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1. 发明授权

US07195348B2 Laser welded inkjet printheads having non-uniformly thick printhead lids 有权
标题翻译：具有不均匀厚度的打印头盖的激光焊接喷墨打印头
公开(公告)号：US07195348B2
公开(公告)日：2007-03-27
申请号：US10850175
申请日：2004-05-20
申请人： Jeffery J. Buchanan , Jeanne Marie Saldanha Singh , Ganesh Vinayak Phatak , Kin Ming Kwan
发明人： Jeffery J. Buchanan , Jeanne Marie Saldanha Singh , Ganesh Vinayak Phatak , Kin Ming Kwan
IPC分类号： B41J2/175
CPC分类号： B29C65/1635 , B29C65/1616 , B29C65/1654 , B29C65/1674 , B29C65/1687 , B29C66/112 , B29C66/114 , B29C66/24244 , B29C66/534 , B29C66/53461 , B29C66/71 , B29C66/73921 , B29C66/8122 , B29C66/81267 , B29C66/81415 , B29C66/81425 , B29C66/81431 , B29C66/81457 , B29C66/8322 , B29K2025/00 , B29K2071/12 , B29K2823/06 , B29K2825/00 , B29K2875/00 , B29K2995/0027 , B29L2031/767 , B41J2/16 , B41J2/1634 , B29K2025/06
摘要： In a system for laser welding upper and lower work pieces along a weld interface, the upper work piece being transparent to laser light and having a non-uniformly thick dimension, compensation plates and compliant members are taught that mate or otherwise contact the upper work piece such that a combined thickness of the upper work piece and the compensation plate or compliant member is substantially uniform in a region at least above the weld interface. In this manner, substantially consistent amounts of laser light reach the weld interface. The upper work piece may include positive projections, negative voids, contoured profiles, surface imperfections or other that cause the non-uniformity. In one embodiment, the compensation plate is fashioned together with a compliant member. In another embodiment, the upper and lower work pieces comprise inkjet printhead lids and bodies, respectively.
摘要翻译：在用于沿着焊接界面激光焊接上部和下部工件的系统中，上部工件对于激光是透明的并且具有不均匀的厚度尺寸，教导了补偿或以其他方式接触上部工件的补偿板和柔性构件使得上部工件和补偿板或柔性构件的组合厚度在至少在焊接界面上方的区域中基本均匀。以这种方式，基本上一致的量的激光到达焊接界面。上部工件可以包括正的凸起，负的空隙，轮廓，轮廓缺陷或引起不均匀的其他。在一个实施例中，补偿板与柔顺构件一起形成。在另一个实施例中，上和下工件分别包括喷墨打印头盖和主体。

2. 发明授权

US06841024B2 Compensation plates and compliant members for laser welding a non-uniformly thick work piece including inkjet printheads with non-uniformly thick printhead lids 有权
标题翻译：补偿板和柔性构件，用于激光焊接不均匀厚的工件，包括具有不均匀厚度的打印头盖的喷墨打印头
公开(公告)号：US06841024B2
公开(公告)日：2005-01-11
申请号：US10279389
申请日：2002-10-24
申请人： James Paul Drummond , Kin Ming Kwan , Jeanne Marie Saldanha Singh
发明人： James Paul Drummond , Kin Ming Kwan , Jeanne Marie Saldanha Singh
IPC分类号： B41J2/16 , B23K26/00
CPC分类号： B29C65/1635 , B29C65/1616 , B29C65/1654 , B29C65/1674 , B29C65/1687 , B29C66/112 , B29C66/114 , B29C66/24244 , B29C66/534 , B29C66/53461 , B29C66/71 , B29C66/73921 , B29C66/8122 , B29C66/81267 , B29C66/81415 , B29C66/81425 , B29C66/81431 , B29C66/81457 , B29C66/8322 , B29K2025/00 , B29K2071/12 , B29K2823/06 , B29K2825/00 , B29K2875/00 , B29K2995/0027 , B29L2031/767 , B41J2/16 , B41J2/1634 , B29K2025/06
摘要： In a system for laser welding upper and lower work pieces along a weld interface, the upper work piece being transparent to laser light and having a non-uniformly thick dimension, compensation plates and compliant members are taught that mate or otherwise contact the upper work piece such that a combined thickness of the upper work piece and the compensation plate or compliant member is substantially uniform in a region at least above the weld interface. In this manner, substantially consistent amounts of laser light reach the weld interface. The upper work piece may include positive projections, negative voids, contoured profiles, surface imperfections or other that cause the non-uniformity. In one embodiment, the compensation plate is fashioned together with a compliant member. In another embodiment, the upper and lower work pieces comprise inkjet printhead lids and bodies, respectively.
摘要翻译：在用于沿着焊接界面激光焊接上部和下部工件的系统中，上部工件对于激光是透明的并且具有不均匀的厚度尺寸，教导了补偿或以其他方式接触上部工件的补偿板和柔性构件使得上部工件和补偿板或柔性构件的组合厚度在至少在焊接界面上方的区域中基本均匀。以这种方式，基本上一致的量的激光到达焊接界面。上部工件可以包括正的凸起，负的空隙，轮廓，轮廓缺陷或引起不均匀的其他。在一个实施例中，补偿板与柔顺构件一起形成。在另一个实施例中，上和下工件分别包括喷墨打印头盖和主体。

3. 发明授权

US07404613B2 Inkjet print cartridge having an adhesive with improved dimensional control 有权
标题翻译：具有改进的尺寸控制的粘合剂的喷墨打印盒
公开(公告)号：US07404613B2
公开(公告)日：2008-07-29
申请号：US11169905
申请日：2005-06-29
申请人： Kin Ming Kwan , James Michael Mrvos , Jeanne Marie Saldanha Singh , Mary Claire Smoot
发明人： Kin Ming Kwan , James Michael Mrvos , Jeanne Marie Saldanha Singh , Mary Claire Smoot
IPC分类号： B41J2/015 , B41J2/175
CPC分类号： B41J2/17559
摘要： A method for manufacturing an inkjet print cartridge and an inkjet cartridge produced thereby are disclosed. An inkjet print cartridge in accordance with one aspect includes a component of the inkjet print cartridge and an applied adhesive on at least a portion of the component, wherein the applied adhesive is formed from an adhesive having a rheology viscosity ratio ηi/ηmin of from 1.0 to less than 2.1. The method in accordance with one aspect includes applying an adhesive onto at least a portion of a component of an inkjet print cartridge at an application temperature, Tα, and heating the adhesive from an initial temperature, Ti, to a cure temperature for the adhesive, Tc. The adhesive has a rheology cure profile characterized by at least one of the following parameters: a) a rheology viscosity ratio ηi/ηmin of from 1.0 to less than 2.1, b) a temperature of the adhesive is approximately equal to a minimum viscosity temperature for the adhesive, Tηmin, within less than about 10 minutes from the start of the cure cycle, and c) viscosity of the adhesive increases within less than about 5 minutes from the start of the cure cycle.
摘要翻译：公开了一种用于制造由此制造的喷墨打印墨盒和喷墨墨盒的方法。根据一个方面的喷墨打印墨盒包括喷墨打印墨盒的组件和在组件的至少一部分上的涂布的粘合剂，其中涂布的粘合剂由具有流变粘度比η的粘合剂形成， /小于/小于2.1。根据一个方面的方法包括在施加温度Tαα下将粘合剂施加到喷墨打印盒的部件的至少一部分上，并从初始温度T 1加热粘合剂，将粘合剂的固化温度提高到粘合剂的固化温度。粘合剂具有流变学固化分布，其特征在于以下参数中的至少一个：a）1.0至小于2.1的流变粘度比ηη/ηmin / b）粘合剂的温度近似等于粘合剂T et et在从固化循环开始后不到约10分钟内的最低粘度温度，c）粘合剂的粘度在治愈周期开始后不到5分钟内就会增加。

4. 发明申请

US20160312049A1 THERMALLY INKJETTABLE ACRYLIC DIELECTRIC INK FORMULATION AND PROCESS 审中-公开
标题翻译：热可塑性丙烯酸介质浸渍配方及工艺
公开(公告)号：US20160312049A1
公开(公告)日：2016-10-27
申请号：US15199829
申请日：2016-06-30
申请人： Xiaorong Cai , Michael John Dixon , Yimin Guan , Ann P. Holloway , Jeanne Marie Saldanha Singh , Zhigang Xiao
发明人： Xiaorong Cai , Michael John Dixon , Yimin Guan , Ann P. Holloway , Jeanne Marie Saldanha Singh , Zhigang Xiao
IPC分类号： C09D11/03 , C09D11/107 , H05K1/03 , C09D11/30
CPC分类号： C09D11/03 , B05D3/0209 , B05D3/0254 , C09D11/101 , C09D11/107 , C09D11/30 , H05K1/0373 , H05K1/162 , H05K2201/0209 , H05K2203/013
摘要： An aqueous composition for forming a micro-fluid jet printable dielectric film layer, methods for forming dielectric film layers, and dielectric film layers formed by the method. The aqueous composition includes from about 5 to about 20 percent by 65 weight of a polymeric binder emulsion, from about 10 to about 30 percent by weight of a humectant, from about 0 to about 3 percent by weight of a surfactant, and an aqueous carrier fluid. The aqueous composition has a viscosity ranging from about 2 to about 6 centipoise at a temperature of about 23° C.
摘要翻译：用于形成微流体喷射可印刷电介质膜层的水性组合物，用于形成电介质膜层的方法和通过该方法形成的电介质膜层。水性组合物包括约5至约20重量％至65重量％的聚合物粘合剂乳液，约10至约30重量％的湿润剂，约0至约3重量％的表面活性剂和水性载体流体。含水组合物在约23℃的温度下具有约2至约6厘泊的粘度。

5. 发明申请

US20110318882A1 METHOD OF RESTRICTING CHIP MOVEMENT UPON BONDING TO RIGID SUBSTRATE USING SPRAY COATABLE ADHESIVE 审中-公开
标题翻译：使用喷涂粘合剂粘合到刚性基板上的芯片运动限制方法
公开(公告)号：US20110318882A1
公开(公告)日：2011-12-29
申请号：US13168219
申请日：2011-06-24
申请人： Xiaoming Wu , Paul Dryer , David Rhine , Anne Pearson , Jeanne Marie Saldanha Singh , Richard Wells , Joel Provence
发明人： Xiaoming Wu , Paul Dryer , David Rhine , Anne Pearson , Jeanne Marie Saldanha Singh , Richard Wells , Joel Provence
IPC分类号： H01L21/50
CPC分类号： B41J2/1601 , B41J2/1623 , B41J2/1628 , B41J2/1645
摘要： A method of bonding a chip to a wafer at precise alignment suitable for fabricating a heater chip in an ink jet printhead is provided. The method includes spray coating an adhesive composition on a surface of a substrate, aligning and tacking at least one chip to the substrate coated with the adhesive composition, exposing the substrate tacked with at least one chip coated with the adhesive composition to radiation and heat, and performing thermal compression bonding. The method uses a spray coatable adhesive composition comprising a thermally activated adhesive and a photoacid generator.
摘要翻译：提供了一种以适合于在喷墨打印头中制造加热器芯片的精确对准将芯片结合到晶片的方法。该方法包括将粘合剂组合物喷涂在基材的表面上，将至少一个芯片对准并固定到涂覆有粘合剂组合物的基材上，将涂覆有至少一个涂有粘合剂组合物的芯片的基材暴露于辐射和加热，并进行热压接。该方法使用包含热活化粘合剂和光致酸产生剂的喷涂可涂层粘合剂组合物。

6. 发明授权

US07784909B2 Ink jetting structure having protected connections 有权
标题翻译：具有受保护连接的喷墨结构
公开(公告)号：US07784909B2
公开(公告)日：2010-08-31
申请号：US12021375
申请日：2008-01-29
申请人： Frank Edward Anderson , Michael John Dixon , Bryan Dale McKinley , Jeanne Marie Saldanha Singh
发明人： Frank Edward Anderson , Michael John Dixon , Bryan Dale McKinley , Jeanne Marie Saldanha Singh
IPC分类号： B41J2/14
CPC分类号： B41J2/17553 , B41J2/17526
摘要： An ink jetting structure includes a substrate that has a first surface and a second surface. A heater chip is mounted to the second surface of the substrate, and includes a first set of electrical contacts. A printhead circuit member has a third surface, a fourth surface, and an opening configured to receive the heater chip with the first set of electrical contacts of the heater chip being exposed through the opening. The third surface is mounted to the second surface of the substrate. The fourth surface has a second set of electrical contacts attached by wire bonds to the first set of electrical contacts. The third surface has a third set of electrical contacts electrically coupled to the second set of electrical contacts, and electrically connected to a flexible cable for coupling to corresponding contacts on a printer.
摘要翻译：喷墨结构包括具有第一表面和第二表面的基底。加热器芯片安装到基板的第二表面，并且包括第一组电触头。打印头电路构件具有第三表面，第四表面和开口，其构造成接收加热器芯片，加热器芯片的第一组电触点通过开口露出。第三表面安装到基板的第二表面。第四表面具有通过引线键合连接到第一组电触点的第二组电触头。第三表面具有电耦合到第二组电触头的第三组电触点，并且电连接到柔性电缆，用于耦合到打印机上的相应触点。

7. 发明申请

US20100132874A1 Composite Ceramic Substrate for Micro-Fluid Ejection Head 有权
标题翻译：用于微流体喷射头的复合陶瓷基板
公开(公告)号：US20100132874A1
公开(公告)日：2010-06-03
申请号：US12697308
申请日：2010-02-01
申请人： Frank Edward Anderson , Michael John Dixon , Eric Spencer Hall , Elios Klemo , Bryan Dale McKinley , Jeanne Marie Saldanha Singh
发明人： Frank Edward Anderson , Michael John Dixon , Eric Spencer Hall , Elios Klemo , Bryan Dale McKinley , Jeanne Marie Saldanha Singh
IPC分类号： B29C65/02
CPC分类号： B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1632 , B41J2/1634 , B41J2202/03 , Y10T29/435 , Y10T29/49155 , Y10T29/49163 , Y10T29/49401 , Y10T428/24926
摘要： A composite ceramic substrate for receiving an ejection head chip for a micro-fluid ejection head and a method for making the composite ceramic substrate. The substrate includes a high temperature previously fired ceramic base having a substantially planarized first surface and at least one fluid supply slot therethrough. A low temperature co-fired ceramic (LTCC) tape layer bundle having at least two LTCC tape layers is attached to the ceramic base at an interface between the LTCC tape layer bundle and the first surface of the ceramic base. The LTCC tape layer bundle has at least one chip pocket therein and at least one of the LTCC tape layers includes a plurality of conductors.
摘要翻译：一种用于接收用于微流体喷射头的喷射头芯片的复合陶瓷基板和用于制造复合陶瓷基板的方法。衬底包括具有基本平坦化的第一表面的高温预先烧制的陶瓷基底和穿过其中的至少一个流体供给槽。具有至少两个LTCC带层的低温共烧陶瓷（LTCC）带层束在LTCC带层束和陶瓷基底的第一表面之间的界面附着在陶瓷基底上。 LTCC带层束在其中具有至少一个芯片袋，并且LTCC带层中的至少一个包括多个导体。

8. 发明申请

US20080044631A1 GRADIENT LAYERS IN MULTI-LAYER CIRCUITS AND METHODS AND CIRCUITS RELATED TO THE SAME 审中-公开
标题翻译：多层电路中的梯度层和与之相关的方法和电路
公开(公告)号：US20080044631A1
公开(公告)日：2008-02-21
申请号：US11838257
申请日：2007-08-14
申请人： Paul Sacoto , Jeanne Marie Saldanha Singh , Rebecca Beth Silveston-Keith
发明人： Paul Sacoto , Jeanne Marie Saldanha Singh , Rebecca Beth Silveston-Keith
IPC分类号： B32B1/00 , H01C17/06
CPC分类号： H01C17/065 , H05K3/1208 , H05K3/125 , H05K3/386 , H05K2201/0209 , H05K2201/0269 , H05K2203/013 , Y10T428/24628
摘要： Methods for improving adherence of conductive traces, such as in a printed circuit, and circuits having conductive traces formed in accordance with such methods. One such method includes depositing a fluid composition receiving layer adjacent to a substrate, and depositing a gradient layer adjacent to the fluid composition receiving layer. The gradient layer is comprised of a fluid composition providing the fluid composition receiving layer and a fluid composition providing a conductive layer. A conductive layer composition is deposited adjacent to the gradient layer to provide the conductive layer.
摘要翻译：用于改善导电迹线的粘附性的方法，例如在印刷电路中，以及根据这些方法形成的具有导电迹线的电路。一种这样的方法包括沉积与衬底相邻的流体组合物接收层，以及沉积与流体组合物接收层相邻的梯度层。梯度层由提供流体组合物接收层的流体组合物和提供导电层的流体组合物组成。导电层组合物沉积在梯度层附近以提供导电层。

9. 发明授权

US06758934B2 Method and apparatus for adhesively securing ink jet pen components using thin film adhesives 有权
标题翻译：使用薄膜粘合剂粘合地固定喷墨笔组件的方法和装置
公开(公告)号：US06758934B2
公开(公告)日：2004-07-06
申请号：US10305636
申请日：2002-11-27
申请人： Jeanne Marie Saldanha Singh , Thomas Lee Smart
发明人： Jeanne Marie Saldanha Singh , Thomas Lee Smart
IPC分类号： B32B3118
CPC分类号： B41J2/17536 , Y10T156/1062 , Y10T156/1064 , Y10T156/108 , Y10T156/1082 , Y10T156/12 , Y10T156/1322
摘要： The invention relates to a method for attaching microelectronic devices, circuit boards and the like to a surface, and is particularly suitable for attaching a plurality of a semiconductor chips to an ink jet pen body. The method includes the steps of (a) providing a sheet of a thin film adhesive material having a first surface and a second surface opposite the first surface, the second surface being releasably attached to a carrier web; (b) simultaneously making a plurality of cuts in the sheet of thin film adhesive material, the cuts extending from the first surface to an interface between the second surface and the carrier web without significantly extending into the carrier web to provide one or more cut portions of adhesive film; (c) removing each cut portion of adhesive film from the carrier web; (d) engaging the second surface of each of the cut portions with predetermined locations on a receiving surface; and (e) providing one or more semiconductor chips in a desirably aligned configuration with respect to the predetermined locations and contacting each semiconductor chip with first surface of each of the cut portions. Use of the method and apparatus of the invention provides significant improvement in the application of adhesive films to surfaces in electronic component assembly.
摘要翻译：本发明涉及一种将微电子器件，电路板等附着在表面上的方法，特别适用于将多个半导体芯片附着到喷墨笔体上。该方法包括以下步骤：（a）提供具有第一表面和与第一表面相对的第二表面的薄膜粘合材料片，所述第二表面可释放地附接到载体网; （b）同时在薄膜粘合剂材料片上进行多个切口，切口从第一表面延伸到第二表面和载体网之间的界面，而不会显着延伸到载体网中以提供一个或多个切割部分的胶膜; （c）从载体网上去除粘合膜的每个切割部分; （d）将每个切割部分的第二表面与接收表面上的预定位置接合; 和（e）相对于预定位置提供期望对准的一个或多个半导体芯片，并使每个半导体芯片与每个切割部分的第一表面接触。使用本发明的方法和装置提供了在电子部件组件中将粘合剂膜应用于表面方面的显着改进。

10. 发明授权

US08636340B2 Printheads and method for assembling printheads 有权
标题翻译：打印头和组装打印头的方法
公开(公告)号：US08636340B2
公开(公告)日：2014-01-28
申请号：US13046845
申请日：2011-03-14
申请人： Michael J. Dixon , Jiandong Fang , Richard Earl Corley, Jr. , Jeanne Marie Saldanha Singh , Frank E. Anderson , Xiaoming Wu
发明人： Michael J. Dixon , Jiandong Fang , Richard Earl Corley, Jr. , Jeanne Marie Saldanha Singh , Frank E. Anderson , Xiaoming Wu
IPC分类号： B41J2/25
CPC分类号： B41J2/1628 , B41J2/1603 , B41J2/1623 , B41J2/1629 , B41J2/1631 , B41J2/1642
摘要： Disclosed is a printhead for a printer that includes a plurality of ejection chip units. Each ejection chip unit of the plurality of ejection chip units is configured to eject at least one fluid. The printhead further includes a plurality of supporting units. Each supporting unit of the plurality of supporting units is fluidly coupled with a corresponding ejection chip unit. The each supporting unit includes a plurality of trenches adapted to receive an adhesive to facilitate attachment of the each supporting unit with the corresponding ejection chip unit. Furthermore, the printhead includes a base unit fluidly coupled with the each supporting unit of the plurality of supporting units. The base unit is adapted to provide the at least one fluid to the each ejection chip unit through a corresponding to supporting unit. Further disclosed is a method for assembling the printhead.
摘要翻译：公开了一种用于打印机的打印头，其包括多个排出芯片单元。多个排出芯片单元中的每个排出芯片单元构造成喷射至少一种流体。打印头还包括多个支撑单元。多个支撑单元的每个支撑单元与相应的排出芯片单元流体耦合。每个支撑单元包括适于接收粘合剂以便于将各个支撑单元与相应的排出芯片单元相连接的多个沟槽。此外，打印头包括与多个支撑单元中的每个支撑单元流体耦合的基座单元。基座单元适于通过对应的支撑单元将至少一个流体提供给每个排出芯片单元。另外公开了一种组装打印头的方法。

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