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    • 8. 发明公开
    • SUBSTRATE PROCESSING METHOD FOR SUPPORTING A CATALYST PARTICLE FOR PLATING PROCESS
    • ÜEN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN
    • EP2902529A1
    • 2015-08-05
    • EP13842687.9
    • 2013-09-27
    • Tanaka Kikinzoku Kogyo K.K.A School Corporation Kansai University
    • NAKAMURA, NoriakiTANIUCHI, JunichiKUBO, HitoshiOHSHIMA, YuusukeISHIKAWA, TomokoSHINGUBARA, ShosoINOUE, Fumihiro
    • C23C18/18
    • The present invention provides a method for treating a substrate that supports metal fine particles for forming a plating layer on a circuit pattern or TSVs in various substrates, in which further micronization treatment is enabled compared with the conventional methods, and the formation of a stable plating layer is enabled. The present invention is a method for treating a substrate, the method including bringing a substrate into contact with a colloidal solution containing metal particles in order to support the metal particles that serve as a catalyst for forming a plating layer on the substrate, in which the colloidal solution contains metal particles formed of Pd and having a particle size of 0.6 nm to 4.0 nm and a face-to-face dimension of the (111) plane of 2.254 Å or more. When an organic layer such as SAM is formed on a surface of the substrate before this treatment, the binding force of the Pd particles can be increased.
    • 本发明提供了一种处理基板的方法,该基板用于在各种基板上的电路图形或TSV上支撑用于形成镀层的金属微粒,与常规方法相比,可进行进一步的微粉化处理,并形成稳定的电镀 层被启用。 本发明是一种处理基板的方法,该方法包括使基板与含有金属颗粒的胶体溶液接触,以便支撑用作在基板上形成镀层的催化剂的金属颗粒,其中 胶体溶液含有由Pd形成的并且具有0.6nm至4.0nm的粒径和(111)面的面对面尺寸为2.254或更大的金属颗粒。 当在该处理之前在基板的表面上形成诸如SAM的有机层时,可以增加Pd颗粒的结合力。