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1. 发明申请

US20110227221A1 ELECTRONIC DEVICE HAVING INTERCONNECTIONS AND PADS 有权
标题翻译：具有互连和贴片的电子设备
公开(公告)号：US20110227221A1
公开(公告)日：2011-09-22
申请号：US13028836
申请日：2011-02-16
申请人： Ji-Yong Park , Hee-Seok Lee , Chul-Woo Kim , Sang-Gui Jo , Kwang-Jin Bae , Seung-Hwan Kim
发明人： Ji-Yong Park , Hee-Seok Lee , Chul-Woo Kim , Sang-Gui Jo , Kwang-Jin Bae , Seung-Hwan Kim
IPC分类号： H01L23/48 , H01L21/768
CPC分类号： H01L24/03 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L24/05 , H01L24/06 , H01L24/13 , H01L2224/02166 , H01L2224/0401 , H01L2224/05553 , H01L2224/05558 , H01L2224/05559 , H01L2224/0557 , H01L2224/0603 , H01L2224/13006 , H01L2224/13007 , H01L2224/1403 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2224/05552 , H01L2924/00
摘要： An electronic device includes first and second interconnections formed on a first surface of a substrate and spaced apart from each other. The electronic device includes a first insulating material layer disposed on the substrate including the first and second interconnections and including a first opening exposing a predetermined region of the first interconnection. The electronic device further includes a first pad filling the first opening and having a greater width than the first opening. The first pad covers at least a part of the second interconnection adjacent to one end of the first interconnection, and the first pad is electrically insulated from the second interconnection by the first insulating material layer.
摘要翻译：电子设备包括形成在基板的第一表面上并彼此间隔开的第一和第二互连。电子设备包括设置在基板上的第一绝缘材料层，包括第一和第二互连，并且包括暴露第一互连的预定区域的第一开口。电子设备还包括填充第一开口并且具有比第一开口更大的宽度的第一垫。第一焊盘覆盖与第一互连的一端相邻的第二互连的至少一部分，并且第一焊盘通过第一绝缘材料层与第二互连电绝缘。

2. 发明授权

US08466554B2 Electronic device having interconnections, openings, and pads having greater width than the openings 有权
标题翻译：具有互连，开口和垫片的电子设备具有比开口宽的宽度
公开(公告)号：US08466554B2
公开(公告)日：2013-06-18
申请号：US13028836
申请日：2011-02-16
申请人： Ji-Yong Park , Hee-Seok Lee , Chul-Woo Kim , Sang-Gui Jo , Kwang-Jin Bae , Seung-Hwan Kim
发明人： Ji-Yong Park , Hee-Seok Lee , Chul-Woo Kim , Sang-Gui Jo , Kwang-Jin Bae , Seung-Hwan Kim
IPC分类号： H01L23/498 , H01L21/768 , H01L23/12 , H01L23/053
CPC分类号： H01L24/03 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L24/05 , H01L24/06 , H01L24/13 , H01L2224/02166 , H01L2224/0401 , H01L2224/05553 , H01L2224/05558 , H01L2224/05559 , H01L2224/0557 , H01L2224/0603 , H01L2224/13006 , H01L2224/13007 , H01L2224/1403 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2224/05552 , H01L2924/00
摘要： An electronic device includes first and second interconnections formed on a first surface of a substrate and spaced apart from each other. The electronic device includes a first insulating material layer disposed on the substrate including the first and second interconnections and including a first opening exposing a predetermined region of the first interconnection. The electronic device further includes a first pad filling the first opening and having a greater width than the first opening. The first pad covers at least a part of the second interconnection adjacent to one end of the first interconnection, and the first pad is electrically insulated from the second interconnection by the first insulating material layer.
摘要翻译：电子设备包括形成在基板的第一表面上并彼此间隔开的第一和第二互连。电子设备包括设置在基板上的第一绝缘材料层，包括第一和第二互连，并且包括暴露第一互连的预定区域的第一开口。电子设备还包括填充第一开口并且具有比第一开口更大的宽度的第一垫。第一焊盘覆盖与第一互连的一端相邻的第二互连的至少一部分，并且第一焊盘通过第一绝缘材料层与第二互连电绝缘。

3. 发明申请

US20140117536A1 WIRING SUBSTRATE, TAPE PACKAGE HAVING THE SAME, AND DISPLAY DEVICE HAVING THE SAME 审中-公开
标题翻译：接线基板，具有该基板的带包装及其相关的显示装置
公开(公告)号：US20140117536A1
公开(公告)日：2014-05-01
申请号：US13693142
申请日：2012-12-04
申请人： Ji-Hwan HWANG , Dong-Han Kim , Chul-Woo Kim , Chung-Ye Chung , Kwang-Jin Bae
发明人： Ji-Hwan HWANG , Dong-Han Kim , Chul-Woo Kim , Chung-Ye Chung , Kwang-Jin Bae
IPC分类号： H05K1/02 , H01L23/00
CPC分类号： H05K1/0277 , H01L23/49838 , H01L23/4985 , H01L24/50 , H01L2924/14 , H01L2924/181 , H05K1/111 , H05K1/189 , H05K2201/097 , H05K2201/09709 , H05K2201/10128 , H05K2201/10674 , Y02P70/611 , H01L2924/00
摘要： A wiring substrate includes a base film, a plurality of first wirings and a plurality of second wirings. The base film has a chip-mounting region configured for mounting a semiconductor chip thereon. The first wirings extend in a first direction from inside the chip-mounting region to outside the chip-mounting region, and include first connection end portions extending in a second direction different from the first direction. The first connection end portions may be formed inside the chip-mounting region and configured to electrically connect to the semiconductor chip. The second wirings extend in the first direction from inside the chip-mounting region to outside the chip-mounting region, and include second connection end portions extending in the opposite direction to the second direction in which the first connection end portions extend, and the second connection end portions may be formed inside the chip-mounting region and configured to electrically connect to the semiconductor chip.
摘要翻译：布线基板包括基膜，多个第一布线和多个第二布线。基膜具有芯片安装区域，用于在其上安装半导体芯片。第一布线沿芯片安装区域内的第一方向延伸到芯片安装区域的外部，并且包括沿与第一方向不同的第二方向延伸的第一连接端部。第一连接端部可以形成在芯片安装区域的内部并且被配置为电连接到半导体芯片。所述第二配线从所述芯片安装区域的内部朝向所述芯片安装区域的外部沿所述第一方向延伸，并且包括沿与所述第一连接端部延伸的所述第二方向相反的方向延伸的第二连接端部，连接端部可以形成在芯片安装区域内部，并且被配置为电连接到半导体芯片。

4. 发明授权

US08339561B2 Wiring substrate, tape package having the same, and display device having the same 有权
标题翻译：配线基板，具有该布线基板的带包装及其显示装置
公开(公告)号：US08339561B2
公开(公告)日：2012-12-25
申请号：US12353317
申请日：2009-01-14
申请人： Ji-Hwan Hwang , Dong-Han Kim , Chul-Woo Kim , Chung-Ye Chung , Kwang-Jin Bae
发明人： Ji-Hwan Hwang , Dong-Han Kim , Chul-Woo Kim , Chung-Ye Chung , Kwang-Jin Bae
IPC分类号： G02F1/1345
CPC分类号： H05K1/0277 , H01L23/49838 , H01L23/4985 , H01L24/50 , H01L2924/14 , H01L2924/181 , H05K1/111 , H05K1/189 , H05K2201/097 , H05K2201/09709 , H05K2201/10128 , H05K2201/10674 , Y02P70/611 , H01L2924/00
摘要： A wiring substrate includes a base film, a plurality of first wirings and a plurality of second wirings. The base film has a chip-mounting region configured for mounting a semiconductor chip thereon. The first wirings extend in a first direction from inside the chip-mounting region to outside the chip-mounting region, and include first connection end portions extending in a second direction different from the first direction. The first connection end portions may be formed inside the chip-mounting region and configured to electrically connect to the semiconductor chip. The second wirings extend in the first direction from inside the chip-mounting region to outside the chip-mounting region, and include second connection end portions extending in the opposite direction to the second direction in which the first connection end portions extend, and the second connection end portions may be formed inside the chip-mounting region and configured to electrically connect to the semiconductor chip.
摘要翻译：布线基板包括基膜，多个第一布线和多个第二布线。基膜具有芯片安装区域，用于在其上安装半导体芯片。第一布线沿芯片安装区域内的第一方向延伸到芯片安装区域的外部，并且包括沿与第一方向不同的第二方向延伸的第一连接端部。第一连接端部可以形成在芯片安装区域的内部并且被配置为电连接到半导体芯片。所述第二配线从所述芯片安装区域的内部朝向所述芯片安装区域的外侧沿所述第一方向延伸，并且包括沿与所述第一连接端部延伸的所述第二方向相反的方向延伸的第二连接端部，连接端部可以形成在芯片安装区域内部，并且被配置为电连接到半导体芯片。

5. 发明申请

US20110247871A1 MULTI-LAYER PRINTED CIRCUIT BOARD COMPRISING FILM AND METHOD FOR FABRICATING THE SAME 审中-公开
标题翻译：包含薄膜的多层印刷电路板及其制造方法
公开(公告)号：US20110247871A1
公开(公告)日：2011-10-13
申请号：US13032100
申请日：2011-02-22
申请人： Soo-Jeoung Park , Chul-Woo Kim , Kyoung-Sei Choi , Kwang-Jin Bae
发明人： Soo-Jeoung Park , Chul-Woo Kim , Kyoung-Sei Choi , Kwang-Jin Bae
IPC分类号： H05K1/11
CPC分类号： H05K3/46 , H05K3/4602 , H05K3/462 , H05K2201/096 , Y10T29/49155
摘要： A multi-layer printed circuit board (PCB) and a method for fabricating the same are provided. The multi-layer printed circuit board may include a first film and a first insulation layer. The first film may include a first via therein and the first film may further include a first conductive pattern on an upper surface thereof and the first conductive layer may be electrically connected to the first via. The first insulation layer may be on the upper surface of the first film and the first insulation layer may include a second via therein and a second conductive pattern on an upper surface thereof and the second conductive pattern may be electrically connected to the second via. The second via may be electrically connected to the first conductive pattern.
摘要翻译：提供了一种多层印刷电路板（PCB）及其制造方法。多层印刷电路板可以包括第一膜和第一绝缘层。第一膜可以包括其中的第一通孔，并且第一膜还可以包括在其上表面上的第一导电图案，并且第一导电层可以电连接到第一通孔。第一绝缘层可以在第一膜的上表面上，并且第一绝缘层可以包括其中的第二通孔和在其上表面上的第二导电图案，并且第二导电图案可以电连接到第二通孔。第二通孔可以电连接到第一导电图案。

6. 发明申请

US20090184418A1 WIRING SUBSTRATE, TAPE PACKAGE HAVING THE SAME, AND DISPLAY DEVICE HAVING THE SAME 有权
标题翻译：接线基板，具有该基板的带包装及其相关的显示装置
公开(公告)号：US20090184418A1
公开(公告)日：2009-07-23
申请号：US12353317
申请日：2009-01-14
申请人： Ji-Hwan HWANG , Dong-Han Kim , Chul-Woo Kim , Chung-Ye Chung , Kwang-Jin Bae
发明人： Ji-Hwan HWANG , Dong-Han Kim , Chul-Woo Kim , Chung-Ye Chung , Kwang-Jin Bae
IPC分类号： H01L23/498 , H05K1/18
CPC分类号： H05K1/0277 , H01L23/49838 , H01L23/4985 , H01L24/50 , H01L2924/14 , H01L2924/181 , H05K1/111 , H05K1/189 , H05K2201/097 , H05K2201/09709 , H05K2201/10128 , H05K2201/10674 , Y02P70/611 , H01L2924/00
摘要： A wiring substrate includes a base film, a plurality of first wirings and a plurality of second wirings. The base film has a chip-mounting region configured for mounting a semiconductor chip thereon. The first wirings extend in a first direction from inside the chip-mounting region to outside the chip-mounting region, and include first connection end portions extending in a second direction different from the first direction. The first connection end portions may be formed inside the chip-mounting region and configured to electrically connect to the semiconductor chip. The second wirings extend in the first direction from inside the chip-mounting region to outside the chip-mounting region, and include second connection end portions extending in the opposite direction to the second direction in which the first connection end portions extend, and the second connection end portions may be formed inside the chip-mounting region and configured to electrically connect to the semiconductor chip.
摘要翻译：布线基板包括基膜，多个第一布线和多个第二布线。基膜具有芯片安装区域，用于在其上安装半导体芯片。第一布线沿芯片安装区域内的第一方向延伸到芯片安装区域的外部，并且包括沿与第一方向不同的第二方向延伸的第一连接端部。第一连接端部可以形成在芯片安装区域的内部并且被配置为电连接到半导体芯片。所述第二配线从所述芯片安装区域的内部朝向所述芯片安装区域的外侧沿所述第一方向延伸，并且包括沿与所述第一连接端部延伸的所述第二方向相反的方向延伸的第二连接端部，连接端部可以形成在芯片安装区域内部，并且被配置为电连接到半导体芯片。

7. 发明授权

US08989662B2 Method and apparatus for automatic bluetooth connection in a mobile communication terminal 有权
标题翻译：移动通信终端中自动蓝牙连接的方法和装置
公开(公告)号：US08989662B2
公开(公告)日：2015-03-24
申请号：US11583397
申请日：2006-10-19
申请人： Chul-Woo Kim
发明人： Chul-Woo Kim
IPC分类号： H04B7/00 , H04W12/06 , H04L29/06 , H04M1/725 , H04W84/18
CPC分类号： H04W12/06 , H04L63/0492 , H04M1/7253 , H04M1/7258 , H04M2250/02 , H04W12/04 , H04W84/18
摘要： A method of automatically connecting to a peripheral Bluetooth device and service in a mobile communication terminal having a Bluetooth module is provided. Upon input of a key, it is determined whether the key includes a Bluetooth mode key. If the key includes the Bluetooth mode key, the terminal transitions to a Bluetooth mode. A Bluetooth device or service corresponding to the key as a short key is detected and connected.
摘要翻译：提供了一种在具有蓝牙模块的移动通信终端中自动连接到外围蓝牙设备和服务的方法。一键输入后，确定键是否包括蓝牙模式键。如果键包括蓝牙模式键，则终端转换到蓝牙模式。检测并连接与密钥对应的蓝牙设备或服务作为短信。

8. 发明申请

US20090189652A1 Frequency Multiplier 有权
标题翻译：频率乘数
公开(公告)号：US20090189652A1
公开(公告)日：2009-07-30
申请号：US11659023
申请日：2005-07-27
申请人： Chul-Woo Kim , Jin-Han Kim , Seok-Ryung Yoon , Young-Ho Kwak , Seok-Soo Yoon
发明人： Chul-Woo Kim , Jin-Han Kim , Seok-Ryung Yoon , Young-Ho Kwak , Seok-Soo Yoon
IPC分类号： H03B19/00
CPC分类号： G06F7/68
摘要： A frequency multiplier is disclosed. A plurality of voltage regulators each regulate levels of voltages at first and second common nodes in response to a corresponding one of input signals from a voltage-controlled delay line. An input buffer charges the first node or discharges the second node in response to a feedback signal. An output buffer regulates a level of a voltage at an output node and outputs a frequency-multiplied clock signal and the feedback signal corresponding to the voltage level of the output node. A discharge circuit discharges the first node before a rising edge of each of the input signals from the voltage-controlled delay line is inputted. A charge circuit charges the second node before the rising edge of each of the input signals from the voltage-controlled delay line is inputted.
摘要翻译：公开了一种倍频器。多个电压调节器响应于来自电压控制延迟线的输入信号中的相应一个，调节第一和第二公共节点处的电压电平。输入缓冲器对第一节点进行充电或响应于反馈信号对第二节点进行放电。输出缓冲器调节输出节点处的电压电平，并输出倍频时钟信号和对应于输出节点电压电平的反馈信号。在输入来自压控延迟线的每个输入信号的上升沿之前，放电电路对第一节点放电。在输入来自压控延迟线的每个输入信号的上升沿之前，充电电路对第二节点充电。

9. 发明授权

US07815753B2 Fe-based bulk amorphous alloy compositions containing more than 5 elements and composites containing the amorphous phase 有权
标题翻译：含有超过5种元素的Fe基块状非晶合金组合物和含有非晶相的复合材料
公开(公告)号：US07815753B2
公开(公告)日：2010-10-19
申请号：US11719871
申请日：2005-08-11
申请人： Seong-Hoon Yi , Hong-Xiang Li , Myung-Il Heo , Jong-Chul Yi , Dong-Jin Yu , Sang-Hum Kwon , Chul-Woo Kim , Jong-Won Kim , In-Seok Hwang
发明人： Seong-Hoon Yi , Hong-Xiang Li , Myung-Il Heo , Jong-Chul Yi , Dong-Jin Yu , Sang-Hum Kwon , Chul-Woo Kim , Jong-Won Kim , In-Seok Hwang
IPC分类号： C22C45/02
CPC分类号： C22C45/02
摘要： Disclosed is a Fe-based bulk amorphous alloy composition which forms a bulk amorphous substance due to its excellent amorphous formability when it is cooled to a temperature lower than its glass transition temperature from the liquid state at a relatively low cooling rate of 1000 K/s or less, has high warm processability in a low temperature range owing to its supercooled liquid region of 20K or higher and has excellent fluidity in the liquid state and thereby good castability. The Fe-based multi-element bulk amorphous alloy composition is represented by a formula of FeαCβSiγBxPyMa, in which M is at least one element selected from Ti(titanium), Cr(chromium), Mo(molybdenum), Nb(niobium), Zr(Zirconium), Ta(tantalum), W(tungsten) and V(vanadium), α, β, γ, x, y, and a each represent atomic % of iron(Fe), Carbon(C), silicon(Si), boron(B), phosphorus(P) and the selected metal element, in which α is 100-(β+γ+x+y+a) atomic %, β is 6 atomic % or more and 13 atomic % or less, γ is 1 atomic % or more and 5 atomic % or less, x is 4.5 atomic % or more and 9.5 atomic % or less, y is 3 atomic % or more and 10 atomic % or less and a is 0.1 atomic % or more and 6 atomic % or less.
摘要翻译：公开了一种Fe基块状非晶态合金组合物，由于其以非常低的冷却速度1000K / s从液态冷却到比其玻璃化转变温度低的温度时，由于其非晶形成性优异而形成块状非晶态物质或更低，由于其过冷液体区域为20K以上，在低温范围内具有高温加工性，并且在液态下具有优异的流动性，从而具有良好的浇铸性。 Fe基多元素块状非晶合金组合物由FeαCbBiSiYBxPyMa的式表示，其中M为选自Ti（钛），Cr（铬），Mo（钼），Nb（铌），Zr（锆），Ta（钽），W（钨）和V（钒），α，bgr，γ，x，y和a分别表示铁（Fe），碳（C）（Si），硼（B），磷（P）和选择的金属元素，其中α为100 - （＆bgr。+γ+ x + y + a）原子％，bgr; 为6原子％以上且13原子％以下，γ为1原子％以上且5原子％以下，x为4.5原子％以上且9.5原子％以下，y为3原子％以上10 原子％以下，a为0.1原子％以上且6原子％以下。

10. 发明申请

US20100222263A1 ATAP PEPTIDES, NUCLEIC ACIDS ENCODING THE SAME AND ASSOCIATED METHODS OF USE 有权
标题翻译： ATAP肽，编码它们的核酸和相关的使用方法
公开(公告)号：US20100222263A1
公开(公告)日：2010-09-02
申请号：US12444288
申请日：2007-10-03
申请人： Jianjie Ma , Jae-Kyun Ko , Chul-Woo Kim , Noah Weisleder
发明人： Jianjie Ma , Jae-Kyun Ko , Chul-Woo Kim , Noah Weisleder
IPC分类号： A61K38/16 , C07H21/04 , A61K31/7088 , A61P35/00 , C07K16/00 , C07K14/00 , C12N15/63 , C12N5/10 , C12N1/21
CPC分类号： A61K38/00 , A61K48/00 , C07K14/4747 , C07K2319/10 , C07K2319/21 , C07K2319/60
摘要： Disclosed herein are nucleic acid sequences that encode pro-apoptotic polypeptides. Also disclosed are polypeptides encoded by these nucleic acid sequences, and antibodies, which immunospecifically-bind to the polypeptide, as well as derivatives, variants, mutants, or fragments of the aforementioned polypeptide, polynucleotide, or antibody. The invention further discloses therapeutic, diagnostic and research methods for diagnosis, treatment, and prevention of proliferative disorders and bacterial infections using the nucleic acids and proteins of the invention.
摘要翻译：本文公开了编码促凋亡多肽的核酸序列。还公开了由这些核酸序列编码的多肽，以及免疫特异性结合多肽的抗体以及上述多肽，多核苷酸或抗体的衍生物，变体，突变体或片段。本发明还公开了使用本发明的核酸和蛋白质进行诊断，治疗和预防增殖性疾病和细菌感染的治疗，诊断和研究方法。

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