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    • 3. 发明授权
    • Imaging array and methods for fabricating same
    • 成像阵列及其制造方法
    • US06559506B1
    • 2003-05-06
    • US10115829
    • 2002-04-03
    • Ji Ung LeeGeorge Edward Possin
    • Ji Ung LeeGeorge Edward Possin
    • H01L2701
    • H01L27/14658H01L27/14643
    • A radiation detector includes a top gate thin film transistor (TFT) including a source electrode, a drain electrode, a gate electrode, a TFT dielectric layer, a TFT semiconductive layer, and a TFT intrinsic amorphous silicon (a-Si) layer. The radiation detector also includes a capacitor including a first electrode, a second electrode substantially coplanar with the gate electrode, and a capacitor dielectric, the capacitor dielectric including a capacitor dielectric layer substantially coplanar with the TFT dielectric layer, a capacitor semiconductive layer substantially coplanar with the TFT semiconductive layer, and a capacitor a-Si layer substantially coplanar with the TFT a-Si layer.
    • 辐射检测器包括一个包括源电极,漏电极,栅电极,TFT电介质层,TFT半导体层和TFT本征非晶硅(a-Si)层的顶栅极薄膜晶体管(TFT)。 放射线检测器还包括电容器,其包括第一电极,与栅电极基本上共面的第二电极和电容器电介质,电容器电介质包括与TFT电介质层基本共面的电容器电介质层,与TFT电介质层基本共面的电容器半导体层, TFT半导体层和与TFT a-Si层基本上共面的电容器a-Si层。
    • 6. 发明授权
    • Method for reducing emitter tip to gate spacing in field emission devices
    • 在场致发射器件中减少发射极尖端与栅极间距的方法
    • US06394871B2
    • 2002-05-28
    • US09945510
    • 2001-08-30
    • Ji Ung Lee
    • Ji Ung Lee
    • H01J902
    • H01J9/025
    • An improved structure and method are provided to decouple the gate dielectric thickness and the emitter tip to gate layer distance by etching the dielectric using ion bombardment. The ion bombardment, or ion etch, is performed prior to depositing the gate layer. The improved structure and method will allow a smaller distance between the emitter tip and the gate structure without having to decrease the thickness of the gate insulator layer. The smaller emitter tip to gate distance lowers the turn-on voltage which is highly desirable in such areas as beam optics and power dissipation.
    • 提供改进的结构和方法,通过使用离子轰击蚀刻电介质来将栅极电介质厚度和发射极尖端去除栅极层距离。 离子轰击或离子蚀刻在沉积栅极层之前进行。 改进的结构和方法将允许发射极尖端和栅极结构之间的距离更小,而不必减小栅极绝缘体层的厚度。 较小的发射极尖端到栅极距离降低了导通电压,这在诸如光束光学和功率耗散的区域中是非常需要的。
    • 8. 发明授权
    • Field emission devices having structure for reduced emitter tip to gate spacing
    • 具有用于减小发射极尖端到栅极间隔的结构的场致发射器件
    • US06710539B2
    • 2004-03-23
    • US09145595
    • 1998-09-02
    • Ji Ung Lee
    • Ji Ung Lee
    • H01J1304
    • H01J9/025
    • An improved structure and method are provided to decouple the gate dielectric thickness and the emitter tip to gate layer distance by etching the dielectric using ion bombardment. The ion bombardment, or ion etch, is performed prior to depositing the gate layer. The improved structure and method will allow a smaller distance between the emitter tip and the gate structure without having to decrease the thickness of the gate insulator layer. The smaller emitter tip to gate distance lowers the turn-on voltage which is highly desirable in such areas as beam optics and power dissipation.
    • 提供改进的结构和方法,通过使用离子轰击蚀刻电介质来将栅极电介质厚度和发射极尖端去除栅极层距离。 离子轰击或离子蚀刻在沉积栅极层之前进行。 改进的结构和方法将允许发射极尖端和栅极结构之间的距离更小,而不必减小栅极绝缘体层的厚度。 较小的发射极尖端到栅极距离降低了导通电压,这在诸如光束光学和功率耗散的区域中是非常需要的。
    • 9. 发明授权
    • Methods of forming field emission display backplates
    • 形成场发射显示背板的方法
    • US06464550B2
    • 2002-10-15
    • US09838845
    • 2001-04-20
    • Ji Ung Lee
    • Ji Ung Lee
    • H01J902
    • H01J9/025H01J3/022H01J2201/30407
    • The present invention includes field emission display backplates and methods of forming field emission display backplates. According to one aspect, the present invention provides a field emission display backplate including a substrate having a surface; an emitter which extends from the surface of the substrate; and an anode having an upper surface, a lower surface, and an opening surface which defines an opening aligned with the emitter, the opening surface includes a first portion which curves outward relative to the anode and a second portion which curves inward relative to the anode.
    • 本发明包括场发射显示背板和形成场发射显示背板的方法。 根据一个方面,本发明提供一种场发射显示器背板,其包括具有表面的基板; 从衬底的表面延伸的发射体; 以及具有上表面,下表面和限定与发射器对准的开口的开口表面的阳极,所述开口表面包括相对于阳极向外弯曲的第一部分和相对于阳极向内弯曲的第二部分 。
    • 10. 发明授权
    • Method for forming an electrostatically-doped carbon nanotube device
    • 形成静电掺杂碳纳米管器件的方法
    • US06890780B2
    • 2005-05-10
    • US10683895
    • 2003-10-10
    • Ji Ung Lee
    • Ji Ung Lee
    • H01L21/00H01L29/12H01L29/26H01L33/24H01L51/00H01L51/30H01L51/40
    • H01L51/0545B82Y10/00B82Y20/00G11C13/025H01L33/24H01L51/002H01L51/0048H01L51/0512Y10S977/742Y10S977/842Y10S977/95
    • The present invention provides a method and associated structure for forming an electrostatically-doped carbon nanotube device. The method includes providing a carbon nanotube having a first end and a second end. The method also includes disposing a first metal contact directly adjacent to the first end of the carbon nanotube, wherein the first metal contact is electrically coupled to the first end of the carbon nanotube, and disposing a second metal contact directly adjacent to the second end of the carbon nanotube, wherein the second metal contact is electrically coupled to the second end of the carbon nanotube. The method further includes disposing a first metal electrode adjacent to and at a distance from the first end of the carbon nanotube, wherein the first metal electrode is capacitively coupled to the first end of the carbon nanotube, and disposing a second metal electrode adjacent to and at a distance from the second end of the carbon nanotube, wherein the second metal electrode is capacitively coupled to the second end of the carbon nanotube. The method still further includes selectively applying a first bias to the first metal electrode to electrostatically dope the first end of the carbon nanotube and selectively applying a second bias to the second metal electrode to electrostatically dope the second end of the carbon nanotube.
    • 本发明提供了一种用于形成静电掺杂碳纳米管器件的方法和相关结构。 该方法包括提供具有第一端和第二端的碳纳米管。 该方法还包括将直接与碳纳米管的第一端直接相邻的第一金属触点设置,其中第一金属触点电耦合到碳纳米管的第一端,并且将第二金属触点直接邻近于碳纳米管的第二端 所述碳纳米管,其中所述第二金属触点电耦合到所述碳纳米管的第二端。 该方法还包括在碳纳米管的第一端附近设置第一金属电极,并且与碳纳米管的第一端相距一定距离,其中第一金属电极电容耦合到碳纳米管的第一端,并且设置第二金属电极 在距离碳纳米管的第二端一定距离处,其中第二金属电极电容耦合到碳纳米管的第二端。 该方法还包括:选择性地向第一金属电极施加第一偏压以静电地掺杂碳纳米管的第一端,并选择性地向第二金属电极施加第二偏压,以静电地掺杂碳纳米管的第二端。