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    • 8. 发明授权
    • Ovenized crystal oscillator assembly
    • 炉式晶体振荡器组件
    • US08294526B2
    • 2012-10-23
    • US12571774
    • 2009-10-01
    • James L. Stolpman
    • James L. Stolpman
    • H03L1/04
    • H03L1/04
    • An oscillator assembly includes a substrate having a top surface, a bottom surface, and a plurality of side surfaces. At least one of the side surfaces has at least one castellation which is covered with conductive material and includes a lower end spaced from the bottom surface of the substrate. The space is defined by an elongate groove in the side surface which is devoid of conductive material and extends between the lower end of the castellation and the bottom surface of the substrate to eliminate the risk of a short circuit with any of the connection pads on a customer's motherboard. The oscillator assembly further incorporates an oscillator circuit in which a current limiting resistor is located in series between the power supply and the heater control circuit.
    • 振荡器组件包括具有顶表面,底表面和多个侧表面的基底。 侧表面中的至少一个具有至少一个被导电材料覆盖的城堡,并且包括与基底的底表面间隔开的下端。 该空间由侧表面中的细长凹槽限定,其不具有导电材料,并且在该基座的下端与基底的底表面之间延伸,以消除与一个连接垫上的任何连接垫短路的风险 客户主板。 振荡器组件还包括振荡器电路,其中限流电阻串联在电源和加热器控制电路之间。
    • 9. 发明授权
    • Ovenized crystal oscillator assembly
    • 炉式晶体振荡器组件
    • US08022777B2
    • 2011-09-20
    • US12380313
    • 2009-02-26
    • James L. StolpmanJeffrey A. McCracken
    • James L. StolpmanJeffrey A. McCracken
    • H03L1/04
    • H03L1/04H05K1/0212H05K1/0243H05K1/181H05K3/403H05K2201/09181H05K2201/10022H05K2201/10075H05K2201/10151H05K2203/165
    • An oscillator assembly including an oscillator seated on a pad of thermally conductive material formed on the surface of a printed circuit board and covered by a lid defining an oven for the oscillator. In one embodiment, a plurality of heaters are located on different sides of the oscillator and at least partially seated on the pad for evenly transferring heat to the pad and the oscillator. In one embodiment, the oscillator is a temperature compensated crystal oscillator and an integrated amplifier controller circuit on the printed circuit board integrates at least one operational amplifier for controlling the heater(s) and one or more transistors for providing heat to the oven. A canopy seated on the pad and covering the oscillator can be used for transferring heat more evenly to the oscillator. A cavity in the bottom of the printed circuit board defines an insulative air pocket.
    • 一种振荡器组件,包括位于印刷电路板的表面上形成并由限定用于振荡器的烘箱的盖子覆盖的导热材料垫上的振荡器。 在一个实施例中,多个加热器位于振荡器的不同侧,并且至少部分地位于该垫上,以将热量均匀地传递到该垫和该振荡器。 在一个实施例中,振荡器是温度补偿晶体振荡器,并且印刷电路板上的集成放大器控制器电路集成了至少一个用于控制加热器的运算放大器和用于向烘箱提供热量的一个或多个晶体管。 位于垫上并覆盖振荡器的顶盖可用于将热量更均匀地传递到振荡器。 印刷电路板底部的空腔限定了绝缘气囊。
    • 10. 发明申请
    • Ovenized Crystal Oscillator Assembly
    • 水晶振荡器组装
    • US20100085124A1
    • 2010-04-08
    • US12571774
    • 2009-10-01
    • James L. Stolpman
    • James L. Stolpman
    • H03L1/04H05K7/02
    • H03L1/04
    • An oscillator assembly includes a substrate having a top surface, a bottom surface, and a plurality of side surfaces. At least one of the side surfaces has at least one castellation which is covered with conductive material and includes a lower end spaced from the bottom surface of the substrate. The space is defined by an elongate groove in the side surface which is devoid of conductive material and extends between the lower end of the castellation and the bottom surface of the substrate to eliminate the risk of a short circuit with any of the connection pads on a customers motherboard. The oscillator assembly further incorporates an oscillator circuit in which a current limiting resistor is located in series between the power supply and the heater control circuit.
    • 振荡器组件包括具有顶表面,底表面和多个侧表面的基底。 侧表面中的至少一个具有至少一个被导电材料覆盖的城堡,并且包括与基底的底表面间隔开的下端。 该空间由侧表面中的细长凹槽限定,其不具有导电材料,并且在该基座的下端与基底的底表面之间延伸,以消除与一个连接垫上的任何连接垫短路的风险 客户主板。 振荡器组件还包括振荡器电路,其中限流电阻串联在电源和加热器控制电路之间。