专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20130130415A1 METHODS OF TESTING INTEGRATED CIRCUIT DEVICES USING FUSE ELEMENTS 有权
标题翻译：使用保险丝元件测试集成电路设备的方法
公开(公告)号：US20130130415A1
公开(公告)日：2013-05-23
申请号：US13300274
申请日：2011-11-18
申请人： Jeong-Hoon AHN , Hyun-Min Choi , Oluwafemi O. Ogunsola
发明人： Jeong-Hoon AHN , Hyun-Min Choi , Oluwafemi O. Ogunsola
IPC分类号： H01L21/66
CPC分类号： H01L22/34 , H01L22/14 , H01L22/20 , H01L23/5256 , H01L2924/0002 , H01L2924/00
摘要： Methods of fabricating integrated circuit devices utilize fuse elements to support sequential testing of vertically-integrated test elements during fabrication. These methods include forming a first test element, a first fuse and a first test pad electrically connected by the first fuse to the first test element, on a substrate. The first test element is tested by passing a first current between the first test element and first test pad and through the first fuse. The first fuse is then “cut” by increasing an impedance of the first fuse, which may include breaking the first fuse to create an electrical “open” (infinite impedance) or greatly increasing a resistance of the first fuse (e.g., by narrowing the fuse through electromigration). A second test element and a second test pad, which is electrically connected to the second test element and the first test pad, are then formed on the substrate.
摘要翻译：制造集成电路器件的方法利用熔丝元件来支持制造过程中垂直集成的测试元件的顺序测试。这些方法包括在衬底上形成第一测试元件，第一熔丝和通过第一熔丝电连接到第一测试元件的第一测试焊盘。通过在第一测试元件和第一测试焊盘之间传递第一电流并通过第一熔丝来测试第一测试元件。然后通过增加第一熔丝的阻抗来将第一熔丝“切割”，其可以包括断开第一熔丝以产生电“开放”（无限阻抗）或大大增加第一熔丝的电阻（例如，通过使第通过电迁移保险丝）。然后在基板上形成第二测试元件和与第二测试元件和第一测试焊盘电连接的第二测试焊盘。

2. 发明授权

US09087803B2 Methods of testing integrated circuit devices using fuse elements 有权
标题翻译：使用熔丝元件测试集成电路器件的方法
公开(公告)号：US09087803B2
公开(公告)日：2015-07-21
申请号：US13300274
申请日：2011-11-18
申请人： Jeong-Hoon Ahn , Hyun-Min Choi , Oluwafemi O. Ogunsola
发明人： Jeong-Hoon Ahn , Hyun-Min Choi , Oluwafemi O. Ogunsola
IPC分类号： H01L21/66 , H01L23/525
CPC分类号： H01L22/34 , H01L22/14 , H01L22/20 , H01L23/5256 , H01L2924/0002 , H01L2924/00
摘要： Methods of fabricating integrated circuit devices utilize fuse elements to support sequential testing of vertically-integrated test elements during fabrication. These methods include forming a first test element, a first fuse and a first test pad electrically connected by the first fuse to the first test element, on a substrate. The first test element is tested by passing a first current between the first test element and first test pad and through the first fuse. The first fuse is then “cut” by increasing an impedance of the first fuse, which may include breaking the first fuse to create an electrical “open” (infinite impedance) or greatly increasing a resistance of the first fuse (e.g., by narrowing the fuse through electromigration). A second test element and a second test pad, which is electrically connected to the second test element and the first test pad, are then formed on the substrate.
摘要翻译：制造集成电路器件的方法利用熔丝元件来支持制造过程中垂直集成的测试元件的顺序测试。这些方法包括在衬底上形成第一测试元件，第一熔丝和通过第一熔丝电连接到第一测试元件的第一测试焊盘。通过在第一测试元件和第一测试焊盘之间传递第一电流并通过第一熔丝来测试第一测试元件。然后通过增加第一熔丝的阻抗来将第一熔丝“切割”，其可以包括断开第一熔丝以产生电“开放”（无限阻抗）或大大增加第一熔丝的电阻（例如，通过使第通过电迁移保险丝）。然后在基板上形成第二测试元件和与第二测试元件和第一测试焊盘电连接的第二测试焊盘。

3. 发明授权

US08450212B2 Method of reducing critical dimension process bias differences between narrow and wide damascene wires 失效
标题翻译：减少狭窄和宽大马士革丝之间关键尺寸工艺偏差差异的方法
公开(公告)号：US08450212B2
公开(公告)日：2013-05-28
申请号：US13170621
申请日：2011-06-28
申请人： Matthew S. Angyal , Oluwafemi O. Ogunsola , Hakeem B. Akinmade-Yusuff
发明人： Matthew S. Angyal , Oluwafemi O. Ogunsola , Hakeem B. Akinmade-Yusuff
IPC分类号： H01L21/311
CPC分类号： H01L21/31144 , H01L21/31116 , H01L21/31138 , H01L21/76805 , H01L21/76816
摘要： A method including forming an organic polymer layer (OPL) on a substrate; forming a patterned photoresist layer having a first opening and a second opening over the OPL, the second opening wider than the first opening; performing a first reactive ion etch (RIE) to form a first trench and a second trench in the organic layer, the second trench wider than the first trench, the first trench extending into but not through the organic polymer layer, the second trench extending through the OPL to the substrate, the first RIE forming a first polymer layer on sidewalls of the first trench and a second polymer layer on sidewalls of the second trench, the second polymer layer thicker than the first polymer layer; and performing a second RIE to extend the first trench through the OPL to the substrate, the second RIE removing the second polymer layer from sidewalls of the second trench.
摘要翻译：一种包括在基材上形成有机聚合物层（OPL）的方法; 在所述OPL上形成具有第一开口和第二开口的图案化光致抗蚀剂层，所述第二开口比所述第一开口更宽; 执行第一反应离子蚀刻（RIE）以在有机层中形成第一沟槽和第二沟槽，第二沟槽比第一沟槽宽，第一沟槽延伸到但不穿过有机聚合物层，第二沟槽延伸穿过所述第一聚合物层在所述第一沟槽的侧壁上形成第一聚合物层，在所述第二沟槽的侧壁上形成第二聚合物层，所述第二聚合物层比所述第一聚合物层厚; 以及执行第二RIE以将所述第一沟槽通过所述OPL延伸到所述衬底，所述第二RIE从所述第二沟槽的侧壁移除所述第二聚合物层。

4. 发明授权

US07348786B2 Probe module for testing chips with electrical and optical input/output interconnects, methods of use, and methods of fabrication 失效
标题翻译：用于测试具有电和光输入/输出互连的芯片的探针模块，使用方法和制造方法
公开(公告)号：US07348786B2
公开(公告)日：2008-03-25
申请号：US11216645
申请日：2005-08-31
申请人： Hiren D. Thacker , Oluwafemi O. Ogunsola , James D. Meindl
发明人： Hiren D. Thacker , Oluwafemi O. Ogunsola , James D. Meindl
IPC分类号： G01R31/02 , G01R31/302 , G01R31/308
CPC分类号： G01R31/311 , G01R1/07314 , G01R31/2889 , G02B6/12 , G02B6/12004 , G02B6/4214
摘要： Probe modules, methods of use of probe modules, and methods of preparing probe modules, are disclosed. A representative embodiment of a probe module, among others, includes a redistribution substrate and a probe substrate interfaced with the redistribution substrate. The probe substrate is operative to test at least one signal of at least one optoelectronic device under test. The probe substrate is operative to interface with electrical and optical components.
摘要翻译：公开了探针模块，探针模块的使用方法和制备探针模块的方法。探针模块的代表性实施例等等包括与再分布衬底接口的再分布衬底和探针衬底。探针衬底可操作以测试至少一个被测光电器件的至少一个信号。探针基板可操作以与电气和光学部件相接合。

5. 发明申请

US20130005147A1 METHOD OF REDUCING CRITICAL DIMENSION PROCESS BIAS DIFFERENCES BETWEEN NARROW AND WIDE DAMASCENE WIRES 失效
标题翻译：降低关键尺寸过程的方法在窄幅和宽度大的线之间偏差
公开(公告)号：US20130005147A1
公开(公告)日：2013-01-03
申请号：US13170621
申请日：2011-06-28
申请人： Matthew S. Angyal , Oluwafemi O. Ogunsola , Hakeem B. Akinmade-Yusuff
发明人： Matthew S. Angyal , Oluwafemi O. Ogunsola , Hakeem B. Akinmade-Yusuff
IPC分类号： H01L21/306 , H01L21/302
CPC分类号： H01L21/31144 , H01L21/31116 , H01L21/31138 , H01L21/76805 , H01L21/76816
摘要： A method including forming an organic polymer layer (OPL) on a substrate; forming a patterned photoresist layer having a first opening and a second opening over the OPL, the second opening wider than the first opening; performing a first reactive ion etch (RIE) to form a first trench and a second trench in the organic layer, the second trench wider than the first trench, the first trench extending into but not through the organic polymer layer, the second trench extending through the OPL to the substrate, the first RIE forming a first polymer layer on sidewalls of the first trench and a second polymer layer on sidewalls of the second trench, the second polymer layer thicker than the first polymer layer; and performing a second RIE to extend the first trench through the OPL to the substrate, the second RIE removing the second polymer layer from sidewalls of the second trench.
摘要翻译：一种包括在基材上形成有机聚合物层（OPL）的方法; 在所述OPL上形成具有第一开口和第二开口的图案化光致抗蚀剂层，所述第二开口比所述第一开口更宽; 执行第一反应离子蚀刻（RIE）以在有机层中形成第一沟槽和第二沟槽，第二沟槽比第一沟槽宽，第一沟槽延伸到但不穿过有机聚合物层，第二沟槽延伸穿过所述第一聚合物层在所述第一沟槽的侧壁上形成第一聚合物层，在所述第二沟槽的侧壁上形成第二聚合物层，所述第二聚合物层比所述第一聚合物层厚; 以及执行第二RIE以将所述第一沟槽通过所述OPL延伸到所述衬底，所述第二RIE从所述第二沟槽的侧壁移除所述第二聚合物层。

6. 发明授权

US07099528B2 Methods and devices for coupling electromagnetic radiation using diffractive optical elements 失效
$Methods and devices for coupling electromagnetic radiation using diffractive optical elements$
标题翻译：使用衍射光学元件耦合电磁辐射的方法和装置
公开(公告)号：US07099528B2
公开(公告)日：2006-08-29
申请号：US10752987
申请日：2004-01-07
申请人： Alan F. Benner , Oluwafemi O. Ogunsola
发明人： Alan F. Benner , Oluwafemi O. Ogunsola
IPC分类号： G02B6/28 , G02B6/26 , G02B6/42
CPC分类号： G02B6/2848 , G02B6/32 , G02B6/34
摘要： Diffractive optical elements are used in methods and devices for coupling or distributing electromagnetic radiation. The diffractive optical. elements may be adapted to split one or more streams of radiation into multiple streams of radiation or to combine multiple streams of radiation to produce single streams. A plurality of diffractive optical elements may be fabricated on substrates by lithographic or molding methods. Diffractive optical elements that split one or more streams of radiation can be combined with diffractive optical elements that combine multiple streams of radiation to provide a coupling device, for example, a star coupler. The star coupler may be used in networked optical communication systems to provide multiple coupling between a plurality of optical drivers and a plurality of optical receivers. Aspects can be applied to any type of electromagnetic radiation having a wavelength that can be used as a medium for transferring information.
摘要翻译：衍射光学元件用于耦合或分配电磁辐射的方法和装置。衍射光学。元件可以适于将一个或多个辐射流分裂成多个辐射流或者组合多个辐射流以产生单个流。多个衍射光学元件可以通过光刻或模制方法在基底上制造。分离一个或多个辐射流的衍射光学元件可以与组合多个辐射流的衍射光学元件组合以提供耦合器件，例如星形耦合器。星形耦合器可以用于网络光通信系统中以在多个光驱动器和多个光接收器之间提供多个耦合。方面可以应用于具有可用作传送信息的介质的波长的任何类型的电磁辐射。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式