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    • 3. 发明授权
    • Pluggable optical transceiver module having a high speed serial data connector (HSSDC)
    • 具有高速串行数据连接器(HSSDC)的可插拔光收发模块
    • US06350063B1
    • 2002-02-26
    • US09458846
    • 1999-12-13
    • Patrick B. GillilandCarlos Jines
    • Patrick B. GillilandCarlos Jines
    • G02B636
    • G02B6/4201G02B6/4246G02B6/4261G02B6/4263G02B6/428G02B6/4283G02B6/4284G02B6/4292
    • A pluggable optical transceiver module includes two optoelectronic devices mounted to a printed circuit board, and a High Speed Serial Data Connector connected to the printed circuit board. The printed circuit board, and associated optoelectronic devices and the High Speed Serial Data Connector being mounted in a housing. One of the two optoelectronic devices is a transmitter. The other of the two optoelectronic devices is a receiver. The pluggable optical transceiver module converts optical signal to electrical signals, and, also, converts electrical signals to optical signals. The High Speed Serial Data Connector is pluggable into a High Speed Serial Data Connector receptacle of a host device. Another portion of the module may have ports for receiving LC style fiber optic connectors.
    • 可插拔光收发器模块包括安装到印刷电路板的两个光电装置和连接到印刷电路板的高速串行数据连接器。 印刷电路板和相关联的光电子器件和高速串行数据连接器安装在外壳中。 两个光电器件中的一个是发射器。 两个光电器件中的另一个是接收器。 可插拔光收发器模块将光信号转换为电信号,并将电信号转换为光信号。 高速串行数据连接器可插拔到主机设备的高速串行数据连接器插座中。 模块的另一部分可以具有用于接收LC型光纤连接器的端口。
    • 4. 发明授权
    • Small format optical subassembly
    • 小格式光学组件
    • US06556608B1
    • 2003-04-29
    • US09826480
    • 2001-04-05
    • Patrick B. GillilandCarlos JinesRobert M. Dwarkin
    • Patrick B. GillilandCarlos JinesRobert M. Dwarkin
    • H01S319
    • H01S5/02248H01L2224/48091H01S5/02292H01S5/0683H01L2924/00014
    • A small format optoelectronic package or device includes a non-electrically conductive substrate partially covered by an electrically conductive can. The electrically conductive can has a transparent element affixed to an aperture of the electrically conductive can. The electrically conductive can encloses and hermetically seals an edge emitting optical diode, a reflecting mirror, a monitor diode, and conductors between the electrically conductive can and the non-electrically conductive substrate. The non-electrically conductive substrate has three through-holes formed through a thickness of the non-electrically conductive substrate. The three through-holes are filled with an electrically conductive material so as to form three electrically conductive vias. Additionally, a surface of the non-electrically conductive substrate is organized into three regions. The first and third regions have the electrically conductive plating material applied thereto.
    • 小格式的光电封装或器件包括由导电罐部分地覆盖的非导电衬底。 导电罐具有固定到导电罐的孔的透明元件。 导电罐可封闭并密封边缘发射光二极管,反射镜,监视二极管和导电罐与非导电基板之间的导体。 非导电基板具有通过非导电基板的厚度形成的三个通孔。 三个通孔填充有导电材料,以形成三个导电通孔。 此外,非导电基板的表面被组织成三个区域。 第一和第三区域具有施加到其上的导电电镀材料。
    • 5. 发明授权
    • Small format optical subassembly
    • 小格式光学组件
    • US06331992B1
    • 2001-12-18
    • US09545087
    • 2000-04-07
    • Patrick B. GillilandCarlos JinesTheodore Washburn
    • Patrick B. GillilandCarlos JinesTheodore Washburn
    • H01S319
    • H01S5/02248H01L2224/48091H01S5/02208H01L2924/00014
    • A small format optoelectronic package or device includes a non-electrically conductive substrate partially covered by an electrically conductive can. The electrically conductive can has a transparent element affixed to an aperture of the electrically conductive can. The electrically conductive can encloses and hermetically seals an optical diode, a monitor diode, and conductors between the electrically conductive can and the non-electrically conductive substrate. The non-electrically conductive substrate has three through-holes formed through a thickness of the non-electrically conductive substrate. The three through-holes are filled with an electrically conductive material so as to form three electrically conductive vias. Additionally, a surface of the non-electrically conductive substrate is organized into three regions. The first and third regions have the electrically conductive plating material applied thereto. The first through-hole protrudes through the first region. The second and third through-holes protrude through the second region. The first via is electrically connected to the electrically conductive plating material adhered to the first region. The optical diode and the monitor diode both have leads which are mounted on the electrically conductive plating of the first region. A first conductor electrically connects another lead of the optical diode to the second via, and a second conductor electrically connects another lead of the monitor diode to the third via.
    • 小格式的光电封装或器件包括由导电罐部分地覆盖的非导电衬底。 导电罐具有固定到导电罐的孔的透明元件。 导电罐可封闭并密封光二极管,监视二极管和导电罐与非导电基板之间的导体。 非导电基板具有通过非导电基板的厚度形成的三个通孔。 三个通孔填充有导电材料,以形成三个导电通孔。 此外,非导电基板的表面被组织成三个区域。 第一和第三区域具有施加到其上的导电电镀材料。 第一通孔突出穿过第一区域。 第二和第三通孔突出穿过第二区域。 第一通孔电连接到粘附到第一区域的导电电镀材料。 光二极管和监视二极管都具有安装在第一区域的导电电镀上的引线。 第一导体将光二极管的另一引线电连接到第二通孔,并且第二导体将监视二极管的另一引线电连接到第三通孔。
    • 7. 发明授权
    • Dual channel device having two optical sub-assemblies
    • 具有两个光学子组件的双通道器件
    • US06530699B1
    • 2003-03-11
    • US09938135
    • 2001-08-22
    • Patrick B. GillilandCarlos Jines
    • Patrick B. GillilandCarlos Jines
    • G02B642
    • G02B6/4249G02B6/4246G02B6/4257G02B6/4261G02B6/428
    • An optoelectronic device includes two optical subassemblies mounted on an edge of a substrate. Electronic circuitry is mounted on the substrate. The two optical packages are electrically connected to the electrical circuitry. An optical coupling element is attached to one of the optical packages and another optical coupling element is attached to the other optical package. A rib is attached to the substrate and to one of the optical coupling elements so as to provide support for the optical coupling element, and another rib is attached to the substrate and to the other optical coupling element. Each optical coupling element has a respective ferrule receiving bore. The ferrule receiving bores are parallel to one another. A connection pin header is electrically connected to the electronic circuitry on the substrate. The connection pin header includes connection pins.
    • 光电子器件包括安装在衬底边缘上的两个光学子组件。 电子电路安装在基板上。 两个光学封装电连接到电路。 光学耦合元件附接到光学封装中的一个,另一个光学耦合元件连接到另一个光学封装。 肋连接到基底和光耦合元件中的一个,以便为光耦合元件提供支撑,另一个肋连接到基片和另一个光耦合元件。 每个光耦合元件具有相应的套圈容纳孔。 套圈接收孔彼此平行。 连接引脚头电连接到基板上的电子电路。 连接引脚包括连接引脚。