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    • 8. 再颁专利
    • Semiconductor laser diode and method of manufacturing the same
    • 半导体激光二极管及其制造方法
    • USRE45071E1
    • 2014-08-12
    • US13070906
    • 2011-03-24
    • Sung Ui HongJin Hong LeeJin Soo KimHo Sang KwackDae Kon Oh
    • Sung Ui HongJin Hong LeeJin Soo KimHo Sang KwackDae Kon Oh
    • H01S5/22
    • B82Y10/00B82Y20/00
    • Provided are a semiconductor laser diode and a method of manufacturing the same. The semiconductor laser diode includes a lower cladding layer disposed on a substrate; a ridge including an optical waveguide layer, an active layer, an upper cladding layer, and an ohmic contact layer, which are sequentially stacked on the lower cladding layer, and having a predetermined width, which is obtained by performing a channel etching process on both sides of the ridge; an oxide layer disposed on surfaces of the upper and lower cladding layer to control the width of the ridge; a dielectric layer disposed on left and right channels of the ridge; an upper electrode layer disposed on the entire surface of the resultant structure to enclose the ridge and the dielectric layer; and a lower electrode layer disposed on a bottom surface of the substrate. The method is simpler than a conventional process of manufacturing a semiconductor laser diode. Also, by controlling a wet oxidation time, the width of a ridge can be freely controlled and an ohmic contact layer can be automatically formed.
    • 提供半导体激光二极管及其制造方法。 半导体激光二极管包括设置在基板上的下包层; 包括光波导层,有源层,上覆层和欧姆接触层的脊,其顺序地层叠在下包层上,并且具有预定的宽度,其通过对两者进行沟道蚀刻处理而获得 山脊边; 设置在所述上​​下包层的表面上以控制所述脊的宽度的氧化物层; 布置在所述脊的左通道和右通道上的电介质层; 设置在所得结构的整个表面上以包围脊和电介质层的上电极层; 以及设置在所述基板的底面上的下电极层。 该方法比制造半导体激光二极管的常规方法简单。 此外,通过控制湿式氧化时间,可以自由地控制脊的宽度,并且可以自动形成欧姆接触层。
    • 10. 发明授权
    • Semiconductor laser diode and method of manufacturing the same
    • 半导体激光二极管及其制造方法
    • US07508857B2
    • 2009-03-24
    • US11265712
    • 2005-11-02
    • Sung Ui HongJin Hong LeeJin Soo KimHo Sang KwackDae Kon Oh
    • Sung Ui HongJin Hong LeeJin Soo KimHo Sang KwackDae Kon Oh
    • H01S5/00
    • H01S5/227B82Y10/00B82Y20/00H01S5/2215H01S5/2216H01S5/2275H01S5/3412H01S5/34306H01S5/34366
    • Provided are a semiconductor laser diode and a method of manufacturing the same. The semiconductor laser diode includes a lower cladding layer disposed on a substrate; a ridge including an optical waveguide layer, an active layer, an upper cladding layer, and an ohmic contact layer, which are sequentially stacked on the lower cladding layer, and having a predetermined width, which is obtained by performing a channel etching process on both sides of the ridge; an oxide layer disposed on surfaces of the upper and lower cladding layer to control the width of the ridge; a dielectric layer disposed on left and right channels of the ridge; an upper electrode layer disposed on the entire surface of the resultant structure to enclose the ridge and the dielectric layer; and a lower electrode layer disposed on a bottom surface of the substrate. The method is simpler than a conventional process of manufacturing a semiconductor laser diode. Also, by controlling a wet oxidation time, the width of a ridge can be freely controlled and an ohmic contact layer can be automatically formed.
    • 提供半导体激光二极管及其制造方法。 半导体激光二极管包括设置在基板上的下包层; 包括光波导层,有源层,上覆层和欧姆接触层的脊,其顺序地层叠在下包层上,并且具有预定的宽度,其通过对两者进行沟道蚀刻处理而获得 山脊边; 设置在所述上​​下包层的表面上以控制所述脊的宽度的氧化物层; 布置在所述脊的左通道和右通道上的电介质层; 设置在所得结构的整个表面上以包围脊和电介质层的上电极层; 以及设置在所述基板的底面上的下电极层。 该方法比制造半导体激光二极管的常规方法简单。 此外,通过控制湿式氧化时间,可以自由地控制脊的宽度,并且可以自动形成欧姆接触层。