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1. 发明申请

US20100053849A1 ANODES WITH CORNER AND EDGE MODIFIED DESIGNS 审中-公开
标题翻译：带拐角和边缘改性设计的阳极
公开(公告)号：US20100053849A1
公开(公告)日：2010-03-04
申请号：US12614784
申请日：2009-11-09
申请人： Jeffrey Poltorak , Yongjian Qiu , Christian Guerrero , Lance Paul Thornton , Randy S. Hahn , James C. Bates, JR. , John Prymak
发明人： Jeffrey Poltorak , Yongjian Qiu , Christian Guerrero , Lance Paul Thornton , Randy S. Hahn , James C. Bates, JR. , John Prymak
IPC分类号： H01G9/04
CPC分类号： H01G9/052 , H01G2/065 , H01G9/15 , H01G11/48 , Y02E60/13 , Y10T428/24777 , Y10T428/24917 , Y10T428/249953 , Y10T428/24999 , Y10T428/249991
摘要： Porous sintered anode bodies for capacitors formed from valve metals are treated by electrolysis to form a dielectric layer and coated with cathode layers. When standard parallelepiped shapes are used, cathode coverage at the edges and corners is non-uniform and failures occur at those locations. Rectangular prisms, obround prisms and cylindrical prisms are formed with transition surfaces at edges and corners, such as chamfers and curves, to enhance cathode layer uniformity. The transition surface greatly enhances the application of polymer slurries.
摘要翻译：由阀金属形成的用于电容器的多孔烧结阳极体通过电解处理以形成电介质层并涂覆有阴极层。当使用标准平行六面体形状时，边缘和拐角处的阴极覆盖不均匀，并且在那些位置发生故障。矩形棱镜，棱镜棱镜和圆柱形棱镜在边缘和角落（如倒角和曲线）上形成过渡表面，以增强阴极层的均匀性。过渡面大大增强了聚合物浆料的应用。

2. 发明授权

US07658986B2 Anodes with corner and edge modified designs 有权
标题翻译：阳极与拐角和边缘修改设计
公开(公告)号：US07658986B2
公开(公告)日：2010-02-09
申请号：US11807765
申请日：2007-05-30
申请人： Jeffrey Poltorak , Yongjian Qiu , Christian Guerrero , Lance Paul Thornton , Randy S. Hahn , James C. Bates, Jr. , John Prymak
发明人： Jeffrey Poltorak , Yongjian Qiu , Christian Guerrero , Lance Paul Thornton , Randy S. Hahn , James C. Bates, Jr. , John Prymak
IPC分类号： B32B3/26 , H01G9/04
CPC分类号： H01G9/052 , H01G2/065 , H01G9/15 , H01G11/48 , Y02E60/13 , Y10T428/24777 , Y10T428/24917 , Y10T428/249953 , Y10T428/24999 , Y10T428/249991
摘要： Porous sintered anode bodies for capacitors formed from valve metals are treated by electrolysis to form a dielectric layer and coated with cathode layers. When standard parallelpiped shapes are used, cathode coverage at the edges and corners is non-uniform and failures occur at those locations. Rectangular prisms, obround prisms and cylindrical prisms are formed with transition surfaces at edges and corners, such as chamfers and curves, to enhance cathode layer uniformity. The transition surface greatly enhances the application of polymer slurries.
摘要翻译：由阀金属形成的用于电容器的多孔烧结阳极体通过电解处理以形成电介质层并涂覆有阴极层。当使用标准并联形状时，边缘和角落处的阴极覆盖不均匀，并且在这些位置发生故障。矩形棱镜，棱镜棱镜和圆柱形棱镜在边缘和角落（如倒角和曲线）上形成过渡表面，以增强阴极层的均匀性。过渡面大大增强了聚合物浆料的应用。

3. 发明申请

US20080299371A1 Anodes with corner and edge modified designs 有权
标题翻译：阳极与拐角和边缘修改设计
公开(公告)号：US20080299371A1
公开(公告)日：2008-12-04
申请号：US11807765
申请日：2007-05-30
申请人： Jeffrey Poltorak , Yongjian Qiu , Christian Guerrero , Lance Paul Thornton , Randy S. Hahn , James C. Bates, JR. , John Prymak
发明人： Jeffrey Poltorak , Yongjian Qiu , Christian Guerrero , Lance Paul Thornton , Randy S. Hahn , James C. Bates, JR. , John Prymak
IPC分类号： B32B27/32 , B32B27/04
CPC分类号： H01G9/052 , H01G2/065 , H01G9/15 , H01G11/48 , Y02E60/13 , Y10T428/24777 , Y10T428/24917 , Y10T428/249953 , Y10T428/24999 , Y10T428/249991
摘要： Porous sintered anode bodies for capacitors formed from valve metals are treated by electrolysis to form a dielectric layer and coated with cathode layers. When standard parallelpiped shapes are used, cathode coverage at the edges and corners is non-uniform and failures occur at those locations. Rectangular prisms, obround prisms and cylindrical prisms are formed with transition surfaces at edges and corners, such as chamfers and curves, to enhance cathode layer uniformity. The transition surface greatly enhances the application of polymer slurries.
摘要翻译：由阀金属形成的用于电容器的多孔烧结阳极体通过电解处理以形成电介质层并涂覆有阴极层。当使用标准并联形状时，边缘和角落处的阴极覆盖不均匀，并且在这些位置发生故障。矩形棱镜，棱镜棱镜和圆柱形棱镜在边缘和角落（如倒角和曲线）上形成过渡表面，以增强阴极层的均匀性。过渡面大大增强了聚合物浆料的应用。

4. 发明授权

US07292429B2 Low inductance capacitor 有权
标题翻译：低电感电容
公开(公告)号：US07292429B2
公开(公告)日：2007-11-06
申请号：US11334271
申请日：2006-01-18
申请人： Michael S. Randall , John Prymak , Azizuddin Tajuddin
发明人： Michael S. Randall , John Prymak , Azizuddin Tajuddin
IPC分类号： H01G4/005 , H01G4/06
CPC分类号： H01G4/232 , H01G4/30
摘要： A low inductance multi-layer capacitor. The capacitor includes interleaved parallel internal electrode plates with dielectric there between. Each internal electrode plate includes two lead-out tabs and is generally T shaped. A first external electrode terminal is electrically connected to the lead-out tabs of the even internal electrode plates, and a second external electrode terminal is electrically connected to the lead-out tabs of the odd internal electrode plates. The external electrode terminals are on a common first exterior surface and a common opposing second exterior surface of the capacitor.
摘要翻译：低电感多层电容器。电容器包括其间具有电介质的交错并联内部电极板。每个内部电极板包括两个引出片，并且通常为T形。第一外部电极端子电连接到偶数内部电极板的引出接线片，第二外部电极端子电连接到奇数内部电极板的引出接线片。外部电极端子位于电容器的公共第一外表面和公共相对的第二外表面上。

5. 发明申请

US20070165360A1 Low inductance capacitor 有权
标题翻译：低电感电容
公开(公告)号：US20070165360A1
公开(公告)日：2007-07-19
申请号：US11334271
申请日：2006-01-18
申请人： Michael Randall , John Prymak , Azizuddin Tajuddin
发明人： Michael Randall , John Prymak , Azizuddin Tajuddin
IPC分类号： H01G4/228
CPC分类号： H01G4/232 , H01G4/30
摘要： A low inductance multi-layer capacitor. The capacitor comprises interleaved parallel internal electrode plates with dielectric there between. Each internal electrode plate comprises two lead-out tabs and is generally T shaped. A first external electrode terminal is electrically connected to the lead-out tabs of the even internal electrode plates, and a second external electrode terminal is electrically connected to the lead-out tabs of the odd internal electrode plates. The external electrode terminals are on a common first exterior surface and a common opposing second exterior surface of the capacitor.
摘要翻译：低电感多层电容器。电容器包括交错并联的内部电极板，其间具有电介质。每个内部电极板包括两个引出片，并且通常为T形。第一外部电极端子电连接到偶数内部电极板的引出接线片，第二外部电极端子电连接到奇数内部电极板的引出接线片。外部电极端子位于电容器的公共第一外表面和公共相对的第二外表面上。

6. 发明申请

US20070139864A1 Embedded capacitors and methods for their fabrication and connection 失效
标题翻译：嵌入式电容器及其制造和连接方法
公开(公告)号：US20070139864A1
公开(公告)日：2007-06-21
申请号：US11316087
申请日：2005-12-21
申请人： Gregory Dunn , Remy Chelini , Robert Croswell , Philip Lessner , Michael Prevallet , John Prymak
发明人： Gregory Dunn , Remy Chelini , Robert Croswell , Philip Lessner , Michael Prevallet , John Prymak
IPC分类号： H01G9/00
CPC分类号： H01G9/045 , H01G9/0032 , H01G9/055 , H01G9/15 , H05K1/162 , H05K3/383 , H05K3/429 , H05K2201/0355 , H05K2201/09309 , H05K2201/09509 , H05K2201/09718 , H05K2203/0315
摘要： Embedded capacitors comprise a bimetal foil (500) that includes a first copper layer (205) and an aluminum layer (210) on the first copper layer. The aluminum layer has a smooth side adjacent the first copper layer and a high surface area textured side (215) opposite the first copper layer. The bimetal foil further includes an aluminum oxide layer (305) on the high surface area textured side of the aluminum layer, a conductive polymerlayer (420) on the aluminum oxide layer, and a second copper layer (535) overlying the aluminum oxide layer. The bimetal foil may be embedded in a circuit board (700) to form high value embedded capacitors.
摘要翻译：嵌入式电容器包括在第一铜层上包括第一铜层（205）和铝层（210）的双金属箔（500）。铝层具有邻近第一铜层的平滑侧面和与第一铜层相对的高表面积纹理化侧面（215）。双金属箔还包括在铝层的高表面积纹理化侧的氧化铝层（305），氧化铝层上的导电聚合物层（420）和覆盖在氧化铝层上的第二铜层（535）。双金属箔可以嵌入在电路板（700）中以形成高价值的嵌入式电容器。

7. 发明申请

US20050231890A1 Thermal dissipating capacitor and electrical component comprising same 失效
标题翻译：散热电容器和包含它的电气部件
公开(公告)号：US20050231890A1
公开(公告)日：2005-10-20
申请号：US10826605
申请日：2004-04-16
申请人： John Prymak
发明人： John Prymak
IPC分类号： C03B29/00 , H01G2/06 , H01G4/228 , H01G4/232 , H01L23/50 , H05K1/02
CPC分类号： H01G4/232 , H01G2/065 , H01L23/50 , H01L2924/0002 , H05K1/0203 , H05K1/0231 , H05K2201/10545 , H01L2924/00
摘要： An electrical component with a printed circuit board. The printed circuit board has an upper face and a lower face. A microprocessor is mounted to the upper face. A capacitor is mounted to the lower face. The capacitor has a first face parallel to the printed circuit board and a second face opposite to the first face. First plates and second plates are in alternating planar relationship with a dielectric therebetween and arranged in a plane perpendicular to the plane created by the circuit board. Each first plate has a first coupling tab and a power tab on opposing edges wherein the first coupling tab terminates at the first face and the power tab terminates at the second face. Each second plate of the second plates comprises a second coupling tab and a ground tab on opposing edges wherein the second coupling tab terminates at the first face and the ground tab terminates at the second face. The first coupling tab and the second coupling tab are in electrical contact with the microprocessor.
摘要翻译：具有印刷电路板的电气部件。印刷电路板具有上表面和下表面。微处理器安装在上面。电容器安装在下表面。电容器具有平行于印刷电路板的第一面和与第一面相对的第二面。第一板和第二板与它们之间的电介质处于交替的平面关系，并且布置在与由电路板产生的平面垂直的平面中。每个第一板具有在相对边缘上的第一联接接头和电源接头，其中第一连接接头在第一面处终止，并且电源接头在第二面处终止。第二板的每个第二板包括在相对边缘上的第二联接片和接地片，其中第二连接片在第一面终止并且接地片终止于第二面。第一耦合片和第二耦合片与微处理器电接触。

8. 发明申请

US20050230030A1 Thermal dissipating capacitor and electrical component comprising same 有权
公开(公告)号：US20050230030A1
公开(公告)日：2005-10-20
申请号：US11033578
申请日：2005-01-12
申请人： John Prymak
发明人： John Prymak
IPC分类号： C03B29/00 , H01G2/06 , H01G4/228 , H01G4/232 , H01L23/50 , H05K1/02
CPC分类号： H01G4/232 , H01G2/065 , H01L23/50 , H01L2924/0002 , H05K1/0203 , H05K1/0231 , H05K2201/10545 , H01L2924/00
摘要： An electrical component with a printed circuit board. The printed circuit board has an upper face and a lower face. A microprocessor is mounted to the upper face. A capacitor is mounted to the lower face. The capacitor has a first face parallel to the printed circuit board and a second face opposite to the first face. First plates and second plates are in alternating planar relationship with a dielectric therebetween and arranged in a plane perpendicular to the plane created by the circuit board. Each first plate has a first coupling tab and a power tab on opposing edges wherein the first coupling tab terminates at the first face and the power tab terminates at the second face. Each second plate of the second plates comprises a second coupling tab and a ground tab on opposing edges wherein the second coupling tab terminates at the first face and the ground tab terminates at the second face. The first coupling tab and the second coupling tab are in electrical contact with the microprocessor.

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