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1. 发明授权

US06919168B2 Masking methods and etching sequences for patterning electrodes of high density RAM capacitors 失效
标题翻译：用于高密度RAM电容器的图形化电极的掩模方法和蚀刻顺序
公开(公告)号：US06919168B2
公开(公告)日：2005-07-19
申请号：US10057674
申请日：2002-01-24
申请人： Jeng H. Hwang , Steve S. Y. Mak , True-Lon Lin , Chentsau Ying , John W. Schaller
发明人： Jeng H. Hwang , Steve S. Y. Mak , True-Lon Lin , Chentsau Ying , John W. Schaller
IPC分类号： C23F4/00 , H01L21/02 , H01L21/3213 , G03F7/00 , G03F7/36
CPC分类号： H01L28/60 , C23F4/00 , H01L21/32136 , H01L21/32139
摘要： A method of etching a noble metal electrode layer disposed on a substrate to produce a semiconductor device including a plurality of electrodes separated by a distance equal to or less than about 0.35 μm and having a noble metal profile equal to or greater than about 80°. The method comprises heating the substrate to a temperature greater than about 150° C., and etching the noble metal electrode layer by employing a high density inductively coupled plasma of an etchant gas comprising a gas selected from the group consisting of nitrogen, oxygen, a halogen (e.g., chlorine), argon, and a gas selected from the group consisting of BCl3, HBr, and SiCl4 mixtures thereof. Masking methods and etching sequences for patterning high density RAM capacitors are also provided.
摘要翻译：一种蚀刻设置在基板上的贵金属电极层的方法，以制造半导体器件，该半导体器件包括间隔等于或小于约0.35μm并且具有等于或大于约80°的贵金属形状的多个电极。该方法包括将衬底加热到大于约150℃的温度，并且通过采用蚀刻剂气体的高密度电感耦合等离子体蚀刻贵金属电极层，所述等离子体包括选自氮，氧，卤素（例如氯），氩气和选自BCl 3，HBr和SiCl 4+混合物的气体。还提供了用于图案化高密度RAM电容器的掩模方法和蚀刻顺序。

2. 发明授权

US5877529A Mosfet termination design and core cell configuration to increase breakdown voltage and to improve device ruggedness 失效
标题翻译： Mosfet终端设计和核心单元配置，以增加击穿电压并提高器件的耐用性
公开(公告)号：US5877529A
公开(公告)日：1999-03-02
申请号：US978667
申请日：1997-11-26
申请人： Koon Chong So , Danny Chi Nim , Fwu-Iuan Hshieh , Yan Man Tsui , True-Lon Lin , Shu-Hui Cheng
发明人： Koon Chong So , Danny Chi Nim , Fwu-Iuan Hshieh , Yan Man Tsui , True-Lon Lin , Shu-Hui Cheng
IPC分类号： H01L29/06 , H01L29/10 , H01L29/78 , H01L29/76 , H01L23/58 , H01L29/94
CPC分类号： H01L29/1095 , H01L29/0619 , H01L29/7811 , H01L29/0696 , H01L2924/0002
摘要： Improved power MOSFET structure, and fabrication process are disclosed in this invention to achieve higher breakdown voltage and improved device ruggedness. The power transistor includes a core cell area which includes a plurality of power transistor cells and a termination area. The power transistor further includes an outer pickup guarding ring, disposed in the termination area guarding the core cell area, for picking up free charged-particles generated in the termination area for preventing the free charged particles from entering the core cell area. In another preferred embodiment, the power transistor further includes an inner pickup guarding fence and blocks, disposed between the termination area and the core cell area for picking up free charged-particles not yet picked up by the outer pickup guarding ring for preventing the free charged particles from entering the core cell area.
摘要翻译：在本发明中公开了改进的功率MOSFET结构和制造工艺，以实现更高的击穿电压和改进的器件耐用性。功率晶体管包括包含多个功率晶体管单元和端接区域的核心单元区域。功率晶体管还包括外部拾波器保护环，设置在保护核心单元区域的端接区域中，用于拾取终止区域中产生的免费带电粒子，以防止自由带电粒子进入核心单元区域。在另一个优选实施例中，功率晶体管还包括内部拾取器防护栅栏和块，其设置在终端区域和核心单元区域之间，用于拾取由外部拾音器保护环尚未拾取的免费带电粒子，以防止自由充电颗粒进入核心区域。

3. 发明授权

US06211529B1 Infrared radiation-detecting device 失效
标题翻译：红外辐射检测装置
公开(公告)号：US06211529B1
公开(公告)日：2001-04-03
申请号：US08785350
申请日：1997-01-17
申请人： Sarath Gunapala , John K. Liu , Jin S. Park , True-Lon Lin , Mani Sundaram
发明人： Sarath Gunapala , John K. Liu , Jin S. Park , True-Lon Lin , Mani Sundaram
IPC分类号： H01L2906
CPC分类号： B82Y20/00 , G01J5/28 , H01L31/035236 , Y10S977/759 , Y10S977/761 , Y10S977/915 , Y10S977/927
摘要： An AlxGa1−xAs/GaAs/AlxGa1−xAs quantum well exhibiting a bound-to-quasibound intersubband absorptive transition is described. The bound-to-quasibound transition exists when the first excited state has the same energy as the “top” (i.e., the upper-most energy barrier) of the quantum well. The energy barrier for thermionic emission is thus equal to the energy required for intersubband absorption. Increasing the energy barrier in this way reduces dark current. The amount of photocurrent generated by the quantum well is maintained at a high level.
摘要翻译：描述了表现出界限对准的子带间吸收转变的Al x Ga 1-x As / GaAs / Al x Ga 1-x As量子阱。当第一激发态具有与量子阱的“顶部”（即，最上面的能量势垒）相同的能量时，存在边界到准近渡的转变。因此，热离子发射的能量势垒等于子带间吸收所需的能量。以这种方式增加能量屏障可以减少暗电流。由量子阱产生的光电流的量保持在高水平。

4. 发明授权

US5731611A MOSFET transistor cell manufactured with selectively implanted punch through prevent and threshold reductoin zones 失效
标题翻译： MOSFET晶体管单元由选择性地植入穿孔防止和阈值还原区制造
公开(公告)号：US5731611A
公开(公告)日：1998-03-24
申请号：US593967
申请日：1996-01-30
申请人： Fwu-Iuan Hshieh , True-Lon Lin
发明人： Fwu-Iuan Hshieh , True-Lon Lin
IPC分类号： H01L21/336 , H01L29/08 , H01L29/78 , H01L27/76 , H01L29/94 , H01L31/062
CPC分类号： H01L29/66712 , H01L29/0878 , H01L29/7802
摘要： A n-channel MOSFET device is formed with a selective high energy boron implantation into the N region of the n- channel where a photoresist is employed to cover the central portion over the channel. Small n- regions are formed near the channel source interface. These small n- regions have the advantages of preventing punch through. The selective implant regions have the additional advantages that the JFET resistance is not increased as a result of forming a punch through prevention region near the source channel boundary. Also disclosed in this invention is a p-type DMOS where a novel boron implantation is applied to reduce the threshold voltage. The boron is selectively implanted into the n-type channel near the source, i.e., a threshold sensitive region. The threshold voltage is reduced without unduly lowering the drain to source breakdown voltage.
摘要翻译：形成n沟道MOSFET器件，其具有选择性高能量硼注入到n沟道的N区中，其中使用光致抗蚀剂覆盖沟道上的中心部分。在通道源接口附近形成小的n-区。这些小的n-区域具有防止穿孔的优点。选择性注入区域具有额外的优点，即由于在源极通道边界附近形成穿通防止区域而不增加JFET电阻。本发明还公开了一种p型DMOS，其中应用新的硼注入来降低阈值电压。选择性地将硼注入到源极附近的n型沟道中，即阈值敏感区域。阈值电压降低，而不会不利地降低漏极到源极击穿电压。

5. 发明授权

US5923065A Power MOSFET device manufactured with simplified fabrication processes to achieve improved ruggedness and product cost savings 失效
标题翻译：功率MOSFET器件采用简化的制造工艺制造，以实现更好的耐用性和产品成本节省
公开(公告)号：US5923065A
公开(公告)日：1999-07-13
申请号：US661952
申请日：1996-06-12
申请人： Koon Chong So , Danny Chi Nim , True-Lon Lin , Fwu-Iuan Hshieh , Yan Man Tsui
发明人： Koon Chong So , Danny Chi Nim , True-Lon Lin , Fwu-Iuan Hshieh , Yan Man Tsui
IPC分类号： H01L21/336 , H01L29/10 , H01L29/76
CPC分类号： H01L29/66712 , H01L29/1095 , H01L29/7811 , H01L29/0619 , H01L29/0638 , H01L29/402
摘要： This invention discloses a MOSFET device in a semiconductor chip with a top surface and a bottom surface. The MOSFET device includes a drain region, doped with impurities of a first conductivity type, formed in the semiconductor chip near the bottom surface. The MOSFET device further includes a vertical pn-junction region, which includes a lower-outer body region, doped with impurities of a second conductivity type, formed on top of the drain region. The pn-junction region further includes a source region, doped with impurities of the first conductivity type, formed on top of the lower-outer body region wherein the lower-outer body region defining a channel region extending from the source region to the drain region near the top surface. The MOSFET device further includes a gate formed on top of the channel region on the top surface. The gate includes a thin insulative bottom layer for insulating from the channel region. The gate is provided for applying a voltage thereon for controlling a current flowing from the source region to the drain region via the channel region. The MOSFET device further includes a deep heavily doped body-dopant region disposed immediately below the source region in the lower-outer body region. It is implanted with a higher concentration of dopant than the lower-outer body region whereby a device ruggedness of the MOSFET device is improved. The deep heavily-doped body-dopant region having a body-dopant concentration profile defined by a diffusion of the body-dopant from an implant depth about twice as that of a source implant-depth whereby the deep heavily-doped body dopant region is kept at a distance away from the channel region.
摘要翻译：本发明公开了一种具有顶表面和底表面的半导体芯片中的MOSFET器件。 MOSFET器件包括在底表面附近形成在半导体芯片中的掺杂有第一导电类型的杂质的漏极区域。 MOSFET器件还包括垂直pn结区域，其包括形成在漏极区域的顶部上的掺杂有第二导电类型的杂质的下外部体区域。 pn结区域还包括掺杂有第一导电类型的杂质的源区，形成在下外体区域的顶部，其中下外体体区限定从源区延伸到漏区的沟道区靠近顶面。 MOSFET器件还包括形成在顶表面上的沟道区域的顶部上的栅极。栅极包括用于与沟道区绝缘的薄绝缘底层。栅极用于在其上施加电压以控制经由沟道区域从源极区域流到漏极区域的电流。 MOSFET器件还包括深下部重掺杂体 - 掺杂区域，其设置在下外体区域中的源极区域的正下方。注入比下外体区域更高浓度的掺杂剂，从而提高MOSFET器件的器件耐用性。深掺杂的体 - 掺杂剂区域具有由植入深度约为原始植入深度的两倍的体掺杂物的扩散所限定的体 - 掺杂物浓度分布，从而保留深重掺杂体掺杂区域距离通道区域一定距离。

6. 发明授权

US5844277A Power MOSFETs and cell topology 失效
标题翻译：功率MOSFET和电池拓扑
公开(公告)号：US5844277A
公开(公告)日：1998-12-01
申请号：US603724
申请日：1996-02-20
申请人： Fwu-Iuan Hshieh , True-Lon Lin
发明人： Fwu-Iuan Hshieh , True-Lon Lin
IPC分类号： H01L21/336 , H01L29/06 , H01L29/10 , H01L29/78 , H01L29/76 , H01L29/94 , H01L31/062
CPC分类号： H01L29/7802 , H01L29/0696 , H01L29/0878 , H01L29/4238 , H01L29/66712 , H01L29/7811 , H01L29/0619 , H01L29/0638 , H01L29/402
摘要： A MOSFET device formed in a semiconductor chip with a top surface and a bottom surface. The MOSFET device includes a drain region doped with impurities of a first conductivity type, formed near the bottom surface. The MOSFET device further includes a plurality of vertical cells wherein each of the vertical cell includes a vertical pn-junction zone region includes a lower-outer body region, doped with impurities of a second conductivity type, formed on top of the drain region. The pn-junction region further includes a source region, doped with impurities of the first conductivity type, formed on top of the lower-outer body region, the lower-outer body region surrounding the source region and extending to the top surface thus defining a cell area for the cell. The vertical cell further includes a source contact formed on the top surface contacting the source region. The MOSFET further includes a plurality of gates. Each gate is formed on the top surface as a poly layer extending from an area near a boundary of the source region and the lower-outer body region of one of the cells to a neighboring cell, the gate includes a thin insulative bottom layer for insulating from the vertical cell, the gate is provided for applying a voltage thereon for controlling a charge state of a channel underneath each of the gates thus controlling a vertical current from the source contact to the drain region. The MOSFET device further includes a plurality of open stripes whereby a width of the channel is increased and a JFET resistance for each of the vertical cells is decreased.
摘要翻译：形成在具有顶表面和底表面的半导体芯片中的MOSFET器件。 MOSFET器件包括在底表面附近形成的掺杂有第一导电类型杂质的漏区。 MOSFET器件还包括多个垂直单元，其中每个垂直单元包括垂直pn结区域区域，该垂直单元区域区域包括形成在漏极区域顶部上的掺杂有第二导电类型的杂质的下部外部体区域。 pn结区域还包括掺杂有第一导电类型的杂质的源区，形成在下外体区域的顶部，下外体体区域围绕源区域并延伸到顶表面，从而限定了细胞区域。垂直单元还包括形成在与源极区域接触的顶表面上的源极接触。 MOSFET还包括多个栅极。每个栅极在顶表面上形成为从一个单元的源极区域和下部 - 外部主体区域的边界附近的区域延伸到相邻单元的多晶硅层，该栅极包括用于绝缘的薄绝缘底层提供了用于在其上施加电压以控制每个栅极下面的沟道的充电状态的栅极，从而控制从源极接触到漏极区域的垂直电流。 MOSFET器件还包括多个开放条纹，从而信道的宽度增加，并且每个垂直单元的JFET电阻降低。

7. 发明授权

US5668026A DMOS fabrication process implemented with reduced number of masks 失效
标题翻译： DMOS制造工艺以减少数量的掩模实现
公开(公告)号：US5668026A
公开(公告)日：1997-09-16
申请号：US611745
申请日：1996-03-06
申请人： True-Lon Lin , Fwu-Iuan Hshieh , Danny Chi Nim , Koon Chong So , Yan Man Tsui
发明人： True-Lon Lin , Fwu-Iuan Hshieh , Danny Chi Nim , Koon Chong So , Yan Man Tsui
IPC分类号： H01L21/265 , H01L21/336 , H01L29/08 , H01L29/10 , H01L29/78
CPC分类号： H01L29/7802 , H01L21/26586 , H01L29/1095 , H01L29/66712 , H01L29/7813 , H01L29/0847 , H01L29/41766
摘要： A new DMOS fabrication process is disclosed. The fabrication process includes the steps of (a) growing an oxide layer on the substrate; (b) applying a first mask to define an active area and for selectively patterning the oxide layer for keeping a plurality of source implant blocking stumps near a plurality source regions wherein the blocking stumps being formed with width greater than twice a diffusion length of a source dopant and with width less than twice a diffusion length of the body dopant whereby the body regions merging together in the body diffusion becoming a single body region underneath the blocking stumps; (c) applying a second mask for forming a plurality of gates covering a portion of areas between the blocking stumps defining an implant window; (d) implanting a body dopant through the implant window followed by a body diffusion for forming a body region underneath the blocking stumps; (e) implanting the source dopant through the implant window over the source implant blocking stumps following by a source diffusion for forming separate source regions underneath the blocking stumps; (f) depositing an insulating dielectric BPSG/PSG layer; (g) employing a contact mask for etching through the insulating dielectric BPSG/PSG layer and the source implant blocking stumps to define contact windows; (h) depositing a metal layer to form a contact layer through the contact window; and (i) patterning the metal layer with a metal contact to define a plurality of contacts whereby the transistor is fabricated with a four masks process.
摘要翻译：公开了一种新的DMOS制造工艺。制造工艺包括以下步骤：（a）在衬底上生长氧化物层; （b）施加第一掩模以限定有源区域并且用于选择性地图案化氧化物层，以便在多个源区域附近保持多个源注入阻挡块，其中形成的阻挡树脂的宽度大于源的扩散长度的两倍掺杂剂并且具有小于体掺杂物的扩散长度的两倍的宽度，从而身体区域在体扩散中合并在一起成为阻塞树桩下方的单个体区域; （c）施加第二掩模以形成覆盖限定植入窗口的阻挡树脂之间的区域的一部分的多个栅极; （d）通过植入窗口植入体内掺杂剂，随后进行体扩散，以形成阻挡树脂下面的体区; （e）在源极注入之后，通过源极扩散将源极掺杂剂注入到植入物窗口上，随后通过源极扩散在阻挡树脂下方形成分离的源区; （f）沉积绝缘介电BPSG / PSG层; （g）使用接触掩模通过绝缘电介质BPSG / PSG层和源极注入阻挡块蚀刻以限定接触窗口; （h）沉积金属层以通过所述接触窗形成接触层; 和（i）用金属接触图案化金属层以限定多个触点，由此通过四个掩模工艺制造晶体管。

8. 发明授权

US5895951A MOSFET structure and fabrication process implemented by forming deep and narrow doping regions through doping trenches 失效
标题翻译：通过掺杂沟槽形成深而窄的掺杂区域来实现MOSFET结构和制造工艺
公开(公告)号：US5895951A
公开(公告)日：1999-04-20
申请号：US628493
申请日：1996-04-05
申请人： Koon Chong So , Yan Man Tsui , Fwu-Iuan Hshieh , True-Lon Lin , Danny Chi Nim
发明人： Koon Chong So , Yan Man Tsui , Fwu-Iuan Hshieh , True-Lon Lin , Danny Chi Nim
IPC分类号： H01L21/336 , H01L29/06 , H01L29/08 , H01L29/10 , H01L29/40 , H01L29/78 , H01L29/76 , H01L29/94 , H01L31/062 , H01L31/113
CPC分类号： H01L29/7813 , H01L29/1095 , H01L29/407 , H01L29/0696 , H01L29/0847
摘要： This invention discloses a MOSFET device which includes a plurality of vertical cells each includes a source, a drain, and a channel for conducting source-to-drain current therethrough. Each of the vertical cells is surrounded by a polysilicon layer acting as a gate for controlling the source-to-drain current through the channel. The MOSFET device further include a plurality of doping trenches filled with trench-filling materials, The MOSFET device further includes a plurality of deep-doped regions disposed underneath the doping trenches wherein the deep-doped region extends downwardly to a depth which is substantially a sum of an implant depth of the deep-doped region and a vertical diffusion depth below a bottom of the doping trenches.
摘要翻译：本发明公开了一种MOSFET器件，其包括多个垂直单元，每个垂直单元包括源极，漏极和用于通过其传导源极 - 漏极电流的沟道。每个垂直单元被用作控制通过通道的源极 - 漏极电流的栅极的多晶硅层包围。 MOSFET器件还包括填充有沟槽填充材料的多个掺杂沟槽。MOSFET器件还包括设置在掺杂沟槽下方的多个深掺杂区域，其中深掺杂区域向下延伸到基本上为总和的深度的深掺杂区域的注入深度和在掺杂沟槽的底部下方的垂直扩散深度。

9. 发明授权

US5883416A Gate-contact structure to prevent contact metal penetration through gate layer without affecting breakdown voltage 失效
标题翻译：栅极接触结构，防止接触金属穿过栅极层而不影响击穿电压
公开(公告)号：US5883416A
公开(公告)日：1999-03-16
申请号：US792226
申请日：1997-01-31
申请人： True-Lon Lin , Koon Chong So , Fwu-Iuan Hshieh , Yan Man Tsui
发明人： True-Lon Lin , Koon Chong So , Fwu-Iuan Hshieh , Yan Man Tsui
IPC分类号： H01L29/06 , H01L29/423 , H01L29/78 , H01L23/485 , H01L23/48
CPC分类号： H01L29/42368 , H01L29/7811 , H01L29/0696 , H01L29/42372 , H01L29/4238 , H01L2924/0002
摘要： The present invention discloses a power transistor disposed on a substrate. The power device includes a core cell area comprising a plurality of power transistor cells each having drain and a source. Each of the power transistor cells further having a polycrystalline silicon gate formed on the substrate as part of a polycrystalline silicon gate layer overlaying the substrate. The polycrystalline silicon gate layer includes a plurality of polycrystalline gate-layer-extension extending to gate contact areas for forming gate contacts with a contact metal disposed thereon. The power transistor further includes a plurality of contact-metal-resistant pad each includes a thick oxide pad disposed below the gate contact areas underneath the polycrystalline gate layer extension whereby the contact-metal resistant pads resists the contact metal from penetrating therethrough and short to the substrate disposed thereunder.
摘要翻译：本发明公开了一种设置在基板上的功率晶体管。功率器件包括核心单元区域，其包括多个功率晶体管单元，每个功率晶体管单元具有漏极和源极。每个功率晶体管单元还具有形成在衬底上的多晶硅栅极，作为覆盖衬底的多晶硅栅极层的一部分。多晶硅栅极层包括延伸到栅极接触区域的多个多晶栅极层延伸部分，用于与设置在其上的接触金属形成栅极接触。功率晶体管还包括多个耐接触金属焊盘，每个包括设置在多晶栅极层延伸下方的栅极接触区下方的厚氧化物焊盘，由此接触金属电阻焊盘抵抗接触金属穿透其中并且短于底物置于其下。

10. 发明授权

US5763915A DMOS transistors having trenched gate oxide 失效
标题翻译：具有沟槽栅极氧化物的DMOS晶体管
公开(公告)号：US5763915A
公开(公告)日：1998-06-09
申请号：US607715
申请日：1996-02-27
申请人： Fwu-Juan Hshieh , True-Lon Lin , Danny Chi Nim , Koon Chong So , Yan Man Tsui
发明人： Fwu-Juan Hshieh , True-Lon Lin , Danny Chi Nim , Koon Chong So , Yan Man Tsui
IPC分类号： H01L21/336 , H01L29/06 , H01L29/40 , H01L29/423 , H01L29/78 , H01L29/76 , H01L29/94
CPC分类号： H01L29/7813 , H01L29/4236 , H01L29/42372 , H01L29/66734 , H01L29/7811 , H01L29/0619 , H01L29/0638 , H01L29/402 , H01L29/4238
摘要： Improved power MOSFET structure, and fabrication process are disclosed in this invention to achieve cost savings by simplified device structure and fabrication processes, and also by reducing the required die size. Specifically, in a novel MOSFET device, insulation of mobile ions are achieved by extending the poly gate and metal contacts such that the passivation layer is no longer required and the fabrication process is simplified such that the MOSFET device can be manufactured at a lower price. Furthermore, in another MOSFET device, the gate runner is used to replace the field plate such that the requirement of a field plate as that in a conventional MOSFET device is also eliminated and, by reducing the die size, the cost of manufacture is further reduced.
摘要翻译：在本发明中公开了改进的功率MOSFET结构和制造工艺，以通过简化的器件结构和制造工艺以及通过减少所需的管芯尺寸来实现成本节约。具体地说，在新颖的MOSFET器件中，通过延长多晶硅栅极和金属触点来实现移动离子的绝缘，从而不再需要钝化层，并且简化了制造工艺，使得可以以更低的价格制造MOSFET器件。此外，在另一个MOSFET器件中，栅极流道用于替代现场板，使得现场板的需求与常规MOSFET器件中的要求也被消除，并且通过减小管芯尺寸，制造成本进一步降低。

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