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    • 1. 发明申请
    • Wafer Inspection
    • 晶圆检验
    • US20140009759A1
    • 2014-01-09
    • US13822281
    • 2011-12-07
    • Guoheng ZhaoJenn-Kuen LeongMehdi Vaez-Iravani
    • Guoheng ZhaoJenn-Kuen LeongMehdi Vaez-Iravani
    • G01N21/88
    • G01N21/9501G01N21/21G01N21/47G01N21/8806G01N2201/06113H01L22/12H01L2924/0002H01L2924/00
    • Systems and methods for inspecting a wafer are provided. One system includes an illumination subsystem configured to illuminate the wafer; a collection subsystem configured to collect light scattered from the wafer and to preserve the polarization of the scattered light; an optical element configured to separate the scattered light collected in different segments of the collection numerical aperture of the collection subsystem, where the optical element is positioned at a Fourier plane or a conjugate of the Fourier plane of the collection subsystem; a polarizing element configured to separate the scattered light in one of the different segments into different portions of the scattered light based on polarization; and a detector configured to detect one of the different. portions of the scattered light and to generate output responsive to the detected light, which is used to detect defects on the wafer.
    • 提供了用于检查晶片的系统和方法。 一个系统包括配置成照亮晶片的照明子系统; 收集子系统,被配置为收集从晶片散射的光并保持散射光的偏振; 光学元件,被配置为将收集在收集子系统的收集数值孔径的不同段中的散射光分离,其中所述光学元件位于所述收集子系统的傅立叶平面或所述傅立叶平面的共轭处; 偏振元件,被配置为基于极化将所述不同段中的一个中的散射光分离成所述散射光的不同部分; 以及检测器,被配置为检测不同的一个。 散射光的一部分并且响应于检测到的光而产生输出,用于检测晶片上的缺陷。
    • 2. 发明授权
    • Surface inspection system using laser line illumination with two dimensional imaging
    • 表面检测系统采用激光线照明二维成像
    • US07525649B1
    • 2009-04-28
    • US11875240
    • 2007-10-19
    • Jenn-Kuen LeongGuoheng ZhaoMehdi Vaez-Iravani
    • Jenn-Kuen LeongGuoheng ZhaoMehdi Vaez-Iravani
    • G01N21/00
    • G01N21/8806G01N21/9501G01N2021/8822G01N2021/9513G01N2021/95676
    • A surface inspection apparatus and a method are provided which include an illumination system configured to focus a beam of radiation at a non-orthogonal incidence angle to form an illumination line on a surface substantially in a plane of incidence of the focused beam. The apparatus and method further include a collection system configured to image the illumination line onto an array of detectors oriented parallel to the illumination line. The collection system includes an imaging lens for collecting light scattered from the illumination line, a focusing lens for focusing the collected light, and the array of detectors, each configured to detect a corresponding portion of the illumination line. The collection system may be configured to image the illumination line such that the width of the imaged illumination line on the array of detectors is larger than the pixel size of the detectors along the same direction.
    • 提供了一种表面检查装置和方法,其包括被配置为以非正交入射角聚焦辐射束的照明系统,以在基本上在聚焦光束的入射平面的表面上形成照明线。 该装置和方法还包括收集系统,其被配置为将照明线图像成平行于照明线定向的检测器阵列。 收集系统包括用于收集从照明线散射的光的成像透镜,用于聚焦所收集的光的聚焦透镜以及每个被配置为检测照明线的相应部分的检测器阵列。 收集系统可以被配置成对照明线进行成像,使得检测器阵列上成像的照明线的宽度大于沿相同方向的检测器的像素尺寸。
    • 4. 发明授权
    • Wafer inspection
    • 晶圆检查
    • US08891079B2
    • 2014-11-18
    • US13822281
    • 2011-12-07
    • Guoheng ZhaoJenn-Kuen LeongMehdi Vaez-Iravani
    • Guoheng ZhaoJenn-Kuen LeongMehdi Vaez-Iravani
    • G01N21/00G01J4/00G01N21/88G01N21/95H01L21/66
    • G01N21/9501G01N21/21G01N21/47G01N21/8806G01N2201/06113H01L22/12H01L2924/0002H01L2924/00
    • Systems and methods for inspecting a wafer are provided. One system includes an illumination subsystem configured to illuminate the wafer; a collection subsystem configured to collect light scattered from the wafer and to preserve the polarization of the scattered light; an optical element configured to separate the scattered light collected in different segments of the collection numerical aperture of the collection subsystem, where the optical element is positioned at a Fourier plane or a conjugate of the Fourier plane of the collection subsystem; a polarizing element configured to separate the scattered light in one of the different segments into different portions of the scattered light based on polarization; and a detector configured to detect one of the different portions of the scattered light and to generate output responsive to the detected light, which is used to detect defects on the wafer.
    • 提供了用于检查晶片的系统和方法。 一个系统包括配置成照亮晶片的照明子系统; 收集子系统,被配置为收集从晶片散射的光并保持散射光的偏振; 光学元件,被配置为将收集在收集子系统的收集数值孔径的不同段中的散射光分离,其中所述光学元件位于所述收集子系统的傅立叶平面或所述傅立叶平面的共轭处; 偏振元件,被配置为基于极化将所述不同段中的一个中的散射光分离成所述散射光的不同部分; 以及检测器,被配置为检测散射光的不同部分中的一个,并且响应于检测到的光而产生输出,所述检测光用于检测晶片上的缺陷。