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1. 发明申请

US20130189888A1 Self-Healing Composite Materials And Micro-Vascular Composites For Forming The Materials 审中-公开
标题翻译：用于形成材料的自愈复合材料和微血管复合材料
公开(公告)号：US20130189888A1
公开(公告)日：2013-07-25
申请号：US13721801
申请日：2012-12-20
申请人： Jason F. Patrick , Kevin R. Hart , Brett P. Krull , Nancy R. Sottos , Jeffrey S. Moore , Scott R. White
发明人： Jason F. Patrick , Kevin R. Hart , Brett P. Krull , Nancy R. Sottos , Jeffrey S. Moore , Scott R. White
IPC分类号： B29C73/22
CPC分类号： B29C73/22 , B29C48/023 , B29C48/05 , B29C67/202 , B29K2067/046 , B32B3/26 , B32B5/024 , B32B5/12 , B32B5/26 , B32B7/08 , B32B17/04 , B32B2260/023 , B32B2260/046 , B32B2262/101 , B32B2307/762 , Y10T442/2098 , Y10T442/3195
摘要： A self-healing composite system includes a solid polymeric matrix and a woven structure in the matrix. The woven structure includes a plurality of fibers, and a first plurality of microfluidic channels. The microfluidic channels include a first healing agent in the channels. The woven structure also may include a second plurality of microfluidic channels that include a second healing agent in the channels.
摘要翻译：自修复复合系统包括固体聚合物基质和基质中的编织结构。编织结构包括多个纤维和第一多个微流体通道。微流体通道包括通道中的第一愈合剂。编织结构还可以包括在通道中包括第二愈合剂的第二多个微流体通道。

2. 发明申请

US20120312589A1 Laser Resin Activation to Provide Selective Via Plating for Via Stub Elimination 失效
标题翻译：激光树脂激活提供选择性通过电镀通过短截线消除
公开(公告)号：US20120312589A1
公开(公告)日：2012-12-13
申请号：US13154821
申请日：2011-06-07
申请人： Gregory E. Balcome , Brett P. Krull , Joseph Kuczynski , Terry G. Ryks , Timothy J. Tofil
发明人： Gregory E. Balcome , Brett P. Krull , Joseph Kuczynski , Terry G. Ryks , Timothy J. Tofil
IPC分类号： H05K1/00 , B32B38/04 , H05K3/46 , G06F17/50
CPC分类号： H05K3/429 , G06F17/5077 , H05K1/0251 , H05K3/4626 , H05K2201/0209 , H05K2203/107 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T156/1057
摘要： An enhanced mechanism for via stub elimination in printed wiring boards (PWBs) and other substrates employs laser resin activation to provide selective via plating. In one embodiment, the resin used in insulator layers of the PWB contains spinel-based non-conductive metal oxide. Preferably, only insulator layers through which vias will pass contain the metal oxide. Those layers are registered and laser irradiated at via formation locations to break down the metal oxide and release metal nuclei. Once these layers are irradiated, all layers of the PWB or subcomposite are laid up and laminated. The resulting composite or subcomposite is subsequently drilled through and subjected to conventional PWB fabrication processes prior to electroless copper plating and subsequent copper electroplating. Because metal nuclei were released only in the via formation locations of the appropriate layers, plating occurs in the via barrels only along those layers and partially plated vias are created without stubs.
摘要翻译：印刷电路板（PWB）和其他基板中通过短截线消除的增强机制采用激光树脂激活来提供选择性通孔电镀。在一个实施方案中，PWB的绝缘体层中使用的树脂含有尖晶石型非导电金属氧化物。优选地，仅通孔所通过的绝缘体层将含有金属氧化物。登记这些层并在通孔形成位置激光照射以分解金属氧化物并释放金属核。一旦这些层被照射，PWB或亚复合材料的所有层被铺设和层压。随后在化学镀铜和随后的铜电镀之前，将所得到的复合材料或副复合材料钻穿并经过常规PWB制造工艺。因为金属核仅在适当层的通孔形成位置中释放，所以仅沿着这些层在通孔桶中进行电镀，并且在没有短截线的情况下产生部分镀覆的通孔。

3. 发明授权

US08974888B2 Preventing conductive anodic filament (CAF) formation by sealing discontinuities in glass fiber bundles 有权
标题翻译：通过密封玻璃纤维束的不连续性来防止导电阳极丝（CAF）的形成
公开(公告)号：US08974888B2
公开(公告)日：2015-03-10
申请号：US13221268
申请日：2011-08-30
申请人： Gregory E. Balcome , Brett P. Krull , Joseph Kuczynski , Terry G. Ryks , Timothy J. Tofil
发明人： Gregory E. Balcome , Brett P. Krull , Joseph Kuczynski , Terry G. Ryks , Timothy J. Tofil
IPC分类号： B32B3/24 , B32B3/10 , H05K3/28 , B32B5/02
CPC分类号： B32B3/10 , B32B5/02 , B32B2262/101 , B32B2383/00 , B32B2457/08 , H05K1/0366 , H05K3/0055 , H05K3/28 , H05K3/42 , H05K3/429 , H05K2201/029 , H05K2203/1147 , H05K2203/124 , H05K2203/1338 , Y10T428/24273 , Y10T428/24322
摘要： An enhanced substrate for making a printed circuit board (PCB) includes a silane applied to the ends of glass fibers in via holes. In one embodiment, during a plated through-hole (PTH) via fabrication process, glass fiber bundles exposed in a drilled through-hole are selectively sealed. For example, after the through-hole is drilled in a substrate, the substrate may be subjected to an aqueous silane bath (e.g., an organo trialkoxysilane in an aqueous solution of an acid that acts as a catalyst) to deposit a layer of silane on the exposed glass fiber bundle ends. For example, trialkoxy groups of the silane may react with exposed silanols on the glass to form a siloxane, which is further polymerized to form a silane polymer barrier layer on the exposed glass fiber ends. The barrier layer effectively seals the glass fiber bundles and eliminates the conductive anodic filament (CAF) pathway between PTH vias.
摘要翻译：用于制造印刷电路板（PCB）的增强基板包括在通孔中施加到玻璃纤维端部的硅烷。在一个实施例中，在通过制造工艺的电镀通孔（PTH）期间，暴露在钻孔中的玻璃纤维束被选择性地密封。例如，在通孔在衬底中钻孔之后，衬底可以经受水性硅烷浴（例如，作为催化剂的酸的水溶液中的有机三烷氧基硅烷），以沉积一层硅烷暴露的玻璃纤维束结束。例如，硅烷的三烷氧基可以与玻璃上暴露的硅烷醇反应形成硅氧烷，其进一步聚合以在暴露的玻璃纤维端部形成硅烷聚合物阻挡层。阻挡层有效地密封玻璃纤维束并消除PTH通孔之间的导电阳极丝（CAF）通路。

4. 发明授权

US08528203B2 Providing selective via plating using laser resin activation 失效
标题翻译：通过激光树脂激活提供选择性电镀
公开(公告)号：US08528203B2
公开(公告)日：2013-09-10
申请号：US13154821
申请日：2011-06-07
申请人： Gregory E. Balcome , Brett P. Krull , Joseph Kuczynski , Terry G. Ryks , Timothy J. Tofil
发明人： Gregory E. Balcome , Brett P. Krull , Joseph Kuczynski , Terry G. Ryks , Timothy J. Tofil
IPC分类号： H01K3/10
CPC分类号： H05K3/429 , G06F17/5077 , H05K1/0251 , H05K3/4626 , H05K2201/0209 , H05K2203/107 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T156/1057
摘要： An enhanced mechanism for via stub elimination in printed wiring boards (PWBs) and other substrates employs laser resin activation to provide selective via plating. In one embodiment, the resin used in insulator layers of the PWB contains spinel-based non-conductive metal oxide. Preferably, only insulator layers through which vias will pass contain the metal oxide. Those layers are registered and laser irradiated at via formation locations to break down the metal oxide and release metal nuclei. Once these layers are irradiated, all layers of the PWB or subcomposite are laid up and laminated. The resulting composite or subcomposite is subsequently drilled through and subjected to conventional PWB fabrication processes prior to electroless copper plating and subsequent copper electroplating. Because metal nuclei were released only in the via formation locations of the appropriate layers, plating occurs in the via barrels only along those layers and partially plated vias are created without stubs.
摘要翻译：印刷电路板（PWB）和其他基板中通过短截线消除的增强机制采用激光树脂激活来提供选择性通孔电镀。在一个实施方案中，PWB的绝缘体层中使用的树脂含有尖晶石型非导电金属氧化物。优选地，仅通孔所通过的绝缘体层将含有金属氧化物。登记这些层并在通孔形成位置激光照射以分解金属氧化物并释放金属核。一旦这些层被照射，PWB或亚复合材料的所有层被铺设和层压。随后在化学镀铜和随后的铜电镀之前，将所得到的复合材料或副复合材料钻穿并经过常规PWB制造工艺。因为金属核仅在适当层的通孔形成位置中释放，所以仅沿着这些层在通孔桶中进行电镀，并且在没有短截线的情况下产生部分镀覆的通孔。

5. 发明申请

US20130052409A1 PREVENTING CONDUCTIVE ANODIC FILAMENT (CAF) FORMATION BY SEALING DISCONTINUITIES IN GLASS FIBER BUNDLES 有权
标题翻译：通过密封玻璃纤维束中的不连续性防止导电阳极纤维（CAF）形成
公开(公告)号：US20130052409A1
公开(公告)日：2013-02-28
申请号：US13221268
申请日：2011-08-30
申请人： Gregory E. Balcome , Brett P. Krull , Joseph Kuczynski , Terry G. Ryks , Timothy J. Tofil
发明人： Gregory E. Balcome , Brett P. Krull , Joseph Kuczynski , Terry G. Ryks , Timothy J. Tofil
IPC分类号： B32B3/10 , H05K3/28
CPC分类号： B32B3/10 , B32B5/02 , B32B2262/101 , B32B2383/00 , B32B2457/08 , H05K1/0366 , H05K3/0055 , H05K3/28 , H05K3/42 , H05K3/429 , H05K2201/029 , H05K2203/1147 , H05K2203/124 , H05K2203/1338 , Y10T428/24273 , Y10T428/24322
摘要： An enhanced substrate for making a printed circuit board (PCB) includes a silane applied to the ends of glass fibers in via holes. In one embodiment, during a plated through-hole (PTH) via fabrication process, glass fiber bundles exposed in a drilled through-hole are selectively sealed. For example, after the through-hole is drilled in a substrate, the substrate may be subjected to an aqueous silane bath (e.g., an organo trialkoxysilane in an aqueous solution of an acid that acts as a catalyst) to deposit a layer of silane on the exposed glass fiber bundle ends. For example, trialkoxy groups of the silane may react with exposed silanols on the glass to form a siloxane, which is further polymerized to form a silane polymer barrier layer on the exposed glass fiber ends. The barrier layer effectively seals the glass fiber bundles and eliminates the conductive anodic filament (CAF) pathway between PTH vias.
摘要翻译：用于制造印刷电路板（PCB）的增强基板包括在通孔中施加到玻璃纤维端部的硅烷。在一个实施例中，在通过制造工艺的电镀通孔（PTH）期间，暴露在钻孔中的玻璃纤维束被选择性地密封。例如，在通孔在衬底中钻孔之后，衬底可以经受水性硅烷浴（例如，作为催化剂的酸的水溶液中的有机三烷氧基硅烷），以沉积一层硅烷暴露的玻璃纤维束结束。例如，硅烷的三烷氧基可以与玻璃上暴露的硅烷醇反应形成硅氧烷，其进一步聚合以在暴露的玻璃纤维端部形成硅烷聚合物阻挡层。阻挡层有效地密封玻璃纤维束并消除PTH通孔之间的导电阳极丝（CAF）通路。

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