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1. 发明申请

US20070241272A1 Image sensor package structure and method for manufacturing the same 审中-公开
标题翻译：图像传感器封装结构及其制造方法
公开(公告)号：US20070241272A1
公开(公告)日：2007-10-18
申请号：US11404730
申请日：2006-04-14
申请人： Jason Chuang , Mon Ho , Hsiu Tu , Chen Pin Peng , Chung Hsin , Wei Chang
发明人： Jason Chuang , Mon Ho , Hsiu Tu , Chen Pin Peng , Chung Hsin , Wei Chang
IPC分类号： H01J5/02
CPC分类号： H01L27/14618 , H01L27/14683 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： An image sensor package structure includes a substrate, a chip, a plurality of wires, and a frame layer. The substrate has an upper surface, which is formed with first electrodes, and a lower surface, which is formed with second electrodes corresponding to electrically connect to the first electrodes. The chip has a sensor region and a plurality of bonding pads located at the side of the sensor region of the chip, and is mounted on the upper surface of the substrate. The plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate. The frame layer is inserted with a transparent layer, and is arranged on the upper surface of the substrate to cover the chip.
摘要翻译：图像传感器封装结构包括基板，芯片，多根导线和框架层。基板具有形成有第一电极的上表面和形成有与第一电极电连接的第二电极的下表面。芯片具有传感器区域和位于芯片的传感器区域侧的多个接合焊盘，并且安装在基板的上表面上。多个导线将芯片的焊盘电连接到基板的第一电极。框架层插入透明层，并且布置在基板的上表面上以覆盖芯片。

2. 发明申请

US20070108577A1 Image sensor module with a protection layer and a method for manufacturing the same 有权
标题翻译：具有保护层的图像传感器模块及其制造方法
公开(公告)号：US20070108577A1
公开(公告)日：2007-05-17
申请号：US11283596
申请日：2005-11-17
申请人： Hsiu Tu , Chen Peng , Mon Ho , Chung Hsin
发明人： Hsiu Tu , Chen Peng , Mon Ho , Chung Hsin
IPC分类号： H01L23/02
CPC分类号： H01L27/14625 , H01L23/10 , H01L23/3157 , H01L27/14618 , H01L27/14685 , H01L2924/0002 , H01L2924/00
摘要： An image sensor module with a protection layer and a method for manufacturing the same includes a substrate with an upper surface and a lower surface, a chip is mounted on the upper surface of the substrate, a plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate, a adhered layer is coated on the upper surface of the substrate, a lens holder has a lateral wall, a protection layer and internal thread, the lateral wall is adhered on the upper surface of the substrate by the adhered layer to encapsulate the chip, so that the protection layer is located on the sensor region of the chip to prevent adhered layer flowed to the sensor region of the chip; and a lens barrel is formed with external thread screwed on the internal thread of the lens holder.
摘要翻译：具有保护层的图像传感器模块及其制造方法包括具有上表面和下表面的基板，芯片安装在基板的上表面上，多条导线电连接到芯片到基板的第一电极，粘合层涂覆在基板的上表面上，透镜保持器具有侧壁，保护层和内螺纹，侧壁粘附在基板的上表面上通过粘附层封装芯片，使保护层位于芯片的传感器区域上，以防止粘附层流到芯片的传感器区域; 并且透镜筒形成有拧在透镜架的内螺纹上的外螺纹。

3. 发明申请

US20070096280A1 Image sensor module structure and a method for manufacturing the same 审中-公开
标题翻译：图像传感器模块结构及其制造方法
公开(公告)号：US20070096280A1
公开(公告)日：2007-05-03
申请号：US11265068
申请日：2005-11-01
申请人： Hsiu Tu , Chen Peng , Mon Ho , Chung Hsin
发明人： Hsiu Tu , Chen Peng , Mon Ho , Chung Hsin
IPC分类号： H01L23/02
CPC分类号： H01L31/02325 , H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L27/14685 , H01L2224/48091 , H01L2224/48227 , H01L2224/8592 , H01L2924/00014
摘要： An image sensor module structure and method for manufacturing the same includes a substrate having an upper surface and a lower surface, a chip is mounted on the upper surface of the substrate, a plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate, an adhered layer is coated on the upper surface of the substrate, a lens holder has a lateral wall and internal thread, the lateral wall is adhered on the upper surface of the substrate by the adhered layer to encapsulate the chip, so that the adhered layer is pressed to cover the wires, and a lens barrel is formed with external thread screwed on the internal thread of the lens holder.
摘要翻译：图像传感器模块结构及其制造方法包括具有上表面和下表面的基板，芯片安装在基板的上表面上，多根导线将芯片的焊盘电连接到基板的第一电极，在基板的上表面上涂覆粘附层，透镜架具有侧壁和内螺纹，侧壁通过粘附层粘附在基板的上表面上，以封装芯片，使得粘附层被覆以覆盖电线，并且透镜镜筒形成有外螺纹，螺纹固定在透镜保持器的内螺纹上。

4. 发明申请

US20070108544A1 Image sensor with a compound structure 审中-公开
标题翻译：具有复合结构的图像传感器
公开(公告)号：US20070108544A1
公开(公告)日：2007-05-17
申请号：US11282392
申请日：2005-11-17
申请人： Hsiu Tu , Chen Peng , Mon Ho
发明人： Hsiu Tu , Chen Peng , Mon Ho
IPC分类号： H01L31/0203
CPC分类号： H01L27/14618 , H01L24/97 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： An image sensor with a compound layer includes a substrate, a chip, wires, a compound layer, and a transparent layer. The substrate has an upper surface, which is formed with a central region and first electrodes arranged at the each side of the central region, and a lower surface, which is formed with second electrodes. The chip is mounted at the central region of the upper surface of the substrate. The chip has a sensor region and a plurality of bonding pads. The wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate. The compound layer is located on the side of the chip and is covered on the wires. The transparent layer is arranged on the compound layer to cover the chip, so that the sensor region of the chip may be received optical signal through the transparent layer.
摘要翻译：具有复合层的图像传感器包括基板，芯片，布线，复合层和透明层。基板具有上表面，其形成有中心区域和布置在中心区域的每一侧的第一电极以及形成有第二电极的下表面。芯片安装在基板的上表面的中心区域。芯片具有传感器区域和多个接合焊盘。电线将芯片的接合焊盘电连接到衬底的第一电极。复合层位于芯片的一侧，并覆盖在电线上。透明层布置在化合物层上以覆盖芯片，使得芯片的传感器区域可以通过透明层接收光信号。

5. 发明申请

US20080036025A1 Image sensor package 审中-公开
标题翻译：图像传感器封装
公开(公告)号：US20080036025A1
公开(公告)日：2008-02-14
申请号：US11888552
申请日：2007-07-31
申请人： Chung Hsin , Chen Peng , Mon Ho
发明人： Chung Hsin , Chen Peng , Mon Ho
IPC分类号： H01L31/0203
CPC分类号： H01L27/14618 , H01L27/14625 , H01L31/0203 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2924/16195 , H01L2924/00014 , H01L2924/00
摘要： An image sensor package includes a substrate having an upper surface, which is formed with a chip region and first electrodes located on the periphery of the chip region, and a lower surface. A chip is mounted on the chip region of the upper surface of the substrate. A frame layer is arranged on the upper surface of the substrate to surround the chip. Four posts are arranged on the upper surface of the substrate and are located on the angle the frame layer. A plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate. A transparent layer is mounted on the four posts to cover the chip.
摘要翻译：图像传感器封装包括具有上表面的基板，其形成有芯片区域和位于芯片区域周边的第一电极以及下表面。芯片安装在基板的上表面的芯片区域上。框架层布置在基板的上表面上以围绕芯片。在基板的上表面上布置有四个柱，并且位于框架层的角度上。多个导线将芯片的接合焊盘电连接到衬底的第一电极。透明层安装在四个柱上以覆盖芯片。

6. 发明申请

US20070138586A1 Image sensor module package 审中-公开
标题翻译：图像传感器模块包装
公开(公告)号：US20070138586A1
公开(公告)日：2007-06-21
申请号：US11305655
申请日：2005-12-16
申请人： Chung Hsin , Chen Peng , Mon Ho
发明人： Chung Hsin , Chen Peng , Mon Ho
IPC分类号： H01L31/0203
CPC分类号： H01L27/14618 , H01L27/14625 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2924/00014 , H01L2924/00
摘要： An image sensor module package includes a substrate having an upper surface, which is formed with a chip region and first electrodes located on the periphery of the chip region, and a lower surface. A chip is mounted on the chip region of the upper surface of the substrate. A frame layer is arranged on the upper surface of the substrate to surround the chip. Four posts are arranged on the upper surface of the substrate and are located on the angle the frame layer. A plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate. A transparent layer is mounted on the four posts to cover the chip. A lens holder is mounted on the frame layer, and is formed with an internal thread. And a lens barrel is formed with an external thread screwed on the internal thread of the lens holder.
摘要翻译：图像传感器模块封装包括具有上表面的基板，其形成有芯片区域和位于芯片区域周边的第一电极以及下表面。芯片安装在基板的上表面的芯片区域上。框架层布置在基板的上表面上以围绕芯片。在基板的上表面上布置有四个柱，并且位于框架层的角度上。多个导线将芯片的接合焊盘电连接到衬底的第一电极。透明层安装在四个柱上以覆盖芯片。透镜支架安装在框架层上，并且形成有内螺纹。并且镜筒形成有螺纹拧在透镜架的内螺纹上的外螺纹。

7. 发明申请

US20070138585A1 Image sensor package 审中-公开
标题翻译：图像传感器封装
公开(公告)号：US20070138585A1
公开(公告)日：2007-06-21
申请号：US11305654
申请日：2005-12-16
申请人： Chung Hsin , Chen Peng , Mon Ho
发明人： Chung Hsin , Chen Peng , Mon Ho
IPC分类号： H01L31/0203
CPC分类号： H01L27/14618 , H01L27/14625 , H01L2924/0002 , H01L2924/00
摘要： An image sensor package includes a substrate having an upper surface, which is formed with a chip region and first electrodes located on the periphery of the chip region, and a lower surface. A chip is mounted on the chip region of the upper surface of the substrate. A frame layer is arranged on the upper surface of the substrate to surround the chip. Four posts are arranged on the upper surface of the substrate and are located on the angle the frame layer. A plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate. A transparent layer is mounted on the four posts to cover the chip.
摘要翻译：图像传感器封装包括具有上表面的基板，其形成有芯片区域和位于芯片区域周边的第一电极以及下表面。芯片安装在基板的上表面的芯片区域上。框架层布置在基板的上表面上以围绕芯片。在基板的上表面上布置有四个柱，并且位于框架层的角度上。多个导线将芯片的接合焊盘电连接到衬底的第一电极。透明层安装在四个柱上以覆盖芯片。

8. 发明申请

US20070090284A1 Image sensor package structure 审中-公开
标题翻译：图像传感器封装结构
公开(公告)号：US20070090284A1
公开(公告)日：2007-04-26
申请号：US11256366
申请日：2005-10-20
申请人： Mon Ho , Chen Peng , May Chen , Eric Lin
发明人： Mon Ho , Chen Peng , May Chen , Eric Lin
IPC分类号： H01J5/02
CPC分类号： H01L27/14618 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2924/16195 , H01L2924/00014 , H01L2924/00
摘要： An image sensor package structure includes a substrate having an upper surface, which is formed with equal amount of the first electrodes arranged at the each side of the upper surface, each the first electrode of the adjacent side of the substrate is corresponding electrically connected each other, so that the signal from one side of the substrate may be transmitted the adjacent side, the each side of the lower surface of the substrate is formed with second electrodes, each side of the second electrodes is less than the each side of the first electrodes of the upper surface, then the second electrode is electrically connected to the first electrode, so that the signal from the first electrode may be directly transmitted to the second electrode and through adjacent one side of the first electrode transmitted to the second electrode. A frame layer is arranged at the upper surface of the substrate. A chip is mounted at the upper surface of the substrate a, at least one side of the chip is formed with bonding pads, which are equal or not many than the first electrodes of the one side of the substrate. Wires are electrically connected the pads of the chip to the first electrodes of the substrate. A transparent layer is covered on the frame layer to encapsulate the chip.
摘要翻译：图像传感器封装结构包括具有上表面的基板，其形成有布置在上表面的每一侧的等量的第一电极，基板的相邻侧的每个第一电极彼此相互电连接，使得来自基板的一侧的信号可以相邻地传输，基板的下表面的每一侧形成有第二电极，第二电极的每侧都小于第一电极的每一侧然后第二电极电连接到第一电极，使得来自第一电极的信号可以直接传输到第二电极并且通过传输到第二电极的第一电极的相邻一侧。框架层布置在基板的上表面。芯片安装在基板a的上表面，芯片的至少一侧形成有与基板一侧的第一电极相等或不多的接合焊盘。电线将芯片的焊盘电连接到衬底的第一电极。透明层被覆盖在帧层上以封装芯片。

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