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1. 发明申请

US20140285967A1 CONFORMAL COATING INCLUDING EMBEDDED THERMAL ENERGY ABSORBING MATERIAL 有权
标题翻译：包括嵌入式热能吸收材料的一致涂层
公开(公告)号：US20140285967A1
公开(公告)日：2014-09-25
申请号：US13976438
申请日：2012-12-11
申请人： Jered H. Wikander , Mark MacDonald , Shawn S. McEuen , Harish Jagadish , David Pidwerbecki
发明人： Jered H. Wikander , Mark MacDonald , Shawn S. McEuen , Harish Jagadish , David Pidwerbecki
IPC分类号： H05K7/20 , H05K3/00 , G06F1/20
CPC分类号： H05K1/0209 , G06F1/1656 , G06F1/203 , H05K3/00 , H05K3/284 , H05K7/2039
摘要： Examples are disclosed for a conformal coating molded around power source circuitry, electrical components or at least portions of a display for a computing device. The conformal coating to include embedded microencapsulated thermal energy storage material to absorb heat generated by the electrical components.
摘要翻译：公开了用于围绕电源电路，电气部件或用于计算设备的显示器的至少部分模制的保形涂层的示例。保形涂层包括嵌入式微胶囊化热能储存材料，以吸收由电气部件产生的热量。

2. 发明授权

US08605428B2 Apparatus, system and method for concealed venting thermal solution 有权
公开(公告)号：US08605428B2
公开(公告)日：2013-12-10
申请号：US13175052
申请日：2011-07-01
申请人： Mark MacDonald , Shawn S. McEuen
发明人： Mark MacDonald , Shawn S. McEuen
IPC分类号： H05K7/20
CPC分类号： G06F1/203 , G06F1/1688 , H05K7/20 , H05K7/20145
摘要： Some embodiments of an apparatus, system and method are described for a concealed venting thermal solution. An apparatus may comprise an enclosure arranged around one or more heat generating components, a duct arranged around an internal perimeter of the enclosure and a seam inlet arranged around an external perimeter of the enclosure to allow an airflow to enter the duct. Other embodiments are described.

3. 发明申请

US20140098488A1 APPARATUS, SYSTEM AND METHOD FOR CONCEALED VENTING THERMAL SOLUTION 审中-公开
标题翻译：用于隐蔽式通风热解决方案的装置，系统和方法
公开(公告)号：US20140098488A1
公开(公告)日：2014-04-10
申请号：US14101075
申请日：2013-12-09
申请人： Mark MacDonald , Shawn S. McEuen
发明人： Mark MacDonald , Shawn S. McEuen
IPC分类号： G06F1/20
CPC分类号： G06F1/203 , G06F1/1688 , H05K7/20 , H05K7/20145
摘要： Some embodiments of an apparatus, system and method are described for a concealed venting thermal solution. An apparatus may comprise an enclosure arranged around one or more heat generating components, a duct arranged around an internal perimeter of the enclosure and a seam inlet arranged around an external perimeter of the enclosure to allow an airflow to enter the duct. Other embodiments are described.
摘要翻译：对于隐藏的排气热解决方案描述了装置，系统和方法的一些实施例。装置可以包括围绕一个或多个发热部件布置的外壳，围绕外壳的内周边布置的管道和围绕外壳的外周设置的允许气流进入管道的接缝入口。描述其他实施例。

4. 发明申请

US20130003282A1 APPARATUS, SYSTEM AND METHOD FOR CONCEALED VENTING THERMAL SOLUTION 有权
公开(公告)号：US20130003282A1
公开(公告)日：2013-01-03
申请号：US13175052
申请日：2011-07-01
申请人： Mark MacDonald , Shawn S. McEuen
发明人： Mark MacDonald , Shawn S. McEuen
IPC分类号： H05K7/20 , F28F13/00 , G06F1/16
CPC分类号： G06F1/203 , G06F1/1688 , H05K7/20 , H05K7/20145
摘要： Some embodiments of an apparatus, system and method are described for a concealed venting thermal solution. An apparatus may comprise an enclosure arranged around one or more heat generating components, a duct arranged around an internal perimeter of the enclosure and a seam inlet arranged around an external perimeter of the enclosure to allow an airflow to enter the duct. Other embodiments are described.

5. 发明授权

US07280347B2 Universal battery pack 有权
标题翻译：通用电池组
公开(公告)号：US07280347B2
公开(公告)日：2007-10-09
申请号：US11025574
申请日：2004-12-29
申请人： Hong W. Wong , Wah Yiu Kwong , Don J. Nguyen , Shawn S. McEuen , George H. Daskalakis , Daryl J. Nelson
发明人： Hong W. Wong , Wah Yiu Kwong , Don J. Nguyen , Shawn S. McEuen , George H. Daskalakis , Daryl J. Nelson
IPC分类号： G06F1/16
CPC分类号： H01M10/425 , G06F1/1632 , H01M2/10 , H01M6/42
摘要： According to one embodiment, a system is disclosed. The system includes a chassis including a printed circuit board (PCB) and a battery pack. The battery pack includes a connector to enable the battery pack to couple to a PCB which is mounted either above the centerline of the battery pack connector and on or below the centerline of the battery pack power connector.
摘要翻译：根据一个实施例，公开了一种系统。该系统包括包括印刷电路板（PCB）和电池组的底盘。该电池组包括连接器，以使得电池组能够耦合到安装在电池组连接器的中心线上方以及电池组电源连接器的中心线上或下方的PCB。

6. 外观设计

USD461180S1 Network communication housing 失效
标题翻译：网络通信住房
公开(公告)号：USD461180S1
公开(公告)日：2002-08-06
申请号：US29148790
申请日：2001-09-28
申请人： Robert L. Van Egmond , Shawn S. McEuen , Gary L. Bookhardt , Marc A. Abrams , Neil C. Delaplane , Brad T. Combs , Josh Gordon , Ryan Wilday
设计人： Robert L. Van Egmond , Shawn S. McEuen , Gary L. Bookhardt , Marc A. Abrams , Neil C. Delaplane , Brad T. Combs , Josh Gordon , Ryan Wilday

7. 发明授权

US06328097B1 Integrated heat dissipation apparatus 有权
标题翻译：集成散热装置
公开(公告)号：US06328097B1
公开(公告)日：2001-12-11
申请号：US09608820
申请日：2000-06-30
申请人： Gary L. Bookhardt , Shawn S. McEuen
发明人： Gary L. Bookhardt , Shawn S. McEuen
IPC分类号： F28D1500
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An integrated heat dissipation apparatus includes an attachment area, a heat exchange area thermally connected to the attachment area, and an air flow generation area that is integrally formed with the attachment area and the heat exchange area. A thermally conductive member extends between the attachment area and the heat exchange area to facilitate the removal of heat from the attachment area to the heat exchange area. A generated air flow passes through the heat exchange area.
摘要翻译：集成散热装置包括附接区域，热连接到附接区域的热交换区域和与附接区域和热交换区域一体形成的气流产生区域。导热构件在附接区域和热交换区域之间延伸，以便于将热量从附着区域移除到热交换区域。产生的空气流通过热交换区域。

8. 发明授权

US06837058B1 Tablet air cooling dock 有权
标题翻译：平板电脑散热底座
公开(公告)号：US06837058B1
公开(公告)日：2005-01-04
申请号：US10611203
申请日：2003-06-30
申请人： Shawn S. McEuen , Brian Wilk , Himanshu Pokharna
发明人： Shawn S. McEuen , Brian Wilk , Himanshu Pokharna
IPC分类号： F25D15/00 , G06F1/16 , G06F1/20 , F25B21/02 , F25D23/12 , H05K5/00
CPC分类号： G06F1/20 , F25D15/00 , G06F1/1626 , G06F1/1632 , G06F1/203
摘要： A tablet air cooling dock. In one embodiment, the dock includes a cooling unit a tablet cradle to receive and support a tablet computer. The cradle includes a passageway to receive air from the cooling unit and to provide the air to a vent of the tablet computer. In one embodiment, the tablet cradle is pivotally mounted to provide multiple viewing positions of the tablet computer.
摘要翻译：平板电脑空冷基座。在一个实施例中，坞站包括用于接收和支持平板计算机的平板支架的冷却单元。支架包括用于从冷却单元接收空气并将空气提供给平板计算机的通风口的通道。在一个实施例中，平板支架枢转地安装以提供平板计算机的多个观看位置。

9. 发明授权

US06353538B1 Protective cover and packaging for multi-chip memory modules 有权
标题翻译：多芯片内存模块的保护盖和封装
公开(公告)号：US06353538B1
公开(公告)日：2002-03-05
申请号：US09311783
申请日：1999-05-13
申请人： Ihab A. Ali , Shawn S. McEuen
发明人： Ihab A. Ali , Shawn S. McEuen
IPC分类号： H05K700
CPC分类号： H01L23/3675 , H01L25/0655 , H01L2924/0002 , H01L2924/00
摘要： A memory module having a packaging cover to encapsulate a board having multiple separate chips, which dynamically generating varying amounts heat. The packaging cover provides localized heat dissipation among the multiple separate memory chips. The separate chips are interconnected to the board via a set of solder balls. The packaging cover further provides a rigid encapsulation of the board and chips. In one embodiment, the memory module includes a thermally conductive substance displaced within the packaging cover to conduct heat from the separate chips to the packaging cover. In one embodiment, the packaging cover consists of a plastic material having a sheet of metal coupled to an interior surface of the packaging cover. In one embodiment, the packaging cover includes two separate covers, with a first cover having an insert pin, and a second cover having an insert receptacle to receive the insert pin. In an alternative embodiment, the first cover of the packaging cover includes a set of clip snaps to secure a coupling between the first cover and a second cover of the packaging cover.
摘要翻译：一种存储器模块，其具有封装封装封装封装的板，该板具有多个单独的芯片，其动态地产生变化量的热量。包装盖在多个分离的存储器芯片之间提供局部散热。单独的芯片通过一组焊球与板相互连接。包装盖还提供了板和芯片的刚性封装。在一个实施例中，存储器模块包括在封装盖内移动的导热物质，以将热量从分离的芯片传导到包装盖。在一个实施例中，包装盖由具有耦合到包装盖的内表面的金属片的塑料材料组成。在一个实施例中，包装盖包括两个单独的盖，第一盖具有插入销，第二盖具有用于接收插入销的插入件插座。在替代实施例中，包装盖的第一盖包括一组夹扣，以固定第一盖和包装盖的第二盖之间的联接。

10. 发明授权

US06362965B1 Clamping heat sinks to circuit boards over processors 有权
公开(公告)号：US06362965B1
公开(公告)日：2002-03-26
申请号：US09736987
申请日：2000-12-14
申请人： Gary L. Bookhardt , Shawn S. McEuen
发明人： Gary L. Bookhardt , Shawn S. McEuen
IPC分类号： H05K720
摘要： A heat sink may be spring strapped onto a socketed processor using clips that engage the spring strap and that are pre-positioned on the circuit board. The clips may be C-shaped and may include an upper spring arm portion, a vertical portion, and a base which may be surface mounted to the circuit board. The upper spring arm of the C-shaped clip then releasably engages the spring strap to clamp the heat sink firmly onto the socketed processor.

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