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1. 发明授权

US07459784B2 High capacity thin module system 有权
公开(公告)号：US07459784B2
公开(公告)日：2008-12-02
申请号：US11961477
申请日：2007-12-20
申请人： James Douglas Wehrly, Jr. , James Wilder , Paul Goodwin , Mark Wolfe
发明人： James Douglas Wehrly, Jr. , James Wilder , Paul Goodwin , Mark Wolfe
IPC分类号： H01L23/34 , H01L21/00 , H05K7/20
CPC分类号： H05K1/189 , H05K1/0203 , H05K1/11 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572
摘要： Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

2. 发明授权

US07443023B2 High capacity thin module system 有权
标题翻译：大容量薄模块系统
公开(公告)号：US07443023B2
公开(公告)日：2008-10-28
申请号：US11231418
申请日：2005-09-21
申请人： James Douglas Wehrly, Jr. , James Wilder , Paul Goodwin , Mark Wolfe
发明人： James Douglas Wehrly, Jr. , James Wilder , Paul Goodwin , Mark Wolfe
IPC分类号： H01L23/34 , H01L21/00 , H05K7/20
CPC分类号： H05K1/189 , H05K1/0203 , H05K1/11 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572
摘要： Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.
摘要翻译：灵活的电路填充有沿其主要侧面或其两侧设置的集成电路。沿柔性电路分布的触点提供模块与应用环境之间的连接。电路填充的柔性电路围绕刚性衬底的边缘设置，从而将集成电路放置在衬底的一侧或两侧，在衬底的一侧或两侧上具有一层或两层集成电路。衬底形式优选地由导热材料设计，并且当柔性电路绕在衬底上时，包括设置在较高热能器件（例如AMB）附近的高导热性芯或区域。其他变型包括将模块的相对侧上的相应IC夹持的导热夹子，以进一步从IC分流热量。来自衬底主体或衬底芯的优选延伸部件促进模块集成电路之间的热变化减小。

3. 发明申请

US20090046431A1 High Capacity Thin Module System 有权
标题翻译：大容量薄模块系统
公开(公告)号：US20090046431A1
公开(公告)日：2009-02-19
申请号：US12258189
申请日：2008-10-24
申请人： James Douglas Wehrly, Jr. , James Wilder , Paul Goodwin , Mark Wolfe
发明人： James Douglas Wehrly, Jr. , James Wilder , Paul Goodwin , Mark Wolfe
IPC分类号： H05K7/20
CPC分类号： H05K1/189 , H05K1/0203 , H05K1/11 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572
摘要： Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.
摘要翻译：灵活的电路填充有沿其主要侧面或其两侧设置的集成电路。沿柔性电路分布的触点提供模块与应用环境之间的连接。电路填充的柔性电路围绕刚性衬底的边缘设置，从而将集成电路放置在衬底的一侧或两侧，在衬底的一侧或两侧上具有一层或两层集成电路。衬底形式优选地由导热材料设计，并且当柔性电路绕在衬底上时，包括设置在较高热能器件（例如AMB）附近的高导热性芯或区域。其他变型包括将模块的相对侧上的相应IC夹持的导热夹子，以进一步从IC分流热量。来自衬底主体或衬底芯的优选延伸部件促进模块集成电路之间的热变化减小。

4. 发明授权

US07737549B2 Circuit module with thermal casing systems 失效
标题翻译：具有热套管系统的电路模块
公开(公告)号：US07737549B2
公开(公告)日：2010-06-15
申请号：US12263060
申请日：2008-10-31
申请人： James Douglas Wehrly, Jr. , James Wilder , Mark Wolfe , Paul Goodwin
发明人： James Douglas Wehrly, Jr. , James Wilder , Mark Wolfe , Paul Goodwin
IPC分类号： H01L23/34 , H05K7/20 , H01L21/00
CPC分类号： H05K1/189 , H05K1/0203 , H05K1/11 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572
摘要： Flexible circuitry is populated with integrated circuitry (ICs), and contacts are distributed along the flexible circuitry to provide connection to an application environment. The flexible circuitry is disposed about a rigid substrate, placing the ICs on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate is preferably devised from thermally-conductive materials and one or more thermal spreaders are in thermal contact with at least some of the ICs. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.
摘要翻译：灵活的电路采用集成电路（IC），并且触点沿柔性电路分布，以提供与应用环境的连接。柔性电路围绕刚性衬底设置，将IC放置在衬底的一侧或两侧上，在衬底的一侧或两侧上具有一层或多层集成电路。衬底优选地由导热材料设计，并且一个或多个热扩散器与至少一些IC热接触。可选地，作为附加的热管理特征，模块可以包括设置在较高热能IC器件附近的高导热性散热器或区域。在优选实施例中，来自衬底主体或衬底芯的延伸部促进模块的IC之间的热变化减小，同时提供用于从模块中排出热能的放大表面。

5. 发明授权

US07626259B2 Heat sink for a high capacity thin module system 有权
标题翻译：散热器用于高容量薄模块系统
公开(公告)号：US07626259B2
公开(公告)日：2009-12-01
申请号：US12258189
申请日：2008-10-24
申请人： James Douglas Wehrly, Jr. , James Wilder , Paul Goodwin , Mark Wolfe
发明人： James Douglas Wehrly, Jr. , James Wilder , Paul Goodwin , Mark Wolfe
IPC分类号： H01L23/34 , H01L21/00 , H05K7/20
CPC分类号： H05K1/189 , H05K1/0203 , H05K1/11 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572
摘要： Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.
摘要翻译：灵活的电路填充有沿其主要侧面或其两侧设置的集成电路。沿柔性电路分布的触点提供模块与应用环境之间的连接。电路填充的柔性电路围绕刚性衬底的边缘设置，从而将集成电路放置在衬底的一侧或两侧，在衬底的一侧或两侧上具有一层或两层集成电路。衬底形式优选地由导热材料设计，并且当柔性电路绕在衬底上时，包括设置在较高热能器件（例如AMB）附近的高导热性芯或区域。其他变型包括将模块的相对侧上的相应IC夹持的导热夹子，以进一步从IC分流热量。来自衬底主体或衬底芯的优选延伸部件促进模块集成电路之间的热变化减小。

6. 发明授权

US07446410B2 Circuit module with thermal casing systems 有权
标题翻译：具有热套管系统的电路模块
公开(公告)号：US07446410B2
公开(公告)日：2008-11-04
申请号：US11283355
申请日：2005-11-18
申请人： James Douglas Wehrly, Jr. , James Wilder , Mark Wolfe , Paul Goodwin
发明人： James Douglas Wehrly, Jr. , James Wilder , Mark Wolfe , Paul Goodwin
IPC分类号： H01L23/34 , H01L21/00 , H05K7/20
CPC分类号： H05K1/189 , H05K1/0203 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572
摘要： Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. The populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally-conductive materials and one or more thermal spreaders are disposed in thermal contact with at least some of the constituent integrated circuitry of the module. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.
摘要翻译：灵活的电路装有沿主要侧面或两侧设置的集成电路（IC）。触点沿柔性电路分布，以提供模块与应用环境之间的连接。填充的柔性电路围绕刚性衬底的边缘设置，从而将集成电路放置在衬底的一侧或两侧上，在衬底的一侧或两侧上具有一层或多层集成电路。衬底形式优选地由导热材料设计，并且一个或多个热扩散器设置成与模块的组成集成电路中的至少一些热接触。可选地，作为附加的热管理特征，模块可以包括设置在较高热能IC器件附近的高导热性散热器或区域。在优选实施例中，来自衬底主体或衬底芯的延伸部促进模块的IC之间的热变化减小，同时提供用于从模块中排出热能的扩大表面。

7. 发明申请

US20090052124A1 Circuit Module with Thermal Casing Systems 失效
标题翻译：具有热套管系统的电路模块
公开(公告)号：US20090052124A1
公开(公告)日：2009-02-26
申请号：US12263060
申请日：2008-10-31
申请人： James Douglas Wehrly, JR. , James Wilder , Mark Wolfe , Paul Goodwin
发明人： James Douglas Wehrly, JR. , James Wilder , Mark Wolfe , Paul Goodwin
IPC分类号： H05K7/20
CPC分类号： H05K1/189 , H05K1/0203 , H05K1/11 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572
摘要： Flexible circuitry is populated with integrated circuitry (ICs), and contacts are distributed along the flexible circuitry to provide connection to an application environment. The flexible circuitry is disposed about a rigid substrate, placing the ICs on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate is preferably devised from thermally-conductive materials and one or more thermal spreaders are in thermal contact with at least some of the ICs. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.
摘要翻译：灵活的电路采用集成电路（IC），并且触点沿柔性电路分布，以提供与应用环境的连接。柔性电路围绕刚性衬底设置，将IC放置在衬底的一侧或两侧上，在衬底的一侧或两侧上具有一层或多层集成电路。衬底优选地由导热材料设计，并且一个或多个热扩散器与至少一些IC热接触。可选地，作为附加的热管理特征，模块可以包括设置在较高热能IC器件附近的高导热性散热器或区域。在优选实施例中，来自衬底主体或衬底芯的延伸部促进模块的IC之间的热变化减小，同时提供用于从模块中排出热能的放大表面。

8. 发明授权

US07542297B2 Optimized mounting area circuit module system and method 有权
标题翻译：优化安装区电路模块系统及方法
公开(公告)号：US07542297B2
公开(公告)日：2009-06-02
申请号：US11255061
申请日：2005-10-19
申请人： James Douglas Wehrly, Jr. , Mark Wolfe , Paul Goodwin
发明人： James Douglas Wehrly, Jr. , Mark Wolfe , Paul Goodwin
IPC分类号： H05K1/00
CPC分类号： H05K1/189 , H01L25/0652 , H01L25/105 , H01L2924/0002 , H05K1/0203 , H05K1/118 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572 , H01L2924/00
摘要： A flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of its major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. A rigid substrate is configured to provide space on one side where the populated flex is disposed while in some embodiments, heat management or cooling structures are arranged on one side of the module to mitigate thermal accumulation in the module.
摘要翻译：灵活的电路填充有沿其主要一侧或两侧设置的集成电路（IC）。触点沿柔性电路分布，以提供模块与应用环境之间的连接。刚性基板被配置为在其上布置有人造弹性体的一侧上提供空间，而在一些实施例中，热管理或冷却结构布置在模块的一侧以减轻模块中的热积聚。

9. 发明申请

US20060091529A1 High capacity thin module system and method 有权
标题翻译：大容量薄模块系统及方法
公开(公告)号：US20060091529A1
公开(公告)日：2006-05-04
申请号：US11231418
申请日：2005-09-21
申请人： James Wehrly , James Wilder , Paul Goodwin , Mark Wolfe
发明人： James Wehrly , James Wilder , Paul Goodwin , Mark Wolfe
IPC分类号： H01L23/34
CPC分类号： H05K1/189 , H05K1/0203 , H05K1/11 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572
摘要： Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.
摘要翻译：灵活的电路填充有沿其主要侧面或其两侧设置的集成电路。沿柔性电路分布的触点提供模块与应用环境之间的连接。电路填充的柔性电路围绕刚性衬底的边缘设置，从而将集成电路放置在衬底的一侧或两侧，在衬底的一侧或两侧上具有一层或两层集成电路。衬底形式优选地由导热材料设计，并且当柔性电路绕在衬底上时，包括设置在较高热能器件（例如AMB）附近的高导热性芯或区域。其他变型包括将模块的相对侧上的相应IC夹持的导热夹子，以进一步从IC分流热量。来自衬底主体或衬底芯的优选延伸部件促进模块集成电路之间的热变化减小。

10. 发明申请

US20080094803A1 High Capacity Thin Module System and Method 有权
标题翻译：高容量薄模块系统和方法
公开(公告)号：US20080094803A1
公开(公告)日：2008-04-24
申请号：US11961477
申请日：2007-12-20
申请人： James Wehrly , James Wilder , Paul Goodwin , Mark Wolfe
发明人： James Wehrly , James Wilder , Paul Goodwin , Mark Wolfe
IPC分类号： H05K7/20
CPC分类号： H05K1/189 , H05K1/0203 , H05K1/11 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572
摘要： Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.
摘要翻译：灵活的电路填充有沿其主要侧面或其两侧设置的集成电路。沿柔性电路分布的触点提供模块与应用环境之间的连接。电路填充的柔性电路围绕刚性衬底的边缘设置，从而将集成电路放置在衬底的一侧或两侧，在衬底的一侧或两侧上具有一层或两层集成电路。衬底形式优选地由导热材料设计，并且当柔性电路绕在衬底上时，包括设置在较高热能器件（例如AMB）附近的高导热性芯或区域。其他变型包括将模块的相对侧上的相应IC夹持的导热夹子，以进一步从IC分流热量。来自衬底主体或衬底芯的优选延伸部件促进模块集成电路之间的热变化减小。

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