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1. 发明授权

US08151446B2 Apparatus for manufacturing printed circuit board 失效
标题翻译：印刷电路板制造装置
公开(公告)号：US08151446B2
公开(公告)日：2012-04-10
申请号：US12076223
申请日：2008-03-14
申请人： Jee-Soo Mok , Je-Gwang Yoo , Yoong Oh , Jong-Seok Bae , Chang-Sup Ryu
发明人： Jee-Soo Mok , Je-Gwang Yoo , Yoong Oh , Jong-Seok Bae , Chang-Sup Ryu
IPC分类号： B23P19/04
CPC分类号： H05K3/4647 , B29C43/28 , B29C43/46 , H05K3/4069 , H05K2203/0143 , H05K2203/1189 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/53126 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187
摘要： An apparatus for manufacturing a printed circuit board that uses conductive bumps to interconnect layers includes: a conveyor unit, which is configured to transport a board that has the conductive bumps formed on one side; an upper roller and a lower roller, which press the board and an insulator together; an elastic coating layer, formed on a surface of the upper roller; and a cleaning device, which removes impurities from a surface of the elastic coating layer. The apparatus does not require a separate device for performing a cushioning function and a detaching function between the bumps and the rollers, and the rollers can be kept clean using a cleaning device.
摘要翻译：用于制造使用导电凸块以互连层的印刷电路板的装置包括：输送单元，其被配置为输送在一侧形成有导电凸块的板; 上辊和下辊，将板和绝缘体压在一起; 形成在上辊的表面上的弹性涂层; 以及从弹性涂层的表面除去杂质的清洗装置。该装置不需要用于执行缓冲功能和凸块和辊之间的分离功能的单独装置，并且可以使用清洁装置将辊保持清洁。

2. 发明申请

US20090049683A1 Apparatus and method for manufacturing printed circuit board 失效
标题翻译：印刷电路板制造装置及方法
公开(公告)号：US20090049683A1
公开(公告)日：2009-02-26
申请号：US12076223
申请日：2008-03-14
申请人： Jee-Soo Mok , Je-Gwang Yoo , Yoong Oh , Jong-Seok Bae , Chang-Sup Ryu
发明人： Jee-Soo Mok , Je-Gwang Yoo , Yoong Oh , Jong-Seok Bae , Chang-Sup Ryu
IPC分类号： H05K3/00 , B29C43/34 , H01L21/67
CPC分类号： H05K3/4647 , B29C43/28 , B29C43/46 , H05K3/4069 , H05K2203/0143 , H05K2203/1189 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/53126 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187
摘要： An apparatus and a method for manufacturing a printed circuit board are disclosed. The apparatus for manufacturing a printed circuit board that uses conductive bumps to interconnect layers includes: a conveyor unit, which is configured to transport a board that has the conductive bumps formed on one side; an upper roller and a lower roller, which press the board and an insulator together; an elastic coating layer, formed on a surface of the upper roller; and a cleaning device, which removes impurities from a surface of the elastic coating layer. The apparatus does not require a separate device for performing a cushioning function and a detaching function between the bumps and the rollers, and the rollers can be kept clean using a cleaning device.
摘要翻译：公开了一种用于制造印刷电路板的装置和方法。用于制造使用导电凸块以互连层的印刷电路板的装置包括：输送单元，其被配置为输送在一侧形成有导电凸块的板; 上辊和下辊，将板和绝缘体压在一起; 形成在上辊的表面上的弹性涂层; 以及从弹性涂层的表面除去杂质的清洗装置。该装置不需要用于执行缓冲功能和凸块和辊之间的分离功能的单独装置，并且可以使用清洁装置将辊保持清洁。

3. 发明申请

US20090294739A1 CONDUCTIVE PASTE INCLUDING A CARBON NANOTUBE AND PRINTED CIRCUIT BOARD USING THE SAME 审中-公开
标题翻译：包含碳纳米管和印刷电路板的导电胶
公开(公告)号：US20090294739A1
公开(公告)日：2009-12-03
申请号：US12263685
申请日：2008-11-03
申请人： Eung-Suek Lee , Je-Gwang Yoo , Chang-Sup Ryu , Jun-Oh Hwang , Tae-Eun Chang , Jee-Soo Mok
发明人： Eung-Suek Lee , Je-Gwang Yoo , Chang-Sup Ryu , Jun-Oh Hwang , Tae-Eun Chang , Jee-Soo Mok
IPC分类号： H01B1/02
CPC分类号： H01B1/24 , B82Y10/00 , H05K1/095 , H05K3/4069 , H05K2201/026 , H05K2201/0272 , H05K2201/0323 , H05K2203/0425
摘要： The invention provides a conductive paste including a carbon nanotube and a printed circuit board using the same. The invention provides the conductive paste which exhibits an excellent electrical conductivity and allows the implementation of the X-Y interconnection and simultaneously the Z-interconnection without loosing the carbon nanotube's own original characteristics.
摘要翻译：本发明提供一种包括碳纳米管的导电浆料和使用其的印刷电路板。本发明提供了导电性优异的导电性糊剂，其导电性优异，可以实现X-Y互连，同时实现Z-互连，而不会使碳纳米管本身的原有特性丧失。

4. 发明申请

US20090017275A1 Heat-releasing printed circuit board and manufacturing method thereof 审中-公开
标题翻译：散热印刷电路板及其制造方法
公开(公告)号：US20090017275A1
公开(公告)日：2009-01-15
申请号：US12076428
申请日：2008-03-18
申请人： Eung-Suek Lee , Je-Gwang Yoo , Chang-Sup Ryu , Jun-Oh Hwang , Jee-Soo Mok
发明人： Eung-Suek Lee , Je-Gwang Yoo , Chang-Sup Ryu , Jun-Oh Hwang , Jee-Soo Mok
IPC分类号： H05K3/00 , B32B3/10
CPC分类号： H05K3/4069 , B82Y10/00 , H05K1/0206 , H05K1/0209 , H05K3/06 , H05K3/249 , H05K3/427 , H05K3/4614 , H05K3/4647 , H05K2201/026 , H05K2201/0347 , H05K2201/035 , H05K2201/096 , Y10T428/24851
摘要： A heat-releasing PCB and a method of manufacturing the PCB are disclosed. The method of manufacturing the heat-releasing printed circuit board includes: preparing a copper clad laminate, which has at least one copper layer stacked on at least one insulation layer; forming a coating layer, made from a paste having carbon nanotubes as a major constituent, on a surface of the copper layer; and forming a circuit pattern by removing portions of the coating layer and portions of the copper layer.
摘要翻译：公开了一种散热PCB及其制造方法。制造散热型印刷电路板的方法包括：制备覆铜层压板，其具有至少一层铜层，堆叠在至少一层绝缘层上; 在铜层的表面上形成由具有碳纳米管作为主要成分的浆料制成的涂层; 以及通过去除涂层的一部分和铜层的一部分来形成电路图案。

5. 发明申请

US20090083975A1 Method of interconnecting layers of a printed circuit board 审中-公开
标题翻译：互连印刷电路板层的方法
公开(公告)号：US20090083975A1
公开(公告)日：2009-04-02
申请号：US12078949
申请日：2008-04-08
申请人： Eung-Suek Lee , Young-Jin Kim , Seung-Hyun Baik , Jae-Boong Cho , Young-Seok Oh , Dae-Woo Suh , Je-Gwang Yoo , Jee-Soo Mok , Chang-Sup Ryu
发明人： Eung-Suek Lee , Young-Jin Kim , Seung-Hyun Baik , Jae-Boong Cho , Young-Seok Oh , Dae-Woo Suh , Je-Gwang Yoo , Jee-Soo Mok , Chang-Sup Ryu
IPC分类号： H05K3/36
CPC分类号： H05K3/4069 , B82Y10/00 , H05K1/095 , H05K3/4614 , H05K3/4647 , H05K2201/026 , H05K2201/0355 , H05K2201/10378 , H05K2203/1461 , Y10T29/49126
摘要： A method of interconnecting layers of a printed circuit board is disclosed. The method includes: forming at least one bump on a first metal layer using a conductive paste containing carbon nanotubes, stacking an insulation layer on the first metal layer such that the bumps penetrate the insulation layer, and stacking a second metal layer on the insulation layer such that the second metal layer is electrically connected with the first metal layer by the bump.
摘要翻译：公开了一种互连印刷电路板的层的方法。该方法包括：使用含有碳纳米管的导电浆料在第一金属层上形成至少一个凸块，在第一金属层上堆叠绝缘层，使凸块穿透绝缘层，并将第二金属层堆叠在绝缘层上使得第二金属层通过凸块与第一金属层电连接。

6. 发明授权

US07983055B2 Printed circuit board with embedded cavity capacitor 有权
标题翻译：带嵌入式腔体电容器的印刷电路板
公开(公告)号：US07983055B2
公开(公告)日：2011-07-19
申请号：US12010436
申请日：2008-01-24
申请人： Han Kim , Je-Gwang Yoo , Chang-Sup Ryu
发明人： Han Kim , Je-Gwang Yoo , Chang-Sup Ryu
IPC分类号： H05K1/18 , H01L27/108
CPC分类号： H05K1/162 , H05K1/0218 , H05K1/0236 , H05K3/4069 , H05K2201/09509 , H05K2201/09618 , H05K2201/09663 , H05K2201/09972
摘要： A printed circuit board having an embedded cavity capacitor is disclosed. According to an embodiment of the present invention, the printed circuit board having the embedded cavity capacitor, the printed circuit board can include two conductive layers to be used as a power layer and a ground layer, respectively; and a first dielectric layer, placed between the two conductive layers, wherein at least one cavity capacitor is arranged in a noise-transferable path between a noise source and a noise prevented destination which are placed on the printed circuit board, the cavity capacitor being formed to allow a second dielectric layer to have a lower stepped region than the first dielectric layer, the second dielectric layer using the two conductive layers as a first electrode and a second electrode, respectively, and placed between the first electrode and the second electrode.
摘要翻译：公开了一种具有嵌入式腔体电容器的印刷电路板。根据本发明的实施例，具有嵌入式空腔电容器的印刷电路板，印刷电路板可以分别包括用作功率层和接地层的两个导电层; 以及放置在所述两个导电层之间的第一电介质层，其中至少一个空腔电容器被布置在放置在所述印刷电路板上的噪声源和被噪声阻止的目的地之间的可噪声转移路径中，形成所述空腔电容器以允许第二电介质层具有比第一电介质层更低的台阶区域，第二电介质层分别使用两个导电层作为第一电极和第二电极，并且放置在第一电极和第二电极之间。

7. 发明申请

US20100212951A1 Electromagnetic interference noise reduction board using electromagnetic bandgap structure 有权
标题翻译：电磁干扰降噪板采用电磁带隙结构
公开(公告)号：US20100212951A1
公开(公告)日：2010-08-26
申请号：US12654766
申请日：2009-12-31
申请人： Han Kim , Je-Gwang Yoo , Chang-Sup Ryu
发明人： Han Kim , Je-Gwang Yoo , Chang-Sup Ryu
IPC分类号： H05K9/00
CPC分类号： H05K9/0071 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2924/00014 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/0236 , H05K9/002 , H05K9/0064 , H05K2201/09309 , H05K2201/09627 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An EMI noise reduction board using an electromagnetic bandgap structure is disclosed. In the EMI noise reduction board according to an embodiment of the present invention, an electromagnetic bandgap structure having band stop frequency properties can be inserted into an inner portion of the board so as to shield an EMI noise, in which the portion corresponds to an edge of the board and in which the EMI noise is conducted from the inside to the edge of the board and radiates to the outside of the board.
摘要翻译：公开了一种使用电磁带隙结构的EMI降噪板。在根据本发明实施例的EMI噪声抑制板中，具有带阻频率特性的电磁带隙结构可以插入到板的内部，以屏蔽EMI噪声，其中该部分对应于边缘并且其EMI噪声从板的内部传导到边缘并辐射到板的外部。

8. 发明申请

US20090130390A1 Optical wiring board and manufacturing method thereof 审中-公开
标题翻译：光接线板及其制造方法
公开(公告)号：US20090130390A1
公开(公告)日：2009-05-21
申请号：US12149952
申请日：2008-05-09
申请人： Joon-Sung Kim , Je-Gwang Yoo , Chang-Sup Ryu , Han-Seo Cho , Sang-Hoon Kim
发明人： Joon-Sung Kim , Je-Gwang Yoo , Chang-Sup Ryu , Han-Seo Cho , Sang-Hoon Kim
IPC分类号： B32B3/00 , B29D11/00
CPC分类号： B29D11/00663 , B29D11/00807 , G02B6/136 , H05K1/0274 , Y10T428/24612
摘要： An optical wiring board and a method of manufacturing the optical wiring board are disclosed. The method of manufacturing an optical wiring board may include forming a lower cladding over an insulating layer; forming a side cladding, which has an indentation corresponding with the core, over the lower cladding; filling a core material in the indentation; and forming an upper cladding such that the core material is covered. Embodiments of the invention can be utilized to readily control the thickness of the core.
摘要翻译：公开了一种光布线板及其制造方法。制造光布线板的方法可以包括在绝缘层上形成下包层; 在所述下包层上形成具有与所述芯对应的凹陷的侧包层; 填充压痕中的芯材; 并且形成上覆层，使得芯材被覆盖。本发明的实施例可用于容易地控制芯的厚度。

9. 发明申请

US20110197409A1 Method of fabricating cavity capacitor embedded in printed circuit board 审中-公开
标题翻译：埋入印刷电路板的空腔电容器的制造方法
公开(公告)号：US20110197409A1
公开(公告)日：2011-08-18
申请号：US13064847
申请日：2011-04-20
申请人： Han Kim , Je-Gwang Yoo , Chang-Sup Ryu
发明人： Han Kim , Je-Gwang Yoo , Chang-Sup Ryu
IPC分类号： H01G7/00
CPC分类号： H05K1/162 , H05K3/0035 , H05K3/4069 , H05K3/4602 , H05K2201/0187 , H05K2201/0394 , H05K2201/09509 , H05K2201/09563 , Y10T29/435 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： A method of fabricating a cavity capacitor embedded in a printed circuit board including two conductive layers to be used as a power layer and a ground layer, respectively, and a first dielectric layer, placed between the two conductive layers, the method including: removing an upper conductive layer and the first dielectric layer excluding a lower conductive layer of the two conductive layers to allow a cavity to be formed between the two conductive layers, the lower conductive layer being supposed to be used as any one of electrodes of the cavity capacitor; stacking a dielectric material on the cavity to allow a second dielectric layer having a lower stepped portion than the first dielectric layer to be formed in the cavity; and stacking a conductive material on an upper part of the second dielectric layer and side parts of the cavity to allow the upper conductive layer to be used as the other electrode of the cavity capacitor.
摘要翻译：一种嵌入在印刷电路板中的空腔电容器的方法，包括分别用作功率层和接地层的两个导电层和放置在两个导电层之间的第一介电层，所述方法包括：上导电层和除了两个导电层的下导电层之外的第一电介质层，以允许在两个导电层之间形成腔，下导电层假定用作空腔电容器的任一电极; 在所述空腔上堆叠电介质材料以允许在所述空腔中形成具有比所述第一电介质层更低的台阶部分的第二电介质层; 并且在第二电介质层的上部和空腔的侧部上堆叠导电材料，以允许上部导电层用作空腔电容器的另一个电极。

10. 发明申请

US20110039076A1 Optical wiring board having a core 审中-公开
标题翻译：具有芯的光线路板
公开(公告)号：US20110039076A1
公开(公告)日：2011-02-17
申请号：US12923993
申请日：2010-10-19
申请人： Joon-Sung Kim , Je-Gwang Yoo , Chang-Sup Ryu , Han-Seo Cho , Sang-Hoon Kim
发明人： Joon-Sung Kim , Je-Gwang Yoo , Chang-Sup Ryu , Han-Seo Cho , Sang-Hoon Kim
IPC分类号： B32B3/00
CPC分类号： B29D11/00663 , B29D11/00807 , G02B6/136 , H05K1/0274 , Y10T428/24612
摘要： An optical wiring board having a core, the optical wiring board including: a lower cladding; a side cladding formed over the lower cladding and having an indentation formed therein, the indentation being in correspondence with the core; a core embedded in the indentation; and an upper cladding covering the core, wherein a height of the core is different from a depth of the indentation
摘要翻译：一种具有芯的光布线板，所述光布线板包括：下包层; 在所述下包层上形成有在其中形成有凹陷的侧包层，所述凹陷与所述芯相对应; 嵌入缩进的核心; 以及覆盖所述芯的上包层，其中所述芯的高度不同于所述凹陷的深度

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