor and printed circuit board having the same 有权
标题翻译：嵌入式多层片式电容器和具有相同功能的印刷电路板
公开(公告)号：US07499258B2
公开(公告)日：2009-03-03
申请号：US11319722
申请日：2005-12-29
申请人： Chang Hoon Shim , Jin Yong An , Suk Hyeon Cho , Sung Hyung Kang
发明人： Chang Hoon Shim , Jin Yong An , Suk Hyeon Cho , Sung Hyung Kang
IPC分类号： H01G4/236 , H01G4/06
CPC分类号： H01G2/06 , H01G4/232 , H01G4/30 , H01L2924/0002 , H05K1/0231 , H05K1/185 , H05K2201/10643 , H01L2924/00
摘要： The invention provides an embedded multilayer chip capacitor, and a printed circuit board having the same. The embedded multilayer chip capacitor has a capacitor body having a plurality of dielectric layers stacked one on another; a plurality of first and second internal electrodes formed inside the capacitor body, separated by the dielectric layers; and first and second vias extended vertically inside the capacitor body. The first via is connected to the first internal electrodes and the second via is connected to the second internal electrodes. The first via is led to a bottom of the capacitor body and the second via is led to a top of the capacitor body.
摘要翻译：本发明提供一种嵌入式多层片状电容器及具有该电容器的印刷电路板。嵌入式多层片状电容器具有电容器主体，该电容器本体具有彼此层叠的多个电介质层; 多个第一和第二内部电极，形成在电容器本体内部，被电介质层分隔开; 并且第一和第二通孔在电容器体内垂直延伸。第一通孔连接到第一内部电极，第二通孔连接到第二内部电极。第一通孔被引导到电容器主体的底部，第二通孔被引导到电容器主体的顶部。

4. 发明申请

US20110079349A1 Method of manufacturing printed circuit board 审中-公开
标题翻译：制造印刷电路板的方法
公开(公告)号：US20110079349A1
公开(公告)日：2011-04-07
申请号：US12654360
申请日：2009-12-17
申请人： Suk Hyeon Cho , Chang Sup Ryu , Jin Yong An , Soon Oh Jung , Sung Won Jeong , Byung Moon Kim , Dong Ju Jeon , Seok Kyu Lee , Jin Ho Kim
发明人： Suk Hyeon Cho , Chang Sup Ryu , Jin Yong An , Soon Oh Jung , Sung Won Jeong , Byung Moon Kim , Dong Ju Jeon , Seok Kyu Lee , Jin Ho Kim
IPC分类号： B32B38/10 , B32B38/04
CPC分类号： H05K3/4682 , H05K3/0035 , H05K3/0052 , H05K3/007 , H05K3/0097 , H05K3/28 , H05K2203/066 , H05K2203/1536
摘要： The present invention provides a method of manufacturing a printed circuit board including the steps of: preparing a pair of raw materials, each formed by sequentially stacking a release film and a first insulating layer, and an adhesive layer, respectively; embedding the pair of raw materials, which are opposed to each other, in the adhesive layer while disposing the release films toward an inner layer; forming a second insulating layer, which has a via formed therethrough and a circuit pattern formed on an upper surface to be connected to the via, on the first insulating layer; cutting edge portions of the second and first insulating layers, the release film, and the adhesive layer; and removing the release film from the first insulating layer.
摘要翻译：本发明提供一种制造印刷电路板的方法，包括以下步骤：制备分别通过依次堆叠隔离膜和第一绝缘层而形成的一对原材料和粘合剂层; 在粘合剂层中嵌入彼此相对的一对原料，同时将释放膜设置在内层上; 在所述第一绝缘层上形成第二绝缘层，所述第二绝缘层具有穿过其形成的通孔和形成在与所述通孔连接的上表面上的电路图案; 第二和第一绝缘层，剥离膜和粘合剂层的切割边缘部分; 以及从所述第一绝缘层移除所述脱模膜。

5. 发明申请

US20130126215A1 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20130126215A1
公开(公告)日：2013-05-23
申请号：US13489045
申请日：2012-06-05
申请人： Suk Hyeon Cho , Francis Sohn
发明人： Suk Hyeon Cho , Francis Sohn
IPC分类号： H05K7/20 , H05K3/42
CPC分类号： H05K1/0206 , H05K1/0209 , H05K2201/0367 , H05K2201/0376 , H05K2201/09781 , H05K2203/0338 , Y10T29/49165
摘要： The present invention relates to a printed circuit board including: a substrate; a circuit pattern formed on a surface of the substrate; a dummy pattern formed on the surface of the substrate, where the circuit pattern is not formed, to be spaced apart from the circuit pattern by a predetermined interval; and a plurality of heat radiating vias formed along an outer edge of the substrate to electrically connect the dummy patterns through the substrate, and it is possible to suppress generation of electromagnetic waves or shield the electromagnetic waves and improve heat radiating characteristics at the same time.
摘要翻译：印刷电路板技术领域本发明涉及一种印刷电路板，包括：基板; 形成在所述基板的表面上的电路图案; 形成在基板表面上的虚设图案，其中未形成电路图案，以与电路图案间隔预定间隔; 以及沿着基板的外缘形成的多个散热通孔，以通过基板电连接虚拟图案，并且可以同时抑制电磁波的产生或屏蔽电磁波并提高散热特性。

6. 发明申请

US20120111728A1 METHOD OF MANUFACTURING CIRCUIT BOARD 审中-公开
标题翻译：制造电路板的方法
公开(公告)号：US20120111728A1
公开(公告)日：2012-05-10
申请号：US13283329
申请日：2011-10-27
申请人： Suk Hyeon Cho , Myeong Ho Hong
发明人： Suk Hyeon Cho , Myeong Ho Hong
IPC分类号： C25D1/00
CPC分类号： H05K3/4007 , H01L21/4857 , H01L23/49822 , H01L2924/0002 , H05K3/205 , H05K2201/09745 , H05K2203/0338 , H01L2924/00
摘要： Disclosed herein is a method of manufacturing a circuit board. The method of manufacturing a circuit board according to a preferred embodiment of the present invention is configured to include (A) forming a cavity 115 for a bump on one surface 111 of a carrier 110, (B) forming a bump 130 in the cavity 115 for the bump through an electroplating process, (C) laminating an insulating layer 140 on one surface 111 of the carrier 110 so as to apply the bump 130, (D) forming a circuit layer 150 including a via 155 connected with the bump 130 on the insulating layer 140, and (E) removing the carrier 110, whereby the process of forming separate solder balls is removed by forming the cavities 111 for the bumps in the carriers 110 to form the bumps, thereby simplifying the process of manufacturing a circuit board and reducing the lead time.
摘要翻译：这里公开了一种制造电路板的方法。根据本发明的优选实施例的制造电路板的方法被配置为包括（A）在载体110的一个表面111上形成用于凸块的空腔115，（B）在空腔115中形成凸块130 对于通过电镀工艺的凸块，（C）在载体110的一个表面111上层叠绝缘层140以施加凸起130，（D）形成包括与凸起130连接的通孔155的电路层150 绝缘层140和（E）去除载体110，由此通过形成用于载体110中的凸点的空腔111来形成分离的焊球的过程以形成凸起，从而简化了制造电路板的过程并缩短交货时间。

7. 发明授权

US07485569B2 Printed circuit board including embedded chips and method of fabricating the same 失效
标题翻译：包括嵌入式芯片的印刷电路板及其制造方法
公开(公告)号：US07485569B2
公开(公告)日：2009-02-03
申请号：US11137345
申请日：2005-05-24
申请人： Chang Sup Ryu , Doo Hwan Lee , Jin Yong Ahn , Myung Sam Kang , Suk Hyeon Cho
发明人： Chang Sup Ryu , Doo Hwan Lee , Jin Yong Ahn , Myung Sam Kang , Suk Hyeon Cho
IPC分类号： H01L21/4763
CPC分类号： H01L23/5389 , H01L25/0655 , H01L25/16 , H01L2224/82039 , H01L2924/01078 , H01L2924/01087 , H05K1/186 , H05K3/4069 , H05K3/4602 , H05K3/4614 , H05K3/4652 , H05K2201/09563 , H05K2201/10674 , H05K2203/0191
摘要： A printed circuit board having embedded chips, composed of a central layer having an embedded chip, an insulating layer formed on one surface or both surfaces of the central layer and having a via hole filled with conductive ink, and a circuit layer formed on the insulating layer and having a via hole and a circuit pattern electrically connected to the chip of the central layer through the via hole of the insulating layer. In addition, a method of fabricating a printed circuit board including embedded chips is provided.
摘要翻译：一种具有嵌入式芯片的印刷电路板，由具有嵌入式芯片的中心层，形成在中心层的一个表面或两个表面上的绝缘层，并且具有填充有导电油墨的通孔，以及形成在绝缘体上的电路层并且具有通孔和通过绝缘层的通孔与中心层的芯片电连接的电路图案。此外，提供了一种制造包括嵌入式芯片的印刷电路板的方法。

8. 发明申请

US20110048786A1 PRINTED CIRCUIT BOARD HAVING A BUMP AND A METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：具有BUMP的印刷电路板及其制造方法
公开(公告)号：US20110048786A1
公开(公告)日：2011-03-03
申请号：US12870137
申请日：2010-08-27
申请人： Suk Hyeon Cho , Jin Yong Ahn , Soon Oh Jung , Dong Ju Jeon , Ki Hwan Kim , Byung Moon Kim
发明人： Suk Hyeon Cho , Jin Yong Ahn , Soon Oh Jung , Dong Ju Jeon , Ki Hwan Kim , Byung Moon Kim
IPC分类号： H05K1/11 , H05K3/10
CPC分类号： H05K3/4015 , H05K3/007 , H05K3/20 , H05K3/28 , H05K3/4007 , H05K2201/0367 , H05K2201/10242 , H05K2203/0338 , Y10T29/49155
摘要： Disclosed herein is a printed circuit board having a bump and a method of manufacturing the same. The printed circuit board having a bump includes an insulating layer into which an inner circuit layer is impregnated; a protective layer that is formed under the insulating layer and has an opening exposing a pad unit of the inner circuit layer; and a bump that is integrally formed with the pad unit and is protruded from the inner side of the protective layer to the outside of the protective layer through the opening. The bump is integrally formed with the pad unit, thereby improving bonding strength between the bump and the printed circuit board, and the surface area of the bump is formed to be wide, thereby improving bonding strength between a solder ball and the printed circuit board.
摘要翻译：这里公开了具有凹凸的印刷电路板及其制造方法。具有凸块的印刷电路板包括绝缘层，内部电路层被浸渍到该绝缘层中; 形成在所述绝缘层之下并具有暴露所述内部电路层的焊盘单元的开口的保护层; 以及与所述垫单元一体形成并从所述保护层的内侧通过所述开口突出到所述保护层的外侧的凸块。凸块与焊盘单元一体地形成，从而提高凸块和印刷电路板之间的接合强度，并且凸块的表面积形成为宽，从而提高焊球和印刷电路板之间的接合强度。

9. 发明申请

US20090147488A1 PRINTED CIRCUIT BOARD HAVING CHIP PACKAGE MOUNTED THEREON AND METHOD OF FABRICATING SAME 审中-公开
公开(公告)号：US20090147488A1
公开(公告)日：2009-06-11
申请号：US12367768
申请日：2009-02-09
申请人： Suk Hyeon Cho , Chang Sup Ryu , Jin Soo Jeong , Jin Yong Ahn
发明人： Suk Hyeon Cho , Chang Sup Ryu , Jin Soo Jeong , Jin Yong Ahn
IPC分类号： H05K7/00
CPC分类号： H05K1/183 , H01L2224/16225 , H05K3/062 , H05K3/064 , H05K3/244 , H05K3/28 , H05K3/4652 , H05K3/4697 , H05K2201/10734 , H05K2203/1394 , Y10T29/4913 , Y10T29/49155
摘要： Disclosed is a printed circuit board (PCB) and a method of fabricating the same. A contact portion is formed on an internal layer of the multi-layered PCB. A groove is formed so as to expose the contact portion of the internal layer. A chip package is mounted on the PCB while being flip-chip bonded to the exposed contact portion of the internal layer.

10. 发明授权

US07506437B2 Printed circuit board having chip package mounted thereon and method of fabricating same 失效
标题翻译：其上安装有芯片封装的印刷电路板及其制造方法
公开(公告)号：US07506437B2
公开(公告)日：2009-03-24
申请号：US11128852
申请日：2005-05-13
申请人： Suk Hyeon Cho , Chang Sup Ryu , Jin Soo Jeong , Jin Yong Ahn
发明人： Suk Hyeon Cho , Chang Sup Ryu , Jin Soo Jeong , Jin Yong Ahn
IPC分类号： H05K3/02 , H05K3/10
CPC分类号： H05K1/183 , H01L2224/16225 , H05K3/062 , H05K3/064 , H05K3/244 , H05K3/28 , H05K3/4652 , H05K3/4697 , H05K2201/10734 , H05K2203/1394 , Y10T29/4913 , Y10T29/49155
摘要： Disclosed is a printed circuit board (PCB) and a method of fabricating the same. A contact portion is formed on an internal layer of the multi-layered PCB. A groove is formed so as to expose the contact portion of the internal layer. A chip package is mounted on the PCB while being flip-chip bonded to the exposed contact portion of the internal layer.
摘要翻译：公开了一种印刷电路板（PCB）及其制造方法。接触部分形成在多层PCB的内层上。形成凹槽以暴露内层的接触部分。芯片封装安装在PCB上，同时倒装芯片结合到内层的暴露的接触部分。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式