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1. 发明授权

US07653501B2 Apparatus for determining diameter of parabolic antenna and method therefor 失效
标题翻译：用于确定抛物面天线直径的装置及其方法
公开(公告)号：US07653501B2
公开(公告)日：2010-01-26
申请号：US12088461
申请日：2005-12-26
申请人： Jeom-hun Lee , Jae-Hoon Kim , Ho-Jin Lee
发明人： Jeom-hun Lee , Jae-Hoon Kim , Ho-Jin Lee
IPC分类号： G01R23/00
CPC分类号： G01B21/10 , H01Q19/132
摘要： Provided are an apparatus and method for determining a diameter of a reflector antenna. The apparatus includes a setting unit for setting up electrical characteristic values of the reflector antenna upon receipt thereof from outside, a parameter input unit for receiving a frequency, an antenna diameter variable value, antenna efficiency, Edge Taper (ET), and an Edge Of Coverage (EOC) angle as parameters for each of multiple frequencies to be accommodated in the reflector antenna, a graph generator for generating, on one rectangular coordinate, a graph representing the relationship between an antenna diameter and EOC directivity with respect to the EOC angle based on the parameters for each frequency received through the parameter input unit, an antenna diameter determination unit for determining an antenna diameter that simultaneously meets the preset EOC directivities for the frequencies to be accommodated in the reflector antenna by using the graph generated by the graph generation unit, and a graph output unit for mapping and outputting the graph generated by the graph generation unit on one rectangular coordinate with an antenna diameter axis and an EOC directivity axis to thereby represent the antenna diameter determined by the antenna diameter determination unit on the graph.
摘要翻译：提供了一种用于确定反射器天线的直径的装置和方法。该装置包括：设置单元，用于在从外部接收反射器天线时设置反射器天线的电特性值，用于接收频率的参数输入单元，天线直径可变值，天线效率，边缘锥度（ET）覆盖（EOC）角度作为要容纳在反射器天线中的多个频率中的每一个的参数，图形生成器，用于在一个矩形坐标上生成表示相对于基于EOC角度的天线直径和EOC方向性之间的关系的曲线图关于通过参数输入单元接收的每个频率的参数，天线直径确定单元，用于通过使用由图形生成单元生成的图形来确定同时满足反射天线中容纳的频率的预设EOC方向性的天线直径以及用于映射和输出由该图形生成的图形的图形输出单元生成单元，其具有天线直径轴和EOC方向轴的一个矩形坐标，从而表示由图中天线直径确定单元确定的天线直径。

2. 发明申请

US20080249739A1 Apparatus for Determining Diameter of Parabolic Antenna and Method Therefor 失效
标题翻译：用于确定抛物线天线直径的装置及其方法
公开(公告)号：US20080249739A1
公开(公告)日：2008-10-09
申请号：US12088461
申请日：2005-12-26
申请人： Jeom-Hun Lee , Jae-Hoon Kim , Ho-Jin Lee
发明人： Jeom-Hun Lee , Jae-Hoon Kim , Ho-Jin Lee
IPC分类号： G01B21/10
CPC分类号： G01B21/10 , H01Q19/132
摘要： Provided are an apparatus and method for determining a diameter of a reflector antenna. The apparatus includes a setting unit for setting up electrical characteristic values of the reflector antenna upon receipt thereof from outside, a parameter input unit for receiving a frequency, an antenna diameter variable value, antenna efficiency, Edge Taper (ET), and an Edge Of Coverage (EOC) angle as parameters for each of multiple frequencies to be accommodated in the reflector antenna, a graph generator for generating, on one rectangular coordinate, a graph representing the relationship between an antenna diameter and EOC directivity with respect to the EOC angle based on the parameters for each frequency received through the parameter input unit, an antenna diameter determination unit for determining an antenna diameter that simultaneously meets the preset EOC directivities for the frequencies to be accommodated in the reflector antenna by using the graph generated by the graph generation unit, and a graph output unit for mapping and outputting the graph generated by the graph generation unit on one rectangular coordinate with an antenna diameter axis and an EOC directivity axis to thereby represent the antenna diameter determined by the antenna diameter determination unit on the graph.
摘要翻译：提供了一种用于确定反射器天线的直径的装置和方法。该装置包括：设置单元，用于在从外部接收反射器天线时设置反射器天线的电特性值，用于接收频率的参数输入单元，天线直径可变值，天线效率，边缘锥度（ET）覆盖（EOC）角度作为要容纳在反射器天线中的多个频率中的每一个的参数，图形生成器，用于在一个矩形坐标上生成表示相对于基于EOC角度的天线直径和EOC方向性之间的关系的曲线图关于通过参数输入单元接收的每个频率的参数，天线直径确定单元，用于通过使用由图形生成单元生成的图形来确定同时满足反射天线中容纳的频率的预设EOC方向性的天线直径以及用于映射和输出由该图形生成的图形的图形输出单元生成单元，其具有天线直径轴和EOC方向轴的一个矩形坐标，从而表示由图中天线直径确定单元确定的天线直径。

3. 发明申请

US20060100846A1 Hybrid type satellite simulation system and method thereof 审中-公开
标题翻译：混合型卫星仿真系统及其方法
公开(公告)号：US20060100846A1
公开(公告)日：2006-05-11
申请号：US11182133
申请日：2005-07-14
申请人： Sang-Uk Lee , Jae-Hoon Kim , Ho-Jin Lee , Seong-Pal Lee
发明人： Sang-Uk Lee , Jae-Hoon Kim , Ho-Jin Lee , Seong-Pal Lee
IPC分类号： G06F9/45
CPC分类号： B64G7/00 , B64G1/24 , H04L67/38
摘要： A hybrid-type satellite simulation system and a method thereof are disclosed. The system includes: a satellite modeling unit including a satellite model and a software model having flight dynamics and space environment data; a satellite operation unit for generating a telecommand, transmitting the telecommand to the satellite simulation system, receiving simulation result as a telemetry, analyzing the simulation result and displaying the analyzed result; a simulator kernel for managing and controlling the satellite simulation system; a TCP/IP interface processing unit for performing an interface function of TCP/IP level between the simulator kernel and a satellite onboard computer; an onboard computer interface processing unit for performing an interface function between the satellite onboard computer and the TCP/IP interface processing unit; and a satellite onboard computer including flight software for controlling a satellite.
摘要翻译：公开了一种混合型卫星仿真系统及其方法。该系统包括：包括卫星模型和具有飞行动力学和空间环境数据的软件模型的卫星建模单元; 用于产生遥控的卫星操作单元，向卫星仿真系统发送遥控信号，接收模拟结果作为遥测，分析仿真结果并显示分析结果; 用于管理和控制卫星仿真系统的模拟器内核; TCP / IP接口处理单元，用于在模拟器内核和机载计算机之间执行TCP / IP级别的接口功能; 车载计算机接口处理单元，用于在卫星机载计算机和TCP / IP接口处理单元之间执行接口功能; 以及包含用于控制卫星的飞行软件的卫星机载计算机。

4. 发明授权

US09941196B2 Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device 有权
公开(公告)号：US09941196B2
公开(公告)日：2018-04-10
申请号：US15130904
申请日：2016-04-15
申请人： Ho-Jin Lee , Tae-Je Cho , Dong-Hyeon Jang , Ho-Geon Song , Se-Young Jeong , Un-Byoung Kang , Min-Seung Yoon
发明人： Ho-Jin Lee , Tae-Je Cho , Dong-Hyeon Jang , Ho-Geon Song , Se-Young Jeong , Un-Byoung Kang , Min-Seung Yoon
IPC分类号： H01L21/768 , H01L23/498 , H01L23/48 , H01L25/065 , H01L23/525
CPC分类号： H01L23/49844 , H01L21/76831 , H01L21/76844 , H01L21/76898 , H01L23/481 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/525 , H01L25/0657 , H01L2224/02372 , H01L2224/05009 , H01L2224/13025 , H01L2224/16 , H01L2224/16145 , H01L2224/16227 , H01L2224/17181 , H01L2225/06513 , H01L2225/06544 , H01L2924/15311
摘要： In one embodiment, a semiconductor device includes a semiconductor substrate having a first surface, and a second surface opposite to the first surface. The second surface defines a redistribution trench. The substrate has a via hole extending therethrough. The semiconductor device also includes a through via disposed in the via hole. The through via may include a via hole insulating layer, a barrier layer, sequentially formed on an inner wall of the via hole. The through via may further include a conductive connector adjacent the barrier layer. The semiconductor device additionally includes an insulation layer pattern formed on the second surface of the substrate. The insulation layer pattern defines an opening that exposes a region of a top surface of the through via. The semiconductor devices includes a redistribution layer disposed in the trench and electrically connected to the through via. The insulation layer pattern overlaps a region of the conductive connector.

5. 发明授权

US09852965B2 Semiconductor devices with through electrodes and methods of fabricating the same 有权
公开(公告)号：US09852965B2
公开(公告)日：2017-12-26
申请号：US15204632
申请日：2016-07-07
申请人： Ho-Jin Lee , Byung Lyul Park , Kwangjin Moon , Jisoon Park , Jin Ho An
发明人： Ho-Jin Lee , Byung Lyul Park , Kwangjin Moon , Jisoon Park , Jin Ho An
IPC分类号： H01L23/48 , H01L21/768
CPC分类号： H01L23/481 , H01L21/76898 , H01L2224/11 , H01L2224/16145 , H01L2924/181 , H01L2924/00012
摘要： Provided herein are semiconductor devices with through electrodes and methods of fabricating the same. The methods may include providing a semiconductor substrate having top and bottom surfaces facing each other, forming on the top surface of the semiconductor substrate a main via having a hollow cylindrical structure and a metal line connected to the main via, forming an interlayered insulating layer on the top surface of the semiconductor substrate to cover the main via and the metal line, removing a portion of the semiconductor substrate to form a via hole exposing a portion of a bottom surface of the main via, and forming in the via hole a through electrode that is electrically connected to the main via. The bottom surface of the main via is overlapped by a circumference of the via hole, when viewed in a plan view.

6. 发明授权

US08422600B2 Apparatus and method for estimating phase error based on variable step size 有权
标题翻译：基于可变步长估计相位误差的装置和方法
公开(公告)号：US08422600B2
公开(公告)日：2013-04-16
申请号：US12536856
申请日：2009-08-06
申请人： Pansoo Kim , Dae-Ig Chang , Ho-Jin Lee , Jin-Young Kim , Jae-Sung Park , Young-Sun Lim
发明人： Pansoo Kim , Dae-Ig Chang , Ho-Jin Lee , Jin-Young Kim , Jae-Sung Park , Young-Sun Lim
IPC分类号： H04L27/06 , H03M13/03
CPC分类号： H04L27/22 , H04L1/0047 , H04L1/005 , H04L1/0066 , H04L2027/0067
摘要： Disclosed is a phase error estimating an apparatus and a method which provides improved convergence speed and tracking speed even in mobile channel environment by variably applying the step size for phase error estimation according to channel status. The apparatus for estimating a phase error includes: a posterior probability (APP) average calculating unit for calculating an APP average value from a soft decision result of a currently received symbol; a step size determining unit for determining a step size variably according to channel status; and a phase error estimating unit for estimating a phase error of the currently received symbol from a phase error of a previously received symbol and the APP average value by using the variably determined step size.
摘要翻译：公开了一种相位误差估计装置和方法，即使在移动信道环境中也可以通过根据信道状态可变地应用步长来进行相位误差估计，从而提高收敛速度和跟踪速度。用于估计相位误差的装置包括：后验概率（APP）平均计算单元，用于根据当前接收的符号的软判决结果计算APP平均值; 步长确定单元，用于根据信道状态可变地确定步长; 以及相位误差估计单元，用于通过使用可变确定的步长来估计来自先前接收到的符号的相位误差的当前接收到的符号的相位误差和APP平均值。

7. 发明授权

US08422232B2 System for controlling temperature of antenna module 有权
标题翻译：天线模块温度控制系统
公开(公告)号：US08422232B2
公开(公告)日：2013-04-16
申请号：US13002888
申请日：2009-07-21
申请人： Changsoo Kwak , In-Bok Yom , So-Hyeun Yun , Donghwan Shin , Ho-Jin Lee
发明人： Changsoo Kwak , In-Bok Yom , So-Hyeun Yun , Donghwan Shin , Ho-Jin Lee
IPC分类号： H05K7/20
CPC分类号： H01Q1/02 , H01Q1/42
摘要： A system for controlling temperature of an antenna module including a heat generating module, and a radome and an underbody cover that enclose the heat generating module. The system includes: a heat collecting unit mounted on inner surface of the antenna module; a heat discharging unit mounted on outer surface of the antenna module; and a heat transfer unit for transferring heat from the heat collecting unit to the heat discharging unit.
摘要翻译：一种用于控制包括发热模块的天线模块的温度的系统，以及包围发热模块的天线罩和底盖。该系统包括：安装在天线模块的内表面上的集热单元; 安装在所述天线模块的外表面上的放热单元; 以及用于将热量从集热单元传递到散热单元的传热单元。

8. 发明授权

US08335255B2 Motion estimation method, medium, and system with fast motion estimation 有权
标题翻译：运动估计方法，中等和快速运动估计系统
公开(公告)号：US08335255B2
公开(公告)日：2012-12-18
申请号：US11783599
申请日：2007-04-10
申请人： Ho-Jin Lee , Sang-Jo Lee , Si-hwa Lee , Do-hyung Kim
发明人： Ho-Jin Lee , Sang-Jo Lee , Si-hwa Lee , Do-hyung Kim
IPC分类号： H04N7/12
CPC分类号： H04N19/56 , H04N19/51
摘要： A motion estimation method, medium, and system with fast motion estimation. The motion estimation method includes comparing a cost indicating a difference between a current block of a current image and a block of a reference image specified by a starting point with a predetermined threshold and selectively searching for the best matching block of the current block from the starting point according to the comparison result.
摘要翻译：具有快速运动估计的运动估计方法，介质和系统。运动估计方法包括将当前图像的当前块与由起始点指定的参考图像的块之间的差指定为预定阈值的成本进行比较，并且从开始选择性地搜索当前块的最佳匹配块根据比较结果。

9. 发明申请

US20120091580A1 Semiconductor Devices And Methods Of Fabricating The Same 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20120091580A1
公开(公告)日：2012-04-19
申请号：US13211574
申请日：2011-08-17
申请人： SeYoung Jeong , Hogeon Song , Chungsun Lee , Ho-Jin Lee
发明人： SeYoung Jeong , Hogeon Song , Chungsun Lee , Ho-Jin Lee
IPC分类号： H01L23/48
CPC分类号： H01L23/481 , H01L21/563 , H01L21/76898 , H01L23/3128 , H01L24/04 , H01L24/05 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/48 , H01L24/97 , H01L25/0657 , H01L25/18 , H01L25/50 , H01L2221/68372 , H01L2224/0401 , H01L2224/04042 , H01L2224/0557 , H01L2224/05624 , H01L2224/05647 , H01L2224/13009 , H01L2224/13025 , H01L2224/1403 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/48227 , H01L2224/73257 , H01L2224/97 , H01L2225/0651 , H01L2225/06517 , H01L2225/06544 , H01L2225/06562 , H01L2225/06568 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/1304 , H01L2924/14 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19104 , H01L2924/00 , H01L2224/05552 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Provided is a semiconductor device. The semiconductor device may include a first semiconductor chip that includes a first through silicon via having a first protrusion height and a second through silicon via having a second protrusion height greater than the first protrusion height which are penetrating at least a portion of the first semiconductor chip, a second semiconductor chip may be electrically connected to the first through silicon via, and a third semiconductor chip may be electrically connected to the second through silicon via.
摘要翻译：提供一种半导体器件。半导体器件可以包括第一半导体芯片，其包括具有第一突起高度的第一至第二硅通孔以及具有大于第一突出高度的第二突出高度的第二穿透硅通孔，该第二突出高度穿过第一半导体芯片的至少一部分，第二半导体芯片可以电连接到第一通孔硅通孔，并且第三半导体芯片可以电连接到第二通孔硅通孔。

10. 发明授权

US08120177B2 Wafer level package having a stress relief spacer and manufacturing method thereof 有权
公开(公告)号：US08120177B2
公开(公告)日：2012-02-21
申请号：US12910260
申请日：2010-10-22
申请人： Hyun-Soo Chung , Ho-Jin Lee , Dong-Hyun Jang , Dong-Ho Lee
发明人： Hyun-Soo Chung , Ho-Jin Lee , Dong-Hyun Jang , Dong-Ho Lee
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L25/0657 , H01L21/76898 , H01L23/481 , H01L25/50 , H01L2224/02371 , H01L2224/02372 , H01L2224/0401 , H01L2224/13025 , H01L2224/274 , H01L2225/06513 , H01L2225/06541 , H01L2924/01079 , H01L2924/01087
摘要： In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability.

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